Packaged current sensor integrated circuit with exposed cooling pad
A current sensor integrated circuit package includes a primary conductor having an input portion into which a current flows and an output portion from which the current flows, a plurality of secondary leads, and a semiconductor die disposed adjacent to a top surface of the primary conductor and positioned on an insulator portion. In some embodiments, at least one magnetic field sensing element is supported by the semiconductor die. In some embodiments, the package includes a package body with a first portion enclosing the semiconductor die and a first portion of the primary conductor and a second portion enclosing an elongated portion of the plurality of secondary leads, wherein a second portion of the primary conductor is exposed. A pad is secured to the package body and a pillar extends from the primary conductor to the pad.
1 . A current sensor integrated circuit package, comprising:
a primary conductor having an input portion into which a current flows and an output portion from which the current flows;
a plurality of secondary leads;
a semiconductor die disposed adjacent to a top surface of the primary conductor and positioned on an insulator portion;
at least one magnetic field sensing element supported by the semiconductor die;
a package body comprising an upper package body surface adjacent to the top surface of the primary conductor, a first portion enclosing the semiconductor die and a first portion of the primary conductor, and a second portion enclosing an elongated portion of the plurality of secondary leads, wherein a second portion of the primary conductor is exposed;
a pad secured to the upper package body surface of the package body, wherein a portion of the pad extends beyond a periphery of the package body, the second, exposed portion of the primary conductor comprises the input portion of the primary conductor and the output portion of the primary conductor, and the portion of the pad extends over either the input portion of the primary conductor or the output portion of the primary conductor; and
a pillar extending from the top surface of the primary conductor to the pad, wherein the pillar is disposed between the portion of the pad that extends beyond the periphery of the package body and the second, exposed portion of the primary conductor.
2 . The current sensor integrated circuit package of claim 1 , wherein the input portion has a reduced area edge and the output portion has a reduced area edge.
3 . The current sensor integrated circuit package of claim 1 , wherein the elongated portion of the plurality of secondary leads is offset with respect to an exposed portion of the respective secondary lead.
4 . The current sensor integrated circuit package of claim 1 , further comprising a non-conductive adhesive disposed between the pad and the package body.
5 . The current sensor integrated circuit package of claim 1 , wherein the pad is secured to the first portion of the package body, to the second portion of the package body, or to both the first portion of the package body and to the second portion of the package body.
6 . The current sensor integrated circuit package of claim 1 , wherein the pad is partially embedded in the package body.
7 . The current sensor integrated circuit package of claim 6 , wherein the pillar is disposed in the package body adjacent to the insulator portion.
8 . The current sensor integrated circuit package of claim 1 , wherein the pad comprises a nonferrous material.
9 . The current sensor integrated circuit package of claim 1 , wherein the pad comprises a ferrous material.
10 . The current sensor integrated circuit package of claim 1 , wherein the pillar comprises copper.
11 . The current sensor integrated circuit package of claim 1 , wherein the plurality of secondary leads comprises a first secondary lead providing an output connection of the current sensor integrated circuit package, a second secondary lead providing a voltage input connection of the current sensor integrated circuit package, and a third secondary lead providing a ground connection of the current sensor integrated circuit package.
12 . The current sensor integrated circuit package of claim 1 , further comprising a front-end amplifier supported by the semiconductor die, wherein the at least one magnetic field sensing element is coupled to the front-end amplifier.
13 . The current sensor integrated circuit package of claim 1 , comprising at least two magnetic field sensing elements.
14 . The current sensor integrated circuit package of claim 13 , wherein the at least two magnetic field sensing elements are Hall effect elements.
15 . The current sensor integrated circuit package of claim 14 , wherein the at least two magnetic field sensing elements are coupled to provide a differential output.
16 . The current sensor integrated circuit package of claim 1 , wherein at least one of the plurality of secondary leads provides a fault signal connection of the current sensor integrated circuit package.
17 . A current sensor integrated circuit package, comprising:
a primary conductor having an input portion into which a current flows and an output portion from which the current flows;
a plurality of secondary leads;
a semiconductor die disposed adjacent to a top surface of the primary conductor and positioned on an insulator portion;
at least one magnetic field sensing element supported by the semiconductor die;
a package body comprising an upper package body surface adjacent to the top surface of the primary conductor, a first portion enclosing the semiconductor die and a first portion of the primary conductor, and a second portion enclosing an elongated portion of the plurality of secondary leads, wherein a second portion of the primary conductor is exposed;
a pad secured to the upper package body surface of the package body, wherein the pad comprises one or more fins protruding from the pad; and
a pillar extending from the top surface of the primary conductor to the pad.
18 . A current sensor integrated circuit package, comprising:
a primary conductor having an input portion into which a current flows and an output portion from which the current flows;
a plurality of secondary leads;
a semiconductor die disposed adjacent to a top surface of the primary conductor and positioned on an insulator portion;
at least one magnetic field sensing element supported by the semiconductor die;
a package body comprising an upper package body surface adjacent to the top surface of the primary conductor, a first portion enclosing the semiconductor die and a first portion of the primary conductor, and a second portion enclosing an elongated portion of the plurality of secondary leads, wherein a second portion of the primary conductor is exposed;
a pad secured to the upper package body surface of the package body; and
a pillar extending from the top surface of the primary conductor to the pad, wherein the pillar is soldered or welded to the primary conductor.
19 . The current sensor integrated circuit package of claim 2 , wherein the reduced area edge of the input portion of the primary conductor does not extend beyond a first side edge of the package body and wherein the reduced area edge of the output portion of the primary conductor does not extend beyond a second side edge of the package body.
20 . The current sensor integrated circuit package of claim 18 , wherein a portion of the pad extends beyond a periphery of the package body.
21 . The current sensor integrated circuit package of claim 20 , wherein the second, exposed portion of the primary conductor comprises the input portion of the primary conductor and the output portion of the primary conductor and wherein the portion of the pad extends over either the input portion of the primary conductor or the output portion of the primary conductor.