IP Library › Granted Patent US 12,538,529
Granted Patent B2
US 12,538,529 · App. 18/511,711 · Granted Jan 27, 2026

Epitaxial fin structures of FINFET having an epitaxial buffer region and an epitaxial capping region

Inventors: Hsueh-Chang Sung (Zhubei, TW); Kun-Mu Li (Zhudong Township, TW)
Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
H10D62/021H01L21/02532H01L21/02576H01L21/02579H01L21/02609H01L21/0262H01L21/3065H01L21/3085H10D30/024H10D30/62H10D30/6211H10D30/797H10D62/151H10D62/405H10D64/017H10D62/116
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Quick Facts
Patent No.
US 12,538,529
App. No.
18/511,711
Granted
Jan 27, 2026
Kind
B2
Abstract

A fin structure on a substrate is disclosed. The fin structure can comprises a first epitaxial region and a second epitaxial region separated by a dielectric region, a merged epitaxial region on the first epitaxial region and the second epitaxial region, an epitaxial buffer region on a top surface of the merged epitaxial region, and an epitaxial capping region on the buffer epitaxial region and side surfaces of the merged epitaxial region.

Claims (38)

1 . A structure, comprising:

first and second fin structures on a substrate;

a merged epitaxial structure on the first and second fin structures;

an epitaxial buffer layer on the merged epitaxial structure, wherein a length of a horizontal interface between the epitaxial buffer layer and the merged epitaxial structure is greater than a distance between the first and second fin structures; and

an epitaxial capping layer on the epitaxial buffer layer and a side surface of the merged epitaxial structure.

2 . The structure of claim 1 , wherein a first thickness of a first portion of the epitaxial buffer layer on a top surface of the merged epitaxial structure is greater than a second thickness of a second portion of the epitaxial buffer layer on the side surface of the merged epitaxial structure.

3 . The structure of claim 1 , wherein the epitaxial capping layer is on a ( 111 ) crystal plane of the merged epitaxial structure.

4 . The structure of claim 1 , wherein the epitaxial capping layer is in contact with the side surface of the merged epitaxial structure, wherein the side surface is along a ( 100 ) crystal plane.

5 . The structure of claim 1 , wherein a dopant concentration of the epitaxial capping layer is between about 1×10 20 atoms/cm 3 and about 3×10 21 atoms/cm 3 .

6 . The structure of claim 1 , wherein a dopant concentration of the epitaxial buffer layer is less than about 2×10 21 atoms/cm 3 .

7 . The structure of claim 1 , wherein:

the epitaxial buffer layer comprises germanium having an atomic concentration in a range from about 10 atomic percent to about 15 atomic percent; and

the epitaxial capping layer comprises less than 25 atomic percent of germanium.

8 . A structure, comprising:

first, second, and third fin structures on a substrate;

a merged epitaxial region on the first and second fin structures;

an epitaxial region on the third fin structure; and

an epitaxial buffer region on the merged epitaxial region, wherein an interface between the epitaxial buffer region and the merged epitaxial region is higher than a top surface of the epitaxial region.

9 . The structure of claim 8 , wherein a length of an interface between the epitaxial buffer region and the merged epitaxial region is greater than a distance between the first and second fin structures.

10 . The structure of claim 8 , wherein:

the epitaxial region comprises a first side surface substantially perpendicular to the substrate; and

the merged epitaxial region comprises a second side surface parallel to the first side surface.

11 . The structure of claim 8 , wherein a thickness the epitaxial buffer region is between about 1 nm and about 3 nm.

12 . The structure of claim 8 , further comprising an epitaxial capping layer on the epitaxial buffer region.

13 . The structure of claim 12 , wherein a thickness of the epitaxial capping layer is between about 2 nm and about 7 nm.

14 . The structure of claim 12 , wherein the epitaxial capping layer is in contact with a top surface of the epitaxial buffer region and a side surface of the merged epitaxial region, and wherein the top surface is along a ( 100 ) crystal plane and the side surface is along a ( 111 ) crystal plane.

15 . A structure, comprising:

first, second, third, and fourth fin structures on a substrate;

first and second epitaxial regions on the first and second fin structures, respectively, wherein a first side surface of the first epitaxial region is parallel to and opposite to a second side surface of the second epitaxial region;

a merged epitaxial region on the third and fourth fin structures; and

an epitaxial buffer layer on a top surface of the merged epitaxial region and higher than horizontal top surfaces of the first and second epitaxial regions.

16 . The structure of claim 15 , wherein a length of an interface between the epitaxial buffer layer and the merged epitaxial region is greater than a distance between the third and fourth fin structures.

17 . The structure of claim 15 , wherein a third side surface of the merged epitaxial region is parallel to the first and second side surfaces.

18 . The structure of claim 15 , further comprising a capping layer over the merged epitaxial region, the first epitaxial region, and the second epitaxial region.

19 . The structure of claim 18 , further comprising an wherein the epitaxial buffer layer is in contact with the top surface of the merged epitaxial region and a bottom surface of the capping layer.

20 . The structure of claim 18 , wherein the capping layer comprises:

a first portion on the first epitaxial region and having a side surface substantially perpendicular to the substrate; and

a second portion on the merged epitaxial region and having a side surface substantially perpendicular to the substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 28, 2023
From: SUNG, HSUEH-CHANG; LI, KUN-MU
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 065682/0444 →
Continuity (5)
Continuation 17515883 · Nov 1, 2021
Continuation 16908057 · Jun 22, 2020
Division 15581778 · Apr 28, 2017
Provisional Application 62428220 · Nov 30, 2016
Related Publication 20240088266A1 · Mar 14, 2024
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