High frequency module and communication device
To suppress degradation of characteristics, a high frequency module includes a mounting substrate, a first signal terminal, a second signal terminal, and ground terminals, and a hybrid filter. The hybrid filter is coupled between the first signal terminal and the second signal terminal. The hybrid filter includes an acoustic wave filter having at least one acoustic wave resonator, a first inductor, and a capacitor. The pass band width of the hybrid filter is larger than that of the acoustic wave resonator. A resin layer is disposed on a first principal surface of the mounting substrate. The resin layer covers at least part of the acoustic wave filter. A metal electrode layer covers at least part of the resin layer, and is coupled to the ground terminals. The second inductor is coupled between the hybrid filter and the second signal terminal.
1. A high frequency module comprising:
a mounting substrate having a first principal surface and a second principal surface that are opposed to each other;
a first signal terminal, a second signal terminal, and a ground terminal that are on the mounting substrate; and
a hybrid filter coupled between the first signal terminal and the second signal terminal, wherein the hybrid filter comprises:
an acoustic wave filter comprising at least one acoustic wave resonator;
a first inductor; and
a capacitor,
wherein a pass band width of the hybrid filter is larger than a pass band width of the acoustic wave resonator,
wherein the acoustic wave filter is on the first principal surface of the mounting substrate,
wherein the first inductor and the capacitor are in or on the mounting substrate, and
wherein the high frequency module further comprises:
a resin layer that is on the first principal surface of the mounting substrate and that covers at least part of the acoustic wave filter;
a metal electrode layer that covers at least part of the resin layer and that is coupled to the ground terminal; and
a second inductor that is in or on the mounting substrate, and that is coupled in series between the hybrid filter and the second signal terminal.
2. A high frequency module comprising:
a mounting substrate having a first principal surface and a second principal surface that are opposed to each other;
a first signal terminal, a second signal terminal, a third signal terminal, and a ground terminal that are on the mounting substrate;
a first filter that is a hybrid filter coupled between the first signal terminal and the second signal terminal, and that comprises an acoustic wave filter comprising at least one acoustic wave resonator, a first inductor, and a capacitor; and
a second filter that is coupled between the first signal terminal and the third signal terminal, wherein a pass band width of the hybrid filter is larger than a pass band width of the acoustic wave resonator,
wherein the acoustic wave filter is on the first principal surface of the mounting substrate,
wherein the second filter, the first inductor, and the capacitor are in or on the mounting substrate, and
wherein the high frequency module further comprises:
a resin layer that is on the first principal surface of the mounting substrate and that covers at least part of the acoustic wave filter;
a metal electrode layer that covers at least part of the resin layer and that is coupled to the ground terminal; and
a second inductor that is in or on the mounting substrate, and that is coupled between the second filter and the third signal terminal.
3. The high frequency module according to claim 1 , wherein the second inductor includes a conductor pattern in the mounting substrate.
4. The high frequency module according to claim 3 ,
wherein the second signal terminal is on the second principal surface of the mounting substrate, and
wherein in plan view from a thickness direction of the mounting substrate, the second inductor overlaps the second signal terminal.
5. The high frequency module according to claim 1 , further comprising:
a third signal terminal on the mounting substrate;
a second acoustic wave filter that is an electronic component different from the acoustic wave filter, that is on the first principal surface of the mounting substrate, and that is coupled between the first signal terminal and the third signal terminal; and
a third inductor that is in or on the mounting substrate, and that is coupled between the second acoustic wave filter and the third signal terminal.
6. The high frequency module according to claim 5 , wherein the third inductor includes a conductor pattern in the mounting substrate.
7. The high frequency module according to claim 5 , wherein the mounting substrate further has a conductor that is between the second inductor and the third inductor in plan view from a thickness direction of the mounting substrate, and is coupled to the ground terminal.
8. The high frequency module according to claim 7 , wherein the conductor comprises a ground layer that is between the first principal surface and the second principal surface of the mounting substrate, and that intersects the thickness direction of the mounting substrate.
9. The high frequency module according to claim 1 , wherein in the hybrid filter, a shortest distance between the first inductor and the metal electrode layer is shorter than a shortest distance between the acoustic wave filter and the metal electrode layer and a shortest distance between the capacitor and the metal electrode layer.
10. The high frequency module according to claim 1 , wherein in the hybrid filter, a shortest distance between the acoustic wave filter and the metal electrode layer is shorter than a shortest distance between the first inductor and the metal electrode layer and a shortest distance between the capacitor and the metal electrode layer.
11. The high frequency module according to claim 10 , wherein in the hybrid filter, a principal surface of the acoustic wave filter on a side opposite to a side of the mounting substrate is in contact with the metal electrode layer.
12. The high frequency module according to claim 2 , wherein the second inductor includes a conductor pattern in the mounting substrate.
13. The high frequency module according to claim 12 ,
wherein the third signal terminal is on the second principal surface of the mounting substrate, and
wherein in plan view from a thickness direction of the mounting substrate, the second inductor overlaps the third signal terminal.
14. The high frequency module according to claim 1 , further comprising:
a matching circuit coupled between the first signal terminal and the acoustic wave filter, wherein the matching circuit comprises at least one electronic component on the first principal surface of the mounting substrate,
wherein the first inductor or the capacitor is a circuit element on the first principal surface of the mounting substrate, and
wherein in plan view from a thickness direction of the mounting substrate, the acoustic wave filter is between the circuit element on the first principal surface of the mounting substrate and the at least one electronic component on the first principal surface of the mounting substrate.
15. The high frequency module according to claim 2 , further comprising:
a matching circuit coupled between the first signal terminal and the acoustic wave filter, wherein the matching circuit comprises at least one electronic component on the first principal surface of the mounting substrate,
wherein the first inductor or the capacitor is a circuit element on the first principal surface of the mounting substrate, and
wherein in plan view from a thickness direction of the mounting substrate, the acoustic wave filter is between the circuit element on the first principal surface of the mounting substrate and the at least one electronic component on the first principal surface of the mounting substrate.
16. The high frequency module according to claim 14 ,
wherein in plan view from the thickness direction of the mounting substrate, an outer edge of the acoustic wave filter includes a first side and a second side that are opposed to each other in a first direction, and
wherein in the plan view from the thickness direction of the mounting substrate:
the at least one electronic component on the first principal surface of the mounting substrate is adjacent to the first side of the outer edge of the acoustic wave filter, and
the at circuit element on the first principal surface of the mounting substrate is adjacent to the second side of the outer edge of the acoustic wave filter.
17. The high frequency module according to claim 14 ,
wherein in the plan view from the thickness direction of the mounting substrate, an outer edge of the acoustic wave filter includes:
a first side and a second side that are opposed to each other in a first direction, and
a third side and a fourth side that are opposed to each other in a second direction orthogonal to the first direction, and
wherein in the plan view from the thickness direction of the mounting substrate:
the at least one electronic component on the first principal surface of the mounting substrate is adjacent to the first side of the outer edge of the acoustic wave filter, and
the circuit element on the first principal surface of the mounting substrate is adjacent to the third side of the outer edge of the acoustic wave filter.
18. The high frequency module according to claim 14 ,
wherein the matching circuit comprises a chip inductor and a chip capacitor, and
wherein the chip inductor and the chip capacitor are on the first principal surface of the mounting substrate.
19. A communication device comprising:
the high frequency module according to claim 1 ; and
a signal processing circuit configured to process a high frequency signal for use in the high frequency module.
20. A communication device comprising:
the high frequency module according to claim 2 ; and
a signal processing circuit configured to process a high frequency signal for use in the high frequency module.