Backside metal patterning die singulation systems and related methods
Implementations of die singulation systems and related methods may include forming a plurality of die on a first side of a substrate, forming a seed layer on a second side of a substrate opposite the first side of the substrate, using a shadow mask, applying a mask layer over the seed layer, forming a backside metal layer over the seed layer, removing the mask layer, and singulating the plurality of die included in the substrate through removing substrate material in the die street and through removing seed layer material in the die street.
1. A method of singulating a plurality of die comprised in a silicon carbide substrate, the method comprising:
forming a plurality of die on a first side of a silicon carbide substrate;
using a shadow mask, applying a mask layer over a second side of the silicon carbide substrate;
forming a backside metal layer over the second side of the silicon carbide substrate;
removing the mask layer; and
singulating the plurality of die comprised in the silicon carbide substrate through removing substrate material in a die street.
2. The method of claim 1 , wherein the plurality of die comprise a plurality of power semiconductor die.
3. The method of claim 1 , wherein the plurality of die comprise one of one or more MOSFETs or one or more IGBTs.
4. The method of claim 1 , further comprising flipping the silicon carbide substrate and singulating the plurality of die through removing substrate material from the first side of the silicon carbide substrate.
5. The method of claim 1 , wherein removing substrate material in the die street further comprises plasma etching.
6. The method of claim 1 , wherein removing substrate material in the die street further comprises using one of a laser beam or a saw blade.
7. The method of claim 1 , further comprising thinning the second side of the silicon carbide substrate to a thickness less than 30 micrometers.
8. The method of claim 1 , further comprising aligning the silicon carbide substrate from a backside of the silicon carbide substrate.
9. A method of singulating a plurality of die comprised in a substrate, the method comprising:
forming a plurality of die on a first side of a substrate;
using a shadow mask, applying a mask layer over a second side of the substrate;
removing the shadow mask;
forming a backside metal layer over the second side of the substrate;
removing the mask layer;
singulating the plurality of die comprised in the substrate through removing substrate material in a die street; and
remote plasma healing a sidewall of each singulated die.
10. The method of claim 9 , wherein the plurality of die comprise a plurality of power semiconductor die.
11. The method of claim 9 , further comprising flipping the substrate and singulating the plurality of die through removing substrate material from the first side of the substrate.
12. The method of claim 9 , further comprising thinning the second side of the substrate to a thickness less than 30 micrometers.
13. The method of claim 9 , further comprising aligning the substrate from a backside of the substrate.
14. A method of singulating a plurality of die comprised in a substrate, the method comprising:
forming a plurality of die on a first side of a substrate;
forming an edge ring through thinning a second side of the substrate;
using a shadow mask, applying a mask layer over the second side of the substrate;
removing the shadow mask;
forming a backside metal layer over the second side of the substrate;
removing the mask layer;
singulating the plurality of die comprised in the substrate through removing substrate material in a die street.
15. The method of claim 14 , wherein the plurality of die comprise a plurality of power semiconductor die.
16. The method of claim 14 , further comprising flipping the substrate and singulating the plurality of die through removing substrate material from the first side of the substrate.
17. The method of claim 14 , wherein the substrate comprises a silicon carbide substrate.
18. The method of claim 14 , wherein removing substrate material in the die street further comprises plasma etching.
19. The method of claim 14 , wherein the substrate is thinned to less than 50 micrometers.
20. The method of claim 14 , wherein the substrate is thinned to less than 30 micrometers.