Multilayer electronic component
A multilayer electronic component, in which the first external electrode may include the 1-1-th electrode layer disposed on the third surface, and the 1-2-th electrode layer disposed on the first and second surfaces, and the second external electrode may include the 2-1-th electrode layer disposed on the fourth surface and the 2-2-th electrode layer disposed on the first and second surfaces, wherein the 1-2-th electrode layer and the 2-2-th electrode layer include Cu and a first additive element having a content lower than a content of the Cu, the contents of the first additive element included in the 1-2-th electrode layer and the 2-2-th electrode layer are greater than the contents of the first additive element included in the 1-1-th electrode layer and the 2-1-th electrode layer, respectively, and the first additive element is at least one selected from Ag and Al, thereby preventing cracks and improving moisture resistance reliability.
1 . A multilayer electronic component comprising:
a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, and having a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface connected to the first and second surfaces and opposing each other in a second direction, and a fifth surface and a sixth surface connected to the first to fourth surfaces and opposing each other in a third direction;
a first external electrode including a 1-1-th electrode layer disposed on the third surface, and a 1-2-th electrode layer disposed on the first and second surfaces and connected to the 1-1-th electrode layer; and
a second external electrode including a 2-1-th electrode layer disposed on the fourth surface and a 2-2-th electrode layer disposed on the first and second surfaces and connected to the 2-1-th electrode layer,
wherein the 1-2-th electrode layer and the 2-2-th electrode layer include Cu and a first additive element having a content lower than a content of the Cu,
the content of the first additive element included in the 1-2-th electrode layer is greater than the content of the first additive element included in the 1-1-th electrode layer, and the content of the first additive element included in the 2-2-th electrode layer is greater than the content of the first additive element included in the 2-1-th electrode layer, and
the first additive element is at least one selected from Ag or Al.
2 . The multilayer electronic component of claim 1 , wherein the 1-1-th electrode layer and the 1-2-th electrode layer contain Cu.
3 . The multilayer electronic component of claim 2 , wherein the 1-1-th electrode layer and the 2-1-th electrode layer further include a second additive element,
wherein the second additive element is at least one selected from Ni, Sn, Si, P, S, Cl, Zn, Ga, Ge, Se, Br, Nb, In, Sb, Te, I, Hf, Ta, W, Pt, Au, Pb or Bi.
4 . The multilayer electronic component of claim 1 , wherein each of the 1-1-th electrode layer, the 1-2-th electrode layer, the 2-1-th electrode layer, and the 2-2-th electrode layer contains glass.
5 . The multilayer electronic component of claim 4 , wherein the content of Cu included in the 1-2-th electrode layer and the 2-2-th electrode layer, and the content of the first additive element included in the 1-1-th electrode layer, the 1-2-th electrode layer, the 2-1-th electrode layer, and the 2-2-th electrode layer, are measured in an area excluding the glass.
6 . The multilayer electronic component of claim 4 , wherein in a cross section of the first external electrode in the first and second directions, an area fraction of the glass included in the 1-1-th electrode layer is greater than an area fraction of the glass included in the 1-2-th electrode layer, and
in a cross section of the second external electrode in the first and second directions, an area fraction of the glass included in the 2-1-th electrode layer is greater than an area fraction of the glass included in the 2-2-th electrode layer.
7 . The multilayer electronic component of claim 1 , wherein the 1-1-th electrode layer and the 2-1-th electrode layer are disposed between an extension line of the first surface and an extension line of the second surface.
8 . The multilayer electronic component of claim 1 , wherein the 1-1-th electrode layer includes a region not covered by the 1-2-th electrode layer on the third surface, and
the 2-1-th electrode layer includes a region not covered by the 2-2-th electrode layer on the fourth surface.
9 . A multilayer electronic component comprising:
a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, and having a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface connected to the first and second surfaces and opposing each other in a second direction, and a fifth surface and a sixth surface connected to the first to fourth surfaces and opposing each other in a third direction;
a first external electrode including a 1-1-th electrode layer disposed on the third surface, and a 1-2-th electrode layer disposed on the first and second surfaces and connected to the 1-1-th electrode layer; and
a second external electrode including a 2-1-th electrode layer disposed on the fourth surface, and a 2-2-th electrode layer disposed on the first and second surfaces and connected to the 2-1-th electrode layer,
wherein the 1-1-th electrode layer is disposed on an area of the third surface specified between an extension line of the first surface in the second direction and an extension line of the second surface in the second direction, and the 2-1-th electrode layer is disposed on an area of the fourth surface which is specified between the extension line of the first surface and the extension line of the second surface,
the 1-1-th electrode layer includes a region not covered by the 1-2-th electrode layer on the third surface,
the 2-1-th electrode layer includes a region not covered by the 2-2-th electrode layer on the fourth surface,
the 1-2-th electrode layer and the 2-2-th electrode layer each contain at least one of Ag or Al, and
the 1-2-th electrode layer overlaps the 1-1-th electrode layer in the second direction, or the 2-2-th electrode layer overlaps the 2-1-th electrode layer in the second direction.
10 . The multilayer electronic component of claim 9 , wherein each of the 1-1-th electrode layer and the 2-1-th electrode layer further includes at least one of Ni, Sn, Si, P, S, Cl, Zn, Ga, Ge, Se, Br, Nb, In, Sb, Te, I, Hf, Ta, W, Pt, Au, Pb or Bi.
11 . The multilayer electronic component of claim 9 , wherein the 1-1-th electrode layer, the 1-2-th electrode layer, the 2-1-th electrode layer, and the 2-2-th electrode layer each contains glass.
12 . The multilayer electronic component of claim 11 , wherein in a cross section of the first external electrode in the first and second directions, an area fraction of the glass of the 1-1-th electrode layer is greater than an area fraction of the glass of the 1-2-th electrode layer, and
in a cross section of the second external electrode in the first and second directions, an area fraction of the glass of the 2-1-th electrode layer is greater than an area fraction of the glass of the 2-2-th electrode layer.