Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
A semiconductor manufacturing apparatus includes a tool performing joining by ultrasonic vibration while applying a load to a metal terminal. The tool includes a plurality of protrusions arranged along the X-axis direction and the Y-axis direction on a pressing surface in a rectangular shape at a tip end portion facing the metal terminal. The intervals between the plurality of protrusions are equal in the X direction of the pressing surface, and are larger on the inner peripheral side than on the outer peripheral side in the Y-axis direction of the pressing surface.
1 . A method of manufacturing a semiconductor device, comprising:
performing joining by ultrasonic vibration while applying a load to a metal terminal with a tool, wherein
the tool includes a plurality of protrusions arranged on a pressing surface in a rectangular shape at a tip end portion facing the metal terminal along a first direction and a second direction that is a direction intersecting the first direction,
intervals between the plurality of protrusions are equal in the first direction of the pressing surface,
along a row of the plurality of protrusions in the second direction, a plurality of intervals between the plurality of protrusions on an inner peripheral side in the second direction are greater than an interval between the plurality of protrusions on an outer peripheral side of the pressing surface in the second direction,
a protruding portion protruding toward the metal terminal is provided across one end portion of the pressing surface in the first direction, the protruding portion being positioned outside of the metal terminal in the first direction during the joining, and
the protruding portion is configured to block a whisker from coming into contact with the semiconductor device during the joining.
2 . The method according to claim 1 , wherein widths of the plurality of protrusions are equal.
3 . The method according to claim 1 , wherein the plurality of protrusions are directly adjacent to each other along the first direction of the pressing surface.
4 . The method according to claim 1 , wherein among the plurality of protrusions provided at both end portions in the second direction of the pressing surface, a groove on an outer peripheral side of the protrusions provided at both end portions in the first direction of the pressing surface is deeper than a groove between the protrusions provided at a portion other than the both end portions in the first direction of the pressing surface.
5 . The method according to claim 1 , wherein along each row of the plurality of protrusions extending in the second direction, the plurality of intervals between the plurality of protrusions on the inner peripheral side in the second direction are greater than the plurality of intervals between the plurality of protrusions on the outer peripheral side of the pressing surface in the second direction.
6 . The method according to claim 1 , wherein intervals between each of the plurality of protrusions are equal in the first direction.
7 . The method according to claim 1 , wherein during the joining by ultrasonic vibration while applying the load to the metal terminal with the tool, a whisker is generated from the metal terminal that spreads in the first direction along the inner peripheral side.
8 . The method according to claim 1 , wherein the protruding portion has a smaller height than the plurality of protrusions measured in a third direction perpendicular to the first direction and the second direction.
9 . A method of manufacturing a semiconductor device, comprising:
performing joining by ultrasonic vibration while applying a load to a metal terminal with a tool, wherein
the tool includes a plurality of protrusions arranged on a pressing surface in a rectangular shape at a tip end portion facing the metal terminal along a first direction and a second direction that is a direction intersecting the first direction,
intervals between the plurality of protrusions are equal in the first direction of the pressing surface,
along a row of the plurality of protrusions in the second direction, a plurality of intervals between the plurality of protrusions on an inner peripheral side in the second direction are greater than an interval between the plurality of protrusions on an outer peripheral side of the pressing surface in the second direction,
a protruding portion protruding toward the metal terminal is provided across one end portion of the pressing surface in the first direction, the protruding portion being positioned outside of the metal terminal in the first direction during the joining, and
among the plurality of protrusions provided at both end portions in the second direction of the pressing surface, a groove on an outer peripheral side of the protrusions provided at both end portions in the first direction of the pressing surface is deeper than a groove between the protrusions provided at a portion other than the both end portions in the first direction of the pressing surface.