Granted Patent
B2
US 12,735,838 · App. 18/446,581 · Granted Sep 15, 2026
Thermal interface materials comprising aligned fibers and materials such as solder, alloys, and/or other metals
Assignee:
Boston Materials, Inc.
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Abstract
The present disclosure is generally directed to a variety of thermally conductive materials for use in semiconductor devices or other applications. In some cases, the materials may include aligned fibers such as carbon fibers, e.g., defining a substrate, and a metal such as solder. In some cases, the metal may be present within a transition metal rich solder alloy, a conductive medium such as a conductive ink, a thermal chemical vapor deposited solder, an oxide coated liquid metal, an oxide coated liquid metal transition metal rich solder alloy, etc. The metal may have a relatively low melting temperature in certain embodiments. The metal may be interspersed or infiltrated between the plurality of discontinuous fibers, and/or surround at least some of the fibers. In some cases, the metal may react with the carbon fibers to form metal carbides and/or diffuse into the carbon fibers, which may facilitate contact between the metal and the carbon fibers. Other aspects are generally directed to devices using such compositions, methods of making such compositions, kits including such compositions, or the like.
Claims (19)
1 . A composition, comprising:
a plurality of discontinuous fibers defining a substrate, wherein the plurality of discontinuous fibers comprise carbon fibers having an average diameter of at least 5 micrometers, and at least 30 vol % of the discontinuous fibers within the substrate are substantially aligned; and
a solder in contact with the plurality of discontinuous fibers, wherein at least some of the solder is interspersed with the plurality of discontinuous fibers, and the plurality of discontinuous fibers is more thermally conductive than the solder.
2 . The composition of claim 1 , wherein the solder comprises a transition metal rich solder alloy.
3 . The composition of claim 1 , wherein the solder comprises an oxide coated liquid metal.
4 . The composition of claim 1 , wherein the solder comprises an oxide coated liquid metal transition metal rich solder alloy.
5 . The composition of claim 1 , wherein the solder comprises a thermal chemical vapor deposited metal.
6 . The composition of claim 1 , wherein the solder is contained within a conductive medium.
7 . The composition of claim 1 , wherein at least some of the solder covers a first side of the substrate.
8 . The composition of claim 1 , wherein at least some of the solder surrounds the plurality of discontinuous fibers.
9 . The composition of claim 1 , wherein the solder has a melting temperature of no more than 265° C.
10 . The composition of claim 1 , wherein the solder comprises nickel.
11 . The composition of claim 1 , further comprising solder flux in contact with the solder.
12 . The composition of claim 1 , wherein the carbon fibers have a carbon content greater than 94% and a modulus of at least 200 GPa.
13 . The composition of claim 1 , wherein at least 30% of the lengths of the discontinuous fibers are in contact with the solder.
14 . The composition of claim 1 , wherein at least 50 vol % of the discontinuous fibers have an alignment that is within 45° of the average alignment of the plurality of discontinuous fibers.
15 . The composition of claim 1 , wherein the composition has an overall heat conductivity of at least 30 W/m K.
16 . The composition of claim 1 , wherein the composition exhibits anisotropic heat conductivity.
17 . A device, comprising the composition of claim 1 , wherein the composition is in thermal communication with a heat source and a cooling apparatus.
Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded Sep 13, 2023
From: PADILLA, RAFAEL, JR.; PAN, CHUNZHOU
To: BOSTON MATERIALS, INC.
Reel/Frame 064889/0118 →
Continuity (2)
Provisional Application
63398190
· Aug 15, 2022
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