Patent Application

App. No. 18/584,179

Abstract

Claims (54)

1 . A semiconductor device package, comprising:

a submount;

a thermoelectric structure on the submount, the thermoelectric structure operable to adjust a temperature difference between a first side of the thermoelectric structure and a second side of the thermoelectric structure based on a bias voltage applied to the thermoelectric structure; and

one or more semiconductor die on the thermoelectric structure.

2 - 14 . (canceled)

15 . The semiconductor device package of claim 1 , wherein the thermoelectric structure comprises a plurality of p-type thermoelectric semiconductor structures and a plurality of n-type thermoelectric semiconductor structures.

16 . (canceled)

17 . The semiconductor device package of claim 15 , wherein the plurality of p-type thermoelectric semiconductor structures and the plurality of n-type thermoelectric semiconductor structures comprise a bismuth alloy.

18 . (canceled)

19 . The semiconductor device package of claim 15 , wherein the plurality of p-type thermoelectric semiconductor structures and the plurality of n-type thermoelectric semiconductor structures comprise a conductive polymer, the conductive polymer being one of poly polystyrene sulfonate (PEDOT:PSS), polyaniline (PANI), polythiophene (PTH), or polyphenylene vinylene (PPV).

20 - 24 . (canceled)

25 . The semiconductor device package of claim 1 , further comprising a power substrate between the thermoelectric structure and the one or more semiconductor die, wherein:

the power substrate comprises a first conducting layer, a second conducting layer, and an insulating layer between the first conducting layer and the second conducting layer, and

the one or more semiconductor die are on the power substrate.

26 . (canceled)

27 . The semiconductor device package of claim 1 , wherein the submount is a first submount, wherein the one or more semiconductor die comprises a plurality of semiconductor die, the semiconductor device package further comprising:

a second submount on the first side of the thermoelectric structure,

wherein the plurality of semiconductor die are on the second submount.

28 . (canceled)

29 . The semiconductor device package of claim 1 , wherein the thermoelectric structure is a first thermoelectric structure, the semiconductor device package further comprising a second thermoelectric structure on a side of the one or more semiconductor die opposite from the first thermoelectric structure.

30 - 33 . (canceled)

34 . The semiconductor device package of claim 1 , wherein the semiconductor device package is one of a discrete semiconductor package or a power module.

35 - 38 . (canceled)

39 . A semiconductor device package, comprising:

a thermoelectric structure comprising an array of thermoelectric semiconductor structures; and

a semiconductor die on the thermoelectric structure.

40 . (canceled)

41 . The semiconductor device package of claim 39 , wherein the thermoelectric structure comprises a first layer defining a first side of the thermoelectric structure and a second layer defining a second side of the thermoelectric structure, and wherein the array of thermoelectric semiconductor structures is between the first layer and the second layer.

42 . The semiconductor device package of claim 41 , wherein the thermoelectric structure comprises a thermoelectric film, each of the first layer and the second layer having a thickness in a range of about 0.3 microns to about 5 microns.

43 - 44 . (canceled)

45 . The semiconductor device package of claim 41 , further comprising a plurality of interconnects coupling adjacent thermoelectric semiconductor structures in the array, the plurality of interconnects comprising one or more first interconnects contacting the first layer and one or more second interconnects contacting the second layer,

wherein each thermoelectric semiconductor structure comprises a first side and an opposing second side, each of the first interconnects contacting a respective first side and each of the second interconnects contacting a respective second side.

46 - 48 . (canceled)

49 . The semiconductor device package of claim 39 , wherein each semiconductor structure in the array has a thickness in a range of about 0.1 microns to about 20 microns, a length in a range of about 1 micron to about 1000 microns, a width in a range of about 1 micron to about 1000 microns, and is separated from adjacent thermoelectric semiconductor structures in the array by a distance in a range of about 1 micron to about 100 microns.

50 . The semiconductor device package of claim 39 , wherein the thermoelectric structure further comprises a first bias voltage connection structure coupled to a first end of the array and a second bias voltage connection structure coupled to a second end of the array, and

wherein the array comprises a plurality of p-type thermoelectric semiconductor structures and a plurality of n-type thermoelectric semiconductor structures, the plurality of p-type thermoelectric semiconductor structures being alternately arranged in series with the plurality of n-type thermoelectric semiconductor structures between the first end of the array and the second end the array.

51 . (canceled)

52 . The semiconductor device package of claim 50 , wherein each of the plurality of p-type thermoelectric semiconductor structures comprises bismuth telluride doped with antimony, and each of the plurality of n-type thermoelectric semiconductor structures comprises bismuth telluride doped with selenium.

53 - 54 . (canceled)

55 . The semiconductor device package of claim 50 , wherein each of the plurality of p-type thermoelectric semiconductor structures comprises a PEDOT-carbon nanotube (CNT) composite, and each of the plurality of n-type thermoelectric semiconductor structures comprises a polyethylenimine (PEI) doped PEDOT-carbon nanotube (CNT) composite.

56 - 57 . (canceled)

58 . A semiconductor device package, comprising:

a housing;

a submount;

a thermoelectric structure;

at least one connection structure extending from the housing, the at least one connection structure coupled to the thermoelectric structure; and

at least one semiconductor die on the thermoelectric structure.

59 . (canceled)

60 . The semiconductor device package of claim 58 , wherein the at least one connection structure is one of a pin, a lead, a terminal, a contact, an interconnect, or a bonding pad.

61 - 67 . (canceled)

68 . The semiconductor device package of claim 58 , further comprising a heat sink coupled to the thermoelectric structure, wherein the heat sink comprises a thermally conductive material.

69 - 72 . (canceled)

73 . The semiconductor device package of claim 58 , wherein the at least one semiconductor die comprises at least one wide bandgap semiconductor device, the at least one wide bandgap semiconductor device comprising one of a silicon carbide-based metal-oxide-semiconductor field-effect transistor (MOSFET), a silicon carbide-based Schottky diode, or a Group-III nitride-based high electron mobility transistor (HEMT) device.

74 . (canceled)

Assignments (8)