Methods for magnetic sensor having non-conductive die paddle
Methods for providing a sensor integrated circuit package including employing a conductive leadframe and forming a non-conductive die paddle in relation to the leadframe. The method can further include placing a die on the non-conductive die paddle to form an assembly, forming at least one electrical connection between the die and the leadframe, and overmolding the assembly to form an integrated circuit package.
1. A method, comprising:
employing a conductive leadframe;
forming a non-conductive die paddle in relation to the leadframe;
placing a die on the non-conductive die paddle to form an assembly;
forming at least one electrical connection between the die and the leadframe;
coupling a magnetic transducer to the die;
molding a magnetic layer within the die paddle; and
overmolding the assembly to form an integrated circuit package.
2. The method according to claim 1 , further including forming the non-conductive die paddle from a plastic material.
3. The method according to claim 2 , further including molding the plastic die paddle.
4. The method according to claim 3 , wherein the leadframe does not overlap with the die.
5. The method according to claim 1 , wherein the magnetic transducer does not overlap with any of the leadframe.
6. The method according to claim 1 , further including overmolding the die paddle, the die, and the magnetic layer.
7. A method, comprising:
employing a conductive leadframe;
forming a non-conductive die paddle in relation to the leadframe;
placing a die on the non-conductive die paddle to form an assembly;
forming at least one electrical connection between the die and the leadframe;
overmolding the assembly to form an integrated circuit package;
positioning a Hall element in the die; and
molding a magnetic layer within the die paddle.
8. A method, comprising:
employing a conductive leadframe;
forming a non-conductive die paddle in relation to the leadframe;
placing a die on the non-conductive die paddle to form an assembly;
forming at least one electrical connection between the die and the leadframe;
overmolding the assembly to form an integrated circuit package;
positioning a magnetoresistive element; and
molding a magnetic layer within the die paddle.
9. A method, comprising:
employing a conductive leadframe;
forming a non-conductive die paddle in relation to the leadframe;
placing a die on the non-conductive die paddle to form an assembly;
forming at least one electrical connection between the die and the leadframe;
coupling a magnetic transducer to the die;
molding a magnetic layer within the die paddle;
overmolding the assembly to form an integrated circuit package; and
employing a non-conductive adhesive to secure the die to the die-paddle, wherein a material comprising the non-conductive die-paddle substantially eliminates eddy current flow in the die paddle.
10. The method according to claim 1 , wherein a first surface of the leadframe and a first surface of the die are substantially coplanar.
11. A method, comprising:
employing a conductive leadframe;
positioning a non-conductive die paddle in relation to the leadframe;
positioning a die in relation to the die paddle;
coupling a magnetic transducer to the die, wherein a cross section of the device through the magnetic transducer consists of non-conductive materials; and
molding a magnetic layer within the die paddle.
12. A method, comprising:
employing a conductive leadframe;
positioning a non-conductive die paddle in relation to the leadframe, wherein the die paddle comprises a plastic material;
positioning a die in relation to the die paddle;
coupling a magnetic transducer to the die, wherein the magnetic transducer does not overlap with any conductive material;
forming at least one electrical connection from the die to the leadframe; and
molding a magnetic layer within the die paddle.