Work function metal patterning and middle-of-line self-aligned contacts for nanosheet technology
A semiconductor device fabrication method is provided and includes forming first and second stacks each including a dual layer top dielectric cap (TDC), sequentially surrounding each layer and a portion of the dual layer TDC of the first stack with high-k dielectric, a first work function metal (WFM) and a second WFM, sequentially surrounding each layer and a portion of the dual layer TDC of the second stack with the high-k dielectric and the second WFM, forming gate metal around the first and second stacks and recessing the gate metal and the second WFM to a depth defined above a height of an uppermost first WFM horizontal portion.
1 . A semiconductor device fabrication method, comprising:
forming first and second stacks each comprising a dual layer top dielectric cap (TDC);
sequentially surrounding each layer and a portion of the dual layer TDC of the first stack with high-k dielectric, a first work function metal (WFM) and a second WFM;
sequentially surrounding each layer and a portion of the dual layer TDC of the second stack with the high-k dielectric and the second WFM;
forming gate metal around the first and second stacks; and
recessing the gate metal and the second WFM to a depth defined above a height of an uppermost first WFM horizontal portion.
2 . The semiconductor device fabrication method according to claim 1 , further comprising:
depositing a self-aligned cap (SAC) over the gate metal;
depositing interlayer dielectric (ILD) over the SAC; and
executing a gate cut through the ILD and the SAC to the work function metal between the first and second stacks to form a contact opening.
3 . The semiconductor device fabrication method according to claim 2 , further comprising forming a gate contact in the contact opening.
4 . The semiconductor device fabrication method according to claim 3 , wherein a height of the gate contact is a fraction of a height of an uppermost surface of the ILD from the substrate.
5 . The semiconductor device fabrication method according to claim 1 , wherein the recessing comprises recessing the gate metal and the second WFM to a range of depths defined above the height of the uppermost first WFM horizontal portion.
6 . The semiconductor device fabrication method according to claim 1 , wherein the recessing comprises recessing the gate metal and the second WFM to a depth defined above the height of the uppermost first WFM horizontal portion.
7 . A semiconductor device fabrication method, comprising:
forming, on a substrate, first and second stacks each comprising lowermost and first and second uppermost first layers, interleaved second and third layers between the lowermost and second uppermost first layers and a fourth layer between the first and second uppermost first layers;
replacing the lowermost and first and second uppermost first layers with dielectric;
removing the second and fourth layers;
sequentially depositing high-k dielectric and a first work function metal (WFM) around the dielectric and the third layers;
depositing a second WFM around the first WFM in the first stack and replacing the first WFM with the second WFM in the second stack;
forming gate metal around the first and second stacks; and
recessing the gate metal and the second WFM to a depth defined above a height of an uppermost first WFM horizontal portion.
8 . The semiconductor device fabrication method according to claim 7 , wherein:
the first and second stacks are formed on an uppermost surface of the substrate,
the substrate comprises silicon and shallow trench isolation (STI) between the first and second stacks,
the lowermost and first and second uppermost first layers comprise silicon germanium 55,
the second and fourth layers comprise silicon germanium 30, and
the third layers comprise silicon.
9 . The semiconductor device fabrication method according to claim 7 , further comprising:
depositing a self-aligned cap (SAC) over the gate metal;
depositing interlayer dielectric (ILD) over the SAC;
executing a gate cut through the ILD and the SAC to the work function metal between the first and second stacks to form a contact opening; and
forming a gate contact in the contact opening.
10 . The semiconductor device fabrication method according to claim 9 , wherein a height of the gate contact is a fraction of a height of an uppermost surface of the ILD from the substrate.
11 . The semiconductor device fabrication method according to claim 7 , wherein the replacing of the first and second uppermost first layers with the dielectric and the depositing of the high-k dielectric around the dielectric forms a top dielectric cap (TDC) that provides a process margin for the recessing.
12 . The semiconductor device fabrication method according to claim 11 , wherein the TDC is a two-layer TDC.
13 . The semiconductor device fabrication method according to claim 7 , wherein the depositing of the first WFM does not fill space between the high-k dielectric.
14 . The semiconductor device fabrication method according to claim 7 , wherein the recessing comprises etching.
15 . The semiconductor device fabrication method according to claim 7 , wherein the recessing comprises recessing the gate metal and the second WFM to a range of depths defined above the height of the uppermost first WFM horizontal portion.
16 . The semiconductor device fabrication method according to claim 7 , wherein the recessing comprises recessing the gate metal and the second WFM to a depth defined above the height of the uppermost first WFM horizontal portion.
17 . A semiconductor device, comprising:
first and second gate stacks, the first gate stack comprising multiple layers, a first dual layer top dielectric cap (TDC) and high-k dielectric, a first work function metal (WFM) and a second WFM sequentially surrounding each layer and a portion of the dual layer TDC and the second gate stack comprising multiple layers, a second dual layer top dielectric cap (TDC) and high-k dielectric and the second WFM sequentially surrounding each layer and a portion of the dual layer TDC; and
gate metal formed around the first and second gate stacks,
the gate metal and the second WFM being recessed to a depth defined above a height of an uppermost first WFM horizontal portion.
18 . The semiconductor device according to claim 17 , further comprising:
a self-aligned cap (SAC) over the gate metal;
interlayer dielectric (ILD) over the SAC; and
a gate contact extending through the ILD and the SAC to the work function metal between the first and second stacks.
19 . The semiconductor device according to claim 17 , wherein the gate metal and the second WFM are recessed to a range of depths defined above the height of the uppermost first WFM horizontal portion.
20 . The semiconductor device according to claim 17 , wherein the gate metal and the second WFM are recessed to a depth defined above the height of the uppermost first WFM horizontal portion.