Device for controlling trapped ions
A device for trapping ions includes: a substrate having a metal layer structure; and at least one ion trap configured to trap ions in a space over the substrate. The metal layer structure is a multi-layer metal structure that includes: a top metal layer having one or more electrodes forming part of the at least one ion trap; a redistribution metal layer having wiring for connecting the one or more electrodes; a first insulating layer arranged between the top metal layer and the redistribution layer and having one or more voids; and one or more connection elements arranged in the one or more voids that connect the wiring from the redistribution metal layer with the one or more electrodes in the top metal layer.
1. A device for trapping ions, the device comprising:
a substrate comprising a metal layer structure; and
at least one ion trap configured to trap ions in a space over the substrate;
wherein the metal layer structure is a multi-layer metal structure that comprises:
a top metal layer comprising one or more electrodes forming part of the at least one ion trap;
a redistribution metal layer comprising wiring for connecting the one or more electrodes;
a first insulating layer arranged between the top metal layer and the redistribution layer and comprising one or more voids; and
one or more connection elements arranged in the one or more voids that connect the wiring from the redistribution metal layer with the one or more electrodes in the top metal layer.
2. The device of claim 1 , wherein the wiring comprises a first wire for connecting a first electrode of the one or more electrodes with a first external terminal, and wherein the wiring further comprises a second wire for connecting a second electrode of the one or more electrodes with a second external terminal.
3. The device of claim 2 , wherein the first external terminal and the second external terminal are formed in the top metal layer.
4. The device of claim 3 , further comprising:
an application board comprising a plurality of lead terminals,
wherein the substrate is mounted on the application board, and
wherein the first external terminal is connected with a first lead terminal of the plurality of lead terminals and the second external terminal is connected with a second lead terminal of the plurality of lead terminals.
5. The device of claim 4 , wherein the first external terminal is connected with the first lead terminal of the application board via wire bonding, and wherein the second external terminal is connected with the second lead terminal of the application board via wire bonding.
6. The device of claim 4 , wherein the substrate is mounted on the application via a glue.
7. The device of claim 1 , wherein the multi-layer metal structure further comprises:
a continuous metal layer arranged between the substrate and the redistribution metal layer; and
a second insulating layer arranged between the redistribution metal layer and the continuous metal layer.
8. The device of claim 1 , wherein the substrate comprises one or more metallized areas covering a surface of the substrate in regions where laser light is introduced into the device.
9. The device of claim 1 , wherein the top metal layer further comprises one or more metallized areas that do not form part of the at least one ion trap that cover a surface of the substrate laterally adjacent to the at least one ion trap.
10. The device of claim 1 , wherein the one or more electrodes comprise at least one RF electrode and at least one DC electrode.
11. The device of claim 1 , wherein the multi-layer metal stack is formed of a material that comprises at least one of: Cu, Al, Au, Pt, Pd, Ti and TiW.
12. The device of claim 1 , wherein an upper surface of the top metal layer comprises at least one of Au and Pt.
13. The device of claim 1 , wherein the first insulating layer is formed of a material that comprises at least one of silicon oxide and silicon nitride.
14. A device for controlling trapped ions, the device comprising:
a first substrate;
a second substrate disposed over the first substrate;
at least one ion trap configured to trap ions in a space between the first substrate and the second substrate; and
a spacer disposed between the first substrate and the second substrate, the spacer comprising an electrical interconnect which electrically connects a first metal layer structure of the first substrate to a second metal layer structure of the second substrate.
15. The device of claim 14 , wherein the spacer comprises a printed circuit board.
16. The device of claim 15 , wherein the printed circuit board is provided with vias forming the electrical interconnect.
17. The device of claim 15 , wherein the printed circuit board comprises a top metallization layer, an intermediate metallization layer and a bottom metallization layer, and wherein the intermediate metallization layer is structured as an electrical redistribution layer.
18. The device of claim 15 , wherein the printed circuit board has metallized side walls facing the space between the first substrate and the second substrate.
19. The device of claim 14 , wherein the first substrate is provided with external terminals of the device and the external terminals are electrically connected via the electrical interconnect to the second metal layer structure of the second substrate.
20. The device of claim 14 , wherein the first substrate and/or the second substrate is provided with an opening for optical access to the space between the first substrate and the second substrate.