Semiconductor device and method of manufacturing the same
View Patent ↗A memory device includes peripheral transistors formed along a first surface of a substate; memory cells formed in one or more of first metallization layers disposed over the first surface, each of the memory cells being operatively coupled to a subset of the peripheral transistors and including a programming transistor and at least a first reading transistor; and second metallization layers disposed over a second surface of the substrate opposite to the first surface. A first source/drain terminal of the first reading transistor is in electrical connection with a first source/drain terminal of the programming transistor. A second source/drain terminal of the first reading transistor is in electrical connection with a bit line that is formed in a corresponding one of the second metallization layers.
1 . A memory device, comprising:
a plurality of peripheral transistors formed along a first surface of a substrate;
a plurality of memory cells formed in one or more of a plurality of first metallization layers disposed over the first surface, each of the plurality of memory cells being operatively coupled to a subset of the peripheral transistors and comprising a programming transistor and at least a first reading transistor; and
a plurality of second metallization layers disposed over a second surface of the substrate opposite to the first surface;
wherein a first source/drain terminal of the programming transistor is in electrical connection with a first source/drain terminal of the first reading transistor, and a second source/drain terminal of the first reading transistor is in electrical connection with a bit line formed in a corresponding one of the second metallization layers.
2 . The memory device of claim 1 , wherein each of the memory cells operatively serves as an anti-fuse memory cell, in which a gate dielectric of the programming transistor is configured to be permanently broken down.
3 . The memory device of claim 1 , wherein a second source/drain terminal of the programming transistor is floating.
4 . The memory device of claim 1 , wherein each of the programming transistor and the first reading transistor has a semiconductive-behaving material as its channel.
5 . The memory device of claim 4 , wherein the semiconductive-behaving material is formed in a corresponding one of the first metallization layers and formed as a two-dimensional film.
6 . The memory device of claim 4 , wherein the semiconductive-behaving material is formed in a corresponding one of the first metallization layers and formed as a three-dimensional structure.
7 . The memory device of claim 1 , wherein the subset of the peripheral transistors include a first peripheral transistor and a second peripheral transistor that are operatively coupled to a gate terminal of the programming transistor and a gate terminal of the first reading transistor, respectively.
8 . The memory device of claim 1 , wherein each of the memory cells further comprising a second reading transistor electrically connected to the programming transistor and the first reading transistor in series.
9 . The memory device of claim 8 , wherein the programming transistor is laterally interposed between the first reading transistor and the second reading transistor.
10 . The memory device of claim 8 , wherein the second reading transistor is laterally interposed between the first reading transistor and the programming transistor.
11 . A memory device, comprising:
a memory cell comprising:
a programming transistor; and
a first reading transistor in electrical connection with the programming transistor in series and in electrical connection with a bit line;
wherein the memory cell is formed in one of a plurality of first metallization layers formed over a first surface of a substrate;
wherein the memory cell is operatively coupled to a subset of a plurality of peripheral transistors formed along the first surface of the substrate; and
wherein the bit line is formed in one of a plurality of second metallization layers formed over a second surface of the substrate opposite to the first surface.
12 . The memory device of claim 11 , wherein the memory cell operatively serves as an anti-fuse memory cell, in which a gate dielectric of the programming transistor is configured to be permanently broken down.
13 . The memory device of claim 11 , wherein each of the programming transistor and the first reading transistor has a semiconductive-behaving material as a channel thereof.
14 . The memory device of claim 11 , wherein the memory cell further comprises a second reading transistor in electrical connection with the programming transistor and the first reading transistor in series.
15 . The memory device of claim 14 , wherein the programming transistor is electrically connected between the first reading transistor and the second reading transistor.
16 . The memory device of claim 14 , wherein the second reading transistor is electrically connected between the first reading transistor and the programming transistor.
17 . A method for forming memory devices, comprising:
forming a plurality of peripheral transistors along a first surface of a substrate;
forming a plurality of first metallization layers disposed over the first surface;
forming a plurality of memory cells in one or more of the plurality of first metallization layers, wherein each of the plurality of memory cells is operatively coupled to a subset of the peripheral transistors and comprises a programming transistor and at least a reading transistor;
forming a plurality of second metallization layers disposed over a second surface of the substrate opposite to the first surface; and
coupling a source/drain terminal of the reading transistor of each of the memory cells to a bit line formed in a corresponding one of the second metallization layers.
18 . The method of claim 17 , wherein the source/drain terminal of the reading transistor of each of the memory cells is coupled to the bit line by a first via structure, the first via structure extending along a lateral direction with a first width.
19 . The method of claim 18 , wherein the source/drain terminal of the reading transistor of each of the memory cells is coupled to the bit line further by a second via structure, the second via structure extending along the lateral direction with a second width that is substantially greater than the first width.
20 . The method of claim 17 , wherein each of the memory cells includes a plurality of transistors connected in series, and wherein each of the plurality of transistors has a semiconductive-behaving material as its channel.