Patent Application

App. No. 18/501,858

Abstract

Claims (72)

1 . A power module, comprising:

at least one power substrate;

a plurality of power devices on the at least one power substrate;

power contacts;

power wire bonds; and

a composite physical containment structure comprising a composite element and an encapsulation material,

wherein the composite element comprises a membrane structure, a dam structure and/or a glob structure; and

wherein a portion of the composite physical containment structure is arranged at least partially on the plurality of power devices, the power wire bonds, and/or the at least one power substrate.

2 . The power module according to claim 1 ,

wherein the composite element comprises the membrane structure; and

wherein the membrane structure is arranged above the power devices and the power wire bonds.

3 . The power module according to claim 2 , further comprising a housing comprising at least housing sidewalls,

wherein the membrane structure is arranged between the housing sidewalls.

4 . The power module according to claim 2 , further comprising a housing comprising at least housing sidewalls,

wherein the membrane structure and the housing sidewalls are configured and structured as a single component, such that the membrane structure is part of the housing sidewalls.

5 . The power module according to claim 2 , further comprising a housing comprising at least housing sidewalls,

wherein the membrane structure and the housing sidewalls are configured and structured as separate components.

6 . (canceled)

7 . (canceled)

8 . The power module according to claim 2 , further comprising a housing comprising at least housing sidewalls,

wherein the encapsulation material is arranged within the housing sidewalls.

9 . The power module according to claim 8 , wherein the membrane structure and the encapsulation material comprise different materials comprising different material properties.

10 . (canceled)

11 . The power module according to claim 2 , wherein the encapsulation material is arranged at least partially on the power devices and/or the power wire bonds.

12 . (canceled)

13 . The power module according to claim 2 , wherein the encapsulation material extends from the power devices into the membrane structure, through the membrane structure, and/or above the membrane structure.

14 . (canceled)

15 . The power module according to claim 2 , wherein the encapsulation material comprises an epoxy material.

16 . (canceled)

17 . The power module according to claim 2 , wherein the membrane structure comprises stress reduction features and/or strain reduction features.

18 . The power module according to claim 2 , wherein the membrane structure comprises aperture portions arranged therein.

19 .- 28 . (canceled)

29 . The power module according to claim 1 , wherein the composite element comprises the dam structure.

30 . The power module according to claim 29 , wherein the dam structure is filled with a dam encapsulation material.

31 . The power module according to claim 29 , further comprising a housing comprising at least housing sidewalls,

wherein the encapsulation material is arranged within the housing sidewalls.

32 . The power module according to claim 30 , wherein the dam encapsulation material and the dam structure are configured as stress reduction features and/or strain reduction features.

33 . (canceled)

34 . The power module according to claim 30 , wherein the dam encapsulation material and the encapsulation material comprise different materials comprising different material properties.

35 .- 43 . (canceled)

44 . The power module according to claim 1 , wherein the composite element comprises the glob structure.

45 . The power module according to claim 44 , wherein the glob structure is arranged on the at least one power substrate.

46 . The power module according to claim 44 , wherein the glob structure and the encapsulation material comprise different materials comprising different material properties.

47 . The power module according to claim 44 , wherein the glob structure at least partially surrounds one or more implementations of the power devices, signal connections, and/or the power wire bonds.

48 . The power module according to claim 44 , wherein the glob structure is configured as a stress reduction feature and/or strain reduction feature.

49 .- 119 . (canceled)

120 . A power module, comprising:

at least one power substrate;

a plurality of power devices on the at least one power substrate;

power contacts;

power wire bonds;

a housing comprising at least housing sidewalls; and

a composite physical containment structure comprising a membrane structure and an encapsulation material,

wherein the encapsulation material is arranged within the housing sidewalls.

121 .- 146 . (canceled)

147 . A power module, comprising:

at least one power substrate;

a plurality of power devices on the at least one power substrate;

power contacts;

power wire bonds; and

a composite physical containment structure comprising a dam structure and an encapsulation material,

wherein the dam structure is filled with a dam encapsulation material; and

wherein the dam encapsulation material and the encapsulation material comprise different materials comprising different material properties.

148 .- 158 . (canceled)

159 . A power module, comprising:

at least one power substrate;

a plurality of power devices on the at least one power substrate;

power contacts;

power wire bonds; and

a composite physical containment structure comprising a glob structure and an encapsulation material,

wherein the glob structure and the encapsulation material comprise different materials comprising different material properties.

160 .- 228 . (canceled)

Assignments (8)