Infrared light source module having shield can embedded therein and electronic device comprising same
The electronic device includes an infrared light emitter disposed on the printed circuit board, the infrared light emitter corresponding to a first light-transmitting area of the plurality of light-transmitting areas, and being configured to emit infrared light through the first light-transmitting area; and an infrared receiver corresponding to a second light-transmitting area of the plurality of light-transmitting areas. The infrared light emitter includes: a substrate including a third surface facing a third direction and a fourth surface facing a fourth direction opposite to the third direction; at least one electronic component including a light source disposed on the fourth surface of the substrate; a module housing surrounding the at least one electronic component of the substrate; and a shielding member disposed in the module housing, the shielding member being configured to shield electromagnetic waves.
1 . An electronic device comprising:
a housing including a first surface facing a first direction and a second surface facing a second direction opposite to the first direction;
a plurality of light-transmitting areas on the second surface;
a printed circuit board disposed between the first surface and the second surface;
an infrared light emitter disposed on the printed circuit board, the infrared light emitter corresponding to a first light-transmitting area of the plurality of light-transmitting areas, and being configured to emit infrared light through the first light-transmitting area; and
an infrared receiver corresponding to a second light-transmitting area of the plurality of light-transmitting areas,
wherein the infrared light emitter includes:
a substrate including a third surface facing a third direction and a fourth surface facing a fourth direction opposite to the third direction;
at least one electronic component including a light source disposed on the fourth surface of the substrate;
a module housing surrounding the at least one electronic component of the substrate; and
a shield can disposed in the module housing, the shield can being configured to shield electromagnetic waves, and
wherein the module housing is different from the shield can.
2 . The electronic device of claim 1 , wherein the module housing and the shield can are disposed to surround a periphery of a side surface of the substrate.
3 . The electronic device of claim 1 , wherein both of the module housing and the shield can extend to an end of the third surface of the substrate.
4 . The electronic device of claim 3 , wherein a flat portion extending parallel to the third surface is disposed on the end of the shield can.
5 . The electronic device of claim 1 , wherein the infrared light emitter further includes an interposer stacked with the substrate, the interposer being adjacent to the third surface of the substrate.
6 . The electronic device of claim 5 , wherein the infrared light emitter further includes a via disposed in along a periphery of the interposer.
7 . The electronic device of claim 6 , wherein the via is a ground wall.
8 . The electronic device of claim 5 , wherein the interposer includes a rim electrode configured to be connected to the shield can.
9 . The electronic device of claim 8 , wherein the shield can is electrically connected to the rim electrode through a solder.
10 . The electronic device of claim 5 , wherein the interposer includes a fifth surface facing a fifth direction and a sixth surface facing a sixth direction being opposite to the fifth direction, and
wherein a solder ball is disposed on the fifth surface.
11 . The electronic device of claim 1 , wherein the light source is a vertical-cavity surface-emitting laser (VCSEL).
12 . The electronic device of claim 1 , wherein the at least one electronic component further includes a drive integrated circuit (IC).
13 . The electronic device of claim 1 , wherein the substrate includes an Al 2 O 3 or AlN material.
14 . The electronic device of claim 1 , wherein both of the module housing and the shield can are disposed in a double injection molding structure.
15 . The electronic device of claim 1 , further comprising a support supporting at least a portion of the module housing.
16 . An IR light emitter mounted in an electronic device for obtaining depth information may include:
a substrate;
at least one electronic component including a light source disposed on a first surface of the substrate;
an interposer stacked with the substrate, adjacent to a second surface of the substrate; a module housing surrounding the at least one electronic component of the substrate; and
a shield can built in the module housing,
wherein the module housing is different from the shield can.
17 . The IR light emitter of claim 16 , wherein the module housing and the shield can may be disposed to surround a periphery of a side surface of the substrate.
18 . The IR light emitter of claim 16 , wherein the IR light emitter further include a via built in along a periphery of the interposer.
19 . The IR light emitter of claim 18 , wherein the via forms a ground wall.
20 . The IR light emitter of claim 19 , wherein the module housing and the shield can may extend to an end of the substrate, a flat portion extending parallel to the one surface of the substrate may be formed on an end of the shield can, and the flat portion may be electrically connected to a rime electrode formed on an end of the via.