IP Library › Granted Patent US 12,227,862
Granted Patent B2
US 12,227,862 · App. 18/583,656 · Granted Feb 18, 2025

Methods for electrochemical additive manufacturing of parts

Inventors: David Pain (Carlsbad, CA); Ian Winfield (Oceanside, CA); Andrew Edmonds (Oceanside, CA); Kareem Shaik (San Diego, CA); Jeffrey Herman (Solana Beach, CA); Michael Matthews (Encinitas, CA); Charles Pateros (Carlsbad, CA)
Assignee: FABRIC8LABS, INC.
C25D1/003C25D5/10C25D5/60C25D17/12C25D21/12B33Y10/00B33Y30/00
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,227,862
App. No.
18/583,656
Granted
Feb 18, 2025
Kind
B2
Abstract

An electrochemical additive manufacturing method includes positioning a cathode portion of a build plate and a deposition anode array into an electrolyte solution. The method additionally includes transmitting electrical energy from the power source through one or more deposition anodes, through the electrolyte solution, and to the cathode portion such that material is deposited onto the cathode portion. The build plate includes a thermal feature, the deposited material is thermally coupled with the thermal feature, and the deposited material forms a heat wicking feature.

Claims (72)

1. An electrochemical additive manufacturing method, comprising steps of:

positioning a first build plate into an electrolyte solution such that a conductive surface of a cathode portion of the first build plate directly contacts the electrolyte solution;

positioning a deposition anode array, comprising a plurality of deposition anodes, into the electrolyte solution such that a gap is established between the conductive surface of the cathode portion and the deposition anode array;

connecting the cathode portion to a power source;

connecting one or more deposition anodes of the plurality of deposition anodes to the power source;

transmitting electrical energy from the power source through the one or more deposition anodes of the plurality of deposition anodes, through the electrolyte solution, and to the conductive surface of the cathode portion, such that material is deposited onto the conductive surface of the cathode portion forms at least a portion of a component, wherein:

the first build plate comprises a thermal feature configured to transfer heat;

the material deposited onto the conductive surface is thermally coupled with the thermal feature to promote heat transfer by or to the thermal feature; and

the material deposited onto the conductive surface forms a heat wicking feature;

positioning a second build plate into the electrolyte solution such that a conductive surface of a cathode portion of the second build plate directly contacts the electrolyte solution;

positioning the deposition anode array into the electrolyte solution such that a gap is established between the conductive surface of the cathode portion of the second build plate and the deposition anode array;

connecting the cathode portion of the second build plate to the power source;

transmitting electrical energy from the power source through the one or more deposition anodes of the plurality of deposition anodes, through the electrolyte solution, and to the conductive surface of the cathode portion of the second build plate, such that material is deposited onto the conductive surface of the cathode portion of the second build plate forms at least a portion of a second component, wherein:

the second build plate comprises a second thermal feature configured to transfer heat;

the material deposited onto the conductive surface of the cathode portion of the second build plate is thermally coupled with the second thermal feature to promote heat transfer by or to the second thermal feature; and

the material deposited onto the conductive surface of the cathode portion of the second build plate forms a second heat wicking feature; and

coupling together opposing end portions of the first build plate to opposing end portions of the second build plate to define a sealed fluid channel between the first build plate and the second build plate, wherein the heat wicking feature and the second heat wicking feature are located within the sealed fluid channel.

2. The electrochemical additive manufacturing method according to claim 1 , wherein at least one of the heat wicking feature and the second heat wicking feature comprises at least one protrusion.

3. The electrochemical additive manufacturing method according to claim 1 , wherein:

the heat wicking feature comprises at least one recess;

the second heat wicking feature comprises at least one protrusion; and

the electrochemical additive manufacturing method further comprises nestably inserting the at least one recess into the at least one protrusion.

4. The electrochemical additive manufacturing method according to claim 1 , wherein the step of coupling together the opposing end portions of the first build plate to the opposing end portions of the second build plate comprises sealing together opposing free ends of the first build plate to opposing free ends of the second build plate.

5. The electrochemical additive manufacturing method according to claim 1 , wherein the thermal feature comprises at least one fin attached to a surface of the cathode portion of the first build plate that is opposite the conductive surface of the cathode portion.

6. The electrochemical additive manufacturing method according to claim 1 , wherein:

the component comprises an electronic sensor component; and

the cathode portion and the material deposited onto the conductive surface of the cathode portion form the electronic sensor component.

7. The electrochemical additive manufacturing method according to claim 6 , wherein the electronic sensor component comprises a thermocouple.

8. The electrochemical additive manufacturing method according to claim 6 , wherein the electronic sensor component comprises a strain gauge.

9. The electrochemical additive manufacturing method according to claim 1 , wherein the heat wicking feature is a first lattice and the second heat wicking feature is a second lattice.

