Substrate processing apparatus and substrate processing method
A substrate processing apparatus includes a first transfer path that is a transfer path for a substrate after MOR film formation and before exposure, and a second transfer path that is a transfer path for the substrate after exposure; and one or a plurality of nitrogen atmosphere placement stages provided on at least one of the first transfer path and the second transfer path and configured to place the substrate in an environment with a nitrogen concentration of an atmosphere set higher than that of air.
1 . A substrate processing apparatus comprising:
a first transfer path that is a transfer path for a substrate after MOR film formation and before exposure, and a second transfer path that is a transfer path for the substrate after exposure;
one or a plurality of nitrogen atmosphere placement stages provided on at least one of the first transfer path and the second transfer path and configured to place the substrate in an environment with a nitrogen concentration of an atmosphere set higher than that of air;
a tower provided in a block where the substrate is delivered to and from an exposure apparatus and having a plurality of accommodation spaces formed vertically at a plurality of levels; and
one or a plurality of air atmosphere placement stages configured to place the substrate in an air environment,
wherein at least one of the nitrogen atmosphere placement stages is provided in any of the accommodation spaces in the tower, and
wherein at least one of the air atmosphere placement stages is provided in any of the accommodation spaces in the tower where the nitrogen atmosphere placement stage is not provided.
2 . The substrate processing apparatus of claim 1 , wherein at least one of the nitrogen atmosphere placement stages is provided on the first transfer path and on the second transfer path, and
wherein the nitrogen atmosphere placement stage provided on the first transfer path is set to have a lower nitrogen concentration than that in the nitrogen atmosphere placement stage provided on the second transfer path.
3 . The substrate processing apparatus of claim 1 , wherein at least one of the nitrogen atmosphere placement stages has a chamber structure including:
a cover provided to surround a support surface supporting the substrate; and
a first nitrogen supplier provided on the cover and configured to supply nitrogen into a space defined by the support surface and the cover.
4 . The substrate processing apparatus of claim 1 , wherein at least one of the nitrogen atmosphere placement stages has a slot structure including:
a plurality of slot dividers configured to define a plurality of slots where the substrate is accommodated;
wall portions provided on three sides among four sides around the substrate accommodated in the slot, excluding an opening that is an introduction port for the substrate; and
a second nitrogen supplier formed in an area of the wall portions facing the opening and configured to supply nitrogen toward the opening.
5 . The substrate processing apparatus of claim 4 , wherein the nitrogen atmosphere placement stage has an opening/closing part in the opening, and
wherein the opening/closing part includes a plurality of shutters provided side by side in a depth direction, each of which has a plurality of passage regions arranged side by side in a vertical direction, wherein when each of the plurality of shutters relatively moves to each other in the vertical direction, an area of the opening facing some of the plurality of slots is opened.
6 . A substrate processing apparatus comprising:
a first transfer path that is a transfer path for a substrate after MOR film formation and before exposure, and a second transfer path that is a transfer path for the substrate after exposure; and
one or a plurality of nitrogen atmosphere placement stages provided on at least one of the first transfer path and the second transfer path and configured to place the substrate in an environment with a nitrogen concentration of an atmosphere set higher than that of air,
wherein at least one of the nitrogen atmosphere placement stages has a slot structure including:
a plurality of slot dividers configured to define a plurality of slots where the substrate is accommodated;
wall portions provided on three sides among four sides around the substrate accommodated in the slot, excluding an opening that is an introduction port for the substrate; and
a second nitrogen supplier formed in an area of the wall portions facing the opening and configured to supply nitrogen toward the opening.
7 . The substrate processing apparatus of claim 6 , further comprising:
a tower provided in a block where the substrate is delivered to and from an exposure apparatus and having a plurality of accommodation spaces formed vertically at a plurality of levels; and
one or a plurality of air atmosphere placement stages configured to place the substrate in an air environment,
wherein at least one of the nitrogen atmosphere placement stages is provided in any of the accommodation spaces in the tower, and
wherein at least one of the air atmosphere placement stages is provided in any of the accommodation spaces in the tower where the nitrogen atmosphere placement stage is not provided.
8 . The substrate processing apparatus of claim 7 , wherein at least one of the nitrogen atmosphere placement stages is provided on the first transfer path and on the second transfer path, and
wherein the nitrogen atmosphere placement stage provided on the first transfer path is set to have a lower nitrogen concentration than that in the nitrogen atmosphere placement stage provided on the second transfer path.
9 . The substrate processing apparatus of claim 6 , wherein the nitrogen atmosphere placement stage has an opening/closing part in the opening, and
wherein the opening/closing part includes a plurality of shutters provided side by side in a depth direction, each of which has a plurality of passage regions arranged side by side in a vertical direction, wherein when each of the plurality of shutters relatively moves to each other in the vertical direction, an area of the opening facing some of the plurality of slots is opened.
10 . The substrate processing apparatus of claim 6 , wherein at least one of the nitrogen atmosphere placement stages is provided in a thermal-processing unit in a processing block.
11 . The substrate processing apparatus of claim 6 , wherein at least one of the nitrogen atmosphere placement stages is provided between a processing block and a substrate loading/unloading part.
12 . The substrate processing apparatus of claim 6 , wherein at least one of the nitrogen atmosphere placement stages is provided on the first transfer path and on the second transfer path, and
wherein the nitrogen atmosphere placement stage provided on the first transfer path is set to have a lower nitrogen concentration than that in the nitrogen atmosphere placement stage provided on the second transfer path.