Nanoimprinted photonic integrated circuits
A method of making a photonic integrated circuit (PIC) is provided. The method comprises depositing a functional resist material layer over a substrate, disposing and pressing a stamp with a plurality of nanopatterns into the functional resist material for a period of time, and removing the stamp from the functional resist material to provide nanofeatures that are inverted versions of the nanopatterns, wherein the nanofeatures form one or more optical elements.
1. A photonic integrated circuit (PIC) comprising:
a substrate;
a nanoimprinted resist structure overlying the substrate, the nanoimprinted resist structure having a plurality of features that form one or more optical elements; and
an encapsulation layer overlying the nanoimprinted resist structure, wherein the encapsulation layer has a thickness that is less than a height of all the plurality of features.
2. The PIC of claim 1 , wherein the encapsulation layer has a lower refractive index than the nanoimprinted resist structure.
3. The PIC of claim 2 , wherein the nanoimprinted resist structure is inorganic and primarily comprised of silica, titanium oxide (TiO 2 ), or titanium oxide particles or semiconductor particles embedded in a sol-gel.
4. The PIC of claim 1 , wherein the nanoimprinted resist structure is formed of a photo-curable or thermally-curable resist.
5. The PIC of claim 1 , wherein the nanoimprinted resist structure has a refractive index greater than 1.5 and less than 4.0.
6. The PIC of claim 5 , wherein the substrate has a refractive index less than 1.5.
7. The PIC of claim 6 , wherein the substrate is formed of one of glass, quartz, silicon, and sapphire.
8. The PIC of claim 1 , wherein the single nanoimprint resist structure includes both centimeters, millimeters or micrometers features and nanometers features having varying heights.
9. The PIC of claim 1 , wherein the plurality of nanofeatures of the single nanoimprint resist structure is formed from a single stamp having a plurality of nanopatterns that are inverted versions of the plurality of nanofeatures.
10. The PIC of claim 9 , wherein the single stamp is a soft polymeric stamp.