10. An electrochemical additive manufacturing method, comprising steps of:

positioning a first build plate into an electrolyte solution such that a conductive surface of a cathode portion of the first build plate directly contacts the electrolyte solution;

positioning a deposition anode array, comprising a plurality of deposition anodes, into the electrolyte solution such that a gap is established between the conductive surface of the cathode portion and the deposition anode array;

connecting the cathode portion to a power source;

connecting one or more deposition anodes of the plurality of deposition anodes to the power source;

transmitting electrical energy from the power source through the one or more deposition anodes of the plurality of deposition anodes, through the electrolyte solution, and to the conductive surface of the cathode portion, such that material is deposited onto the conductive surface of the cathode portion forms at least a portion of a component, wherein:

the first build plate comprises a thermal feature configured to transfer heat;

the material deposited onto the conductive surface is thermally coupled with the thermal feature to promote heat transfer by or to the thermal feature; and

the material deposited onto the conductive surface forms a heat wicking feature that comprises protrusions, spaced apart from each other and each located at a corresponding one of multiple discrete locations distributed along the heat wicking feature;

positioning a second build plate into the electrolyte solution such that a conductive surface of a cathode portion of the second build plate directly contacts the electrolyte solution;

positioning the deposition anode array into the electrolyte solution such that a gap is established between the conductive surface of the cathode portion of the second build plate and the deposition anode array;

connecting the cathode portion of the second build plate to the power source;

transmitting electrical energy from the power source through the one or more deposition anodes of the plurality of deposition anodes, through the electrolyte solution, and to the conductive surface of the cathode portion of the second build plate, such that material is deposited onto the conductive surface of the cathode portion of the second build plate forms at least a portion of a second component, wherein:

the second build plate comprises a second thermal feature configured to transfer heat;

the material deposited onto the conductive surface of the cathode portion of the second build plate is thermally coupled with the second thermal feature to promote heat transfer by or to the second thermal feature; and

the material deposited onto the conductive surface of the cathode portion of the second build plate forms a second heat wicking feature; and

coupling together opposing end portions of the first build plate to opposing end portions of the second build plate to define a sealed fluid channel between the first build plate and the second build plate, wherein:

the heat wicking feature and the second heat wicking feature are located within the sealed fluid channel;

the heat wicking feature and the second heat wicking feature are spaced apart from each other except at the discrete locations where the protrusions of the heat wicking feature and the second heat wicking feature contact each other; and

the discrete locations are distributed across a width of the sealed fluid channel.

11. The electrochemical additive manufacturing method according to claim 10 , wherein, at each one of the one or more discrete locations, the heat wicking feature, including the protrusion, and the second heat wicking feature together span the sealed fluid channel.

12. The electrochemical additive manufacturing method according to claim 10 , wherein, the second heat wicking feature comprises recesses, spaced apart from each other across the second heat wicking feature and each receiving a corresponding one of the protrusions of the heat wicking feature.

13. The electrochemical additive manufacturing method according to claim 10 , wherein the heat wicking feature comprises three or more protrusions that contact the second heat wicking feature at three or more discrete locations.

14. The electrochemical additive manufacturing method according to claim 10 , wherein the heat wicking feature, including the protrusions, is a first lattice and the second heat wicking feature is a second lattice.

15. An electrochemical additive manufacturing method, comprising steps of:

positioning a build plate into an electrolyte solution such that a conductive surface of a cathode portion of the build plate directly contacts the electrolyte solution;

positioning a deposition anode array, comprising a plurality of deposition anodes, into the electrolyte solution such that a gap is established between the conductive surface of the cathode portion and the deposition anode array;

connecting the cathode portion to a power source;

connecting one or more deposition anodes of the plurality of deposition anodes to the power source; and

transmitting electrical energy from the power source through the one or more deposition anodes of the plurality of deposition anodes, through the electrolyte solution, and to the conductive surface of the cathode portion, such that material is deposited onto the conductive surface of the cathode portion forms at least a portion of a component, wherein:

the build plate comprises a thermal feature configured to transfer heat;

the material deposited onto the conductive surface is thermally coupled with the thermal feature to promote heat transfer by or to the thermal feature; and

the material deposited onto the conductive surface forms a heat wicking feature comprising a plurality of protrusions spaced apart from each other at discrete locations distributed across the heat wicking feature.

16. The electrochemical additive manufacturing method according to claim 15 , further comprising coupling together opposing end portions of the build plate to opposing end portions of a second build plate to define a sealed fluid channel between the build plate and the second build plate, wherein the heat wicking feature is located within the sealed fluid channel.

17. The electrochemical additive manufacturing method according to claim 16 , wherein:

a second heat wicking feature is attached to the second build plate; and

the second heat wicking feature is located within the sealed fluid channel when the opposing end portions of the build plate and the opposing end portions of the second build plate are coupled together.

18. The electrochemical additive manufacturing method according to claim 17 , wherein the heat wicking feature and the second heat wicking feature are spaced apart from each other except at one or more discrete locations where the plurality of protrusions of the heat wicking feature contact the second heat wicking feature.

19. The electrochemical additive manufacturing method according to claim 18 , wherein:

the second heat wicking feature comprises a plurality of recesses at discrete locations across the second heat wicking feature; and

each one of the plurality of protrusions of the heat wicking feature is nestably inserted into a corresponding one of the plurality of recesses of the second heat wicking feature.

20. The electrochemical additive manufacturing method according to claim 19 , wherein the heat wicking feature, including the plurality of protrusions, is a first lattice and the second heat wicking feature, including the plurality of recesses, is a second lattice.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2024
From: PAIN, DAVID; WINFIELD, IAN; EDMONDS, ANDREW; SHAIK, KAREEM; HERMAN, JEFFREY; MATTHEWS, MICHAEL; PATEROS, CHARLES
To: FABRIC8LABS, INC.
Reel/Frame 066527/0611 →
Continuity (3)
Continuation 17903966 · Sep 6, 2022
Provisional Application 63260918 · Sep 4, 2021
Related Publication 20240271304A1 · Aug 15, 2024
References Cited (55)
US 4575330A · Hull · 1986 [cited by applicant]
US 4678282A · Yaniv et al. · 1987 [cited by applicant]
US 5132820A · Someya et al. · 1992 [cited by applicant]
US 5403460A · Sala et al. · 1995 [cited by applicant]
US 5641391A · Hunter et al. · 1997 [cited by applicant]
US 5998805A · Shi et al. · 1999 [cited by applicant]
US 6036834A · Clerc · 2000 [cited by applicant]
US 7839831B2 · Vrcelj et al. · 2010 [cited by applicant]
US 8168540B1 · Reid et al. · 2012 [cited by applicant]
US 8681077B2 · Kimura · 2014 [cited by applicant]
US 9777385B2 · Wirth et al. · 2017 [cited by applicant]
US 10465307B2 · Pain et al. · 2019 [cited by applicant]
US 10724146B1 · Pain et al. · 2020 [cited by applicant]
US 10914000B1 · Pain et al. · 2021 [cited by applicant]
US 10947632B1 · Pain et al. · 2021 [cited by applicant]
US 11232956B2 · Pain et al. · 2022 [cited by applicant]
US 11313035B2 · Pain et al. · 2022 [cited by applicant]
US 11313036B2 · Pain et al. · 2022 [cited by applicant]
US 11401603B2 · Pain et al. · 2022 [cited by applicant]
US 20010014409A1 · Cohen · 2001 [cited by applicant]
US 20030006133A1 · Metzger · 2003 [cited by applicant]
US 20040129573A1 · Cohen · 2004 [cited by applicant]
US 20040134788A1 · Cohen · 2004 [cited by examiner]
US 20050045252A1 · Yamasaki et al. · 2005 [cited by applicant]
US 20050176238A1 · Cohen et al. · 2005 [cited by applicant]
US 20050183959A1 · Wilson et al. · 2005 [cited by applicant]
US 20050202660A1 · Cohen et al. · 2005 [cited by applicant]
US 20050223543A1 · Cohen et al. · 2005 [cited by applicant]
US 20060134831A1 · Cohen · 2006 [cited by examiner]
US 20060283539A1 · Slafer · 2006 [cited by applicant]
US 20070068819A1 · Singh et al. · 2007 [cited by applicant]
US 20070089993A1 · Schwartz et al. · 2007 [cited by applicant]
US 20070221504A1 · Yuefeng · 2007 [cited by applicant]
US 20100300886A1 · Lin et al. · 2010 [cited by applicant]
US 20110210005A1 · Van Den Bossche et al. · 2011 [cited by applicant]
US 20170145584A1 · Wirth et al. · 2017 [cited by applicant]
US 20190160594A1 · Flamm et al. · 2019 [cited by applicant]
US 20210047744A1 · Biton · 2021 [cited by applicant]
US 20210348288A1 · Eliyahu · 2021 [cited by examiner]
CN 104178782 · 2014 [cited by applicant]
CN 204097583 · 2015 [cited by applicant]
CN 104593830 · 2015 [cited by applicant]
WO 2017087884 · 2017 [cited by applicant]
WO 2019150362 · 2019 [cited by applicant]
WO 2021041265 · 2021 [cited by applicant]
Frey et al., “Switch-matrix-based High-Density Microelectrode Array in CMOS Technology”, IEEE Journal of Solid-State-Circuits, Feb. 2010, pp. 467-482, vol. 45, No. 2. [cited by applicant]
Stewart et al., “Polysilicon TFT Technology for Active Matrix OLED Displays”, IEEE Transactions on Electron Devices, May 2001, pp. 845-851, vol. 48, No. 5. [cited by applicant]
International Search Report and Written Opinion for PCT/US2020/04753l dated Sep. 29, 2020. [cited by applicant]
Supplementary International Search Report for PCT/US2020/04753l dated Nov. 22, 2021. [cited by applicant]
U.S. Appl. No. 17/554,677, filed Dec. 17, 2021. [cited by applicant]
U.S. Appl. No. 17/566,546, filed Dec. 30, 2021. [cited by applicant]
U.S. Appl. No. 17/535,437, filed Nov. 24, 2021. [cited by applicant]
U.S. Appl. No. 17/738,729, filed May 6, 2022. [cited by applicant]
U.S. Appl. No. 17/863,272, filed Jul. 12, 2022. [cited by applicant]
Nakamura et al., Incorporation of input function into displays using LTPS TFT technology, Journal of the SID, 2006, pp. 363-369, 14/4. [cited by applicant]