IP Library › Granted Patent US 12,621,930
Granted Patent B2
US 12,621,930 · App. 18/617,391 · Granted May 5, 2026

Printed circuit board dielectric molding or machining and electrolytic metallization

Inventors: Edward C. Carignan (Round Rock, TX); Paulo Guedes-Pinto (Round Rock, TX)
Assignee: INFINITUM ELECTRIC INC.
H05K1/0284H02K3/26H05K1/0366H05K3/18H05K2201/09036
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,621,930
App. No.
18/617,391
Granted
May 5, 2026
Kind
B2
Abstract

A printed circuit board (PCB) has a tridimensional (3D) dielectric substrate having opposite sides and made of fiber-reinforced polymer. Each side comprises channels and pockets formed by molding or machining a dielectric laminate, and the channels and pockets define a layout for conductive traces and pads of the PCB. The channels and pockets in a same side of the 3D dielectric substrate have a uniform depth. Side walls of the channels and pockets have a draft angle in a range of at least about 5 degrees to at least about 15 degrees.

Claims (24)

1 . A printed circuit board (PCB) stator for an axial field rotary energy device, the PCB stator comprising:

PCB panels, each comprising a tridimensional (3D) dielectric substrate with opposite sides and made of fiber-reinforced polymer;

each side comprises channels and pockets comprising machined dielectric laminate, the channels and pockets in each side have a uniform depth, and the channels and pockets comprise a layout of conductive traces and pads that are plated therein and the outer surface of those conductive traces and pads are flush with the sides of the 3D dielectric substrate; and

side walls of the channels and pockets have a draft angle in a range of at least about 5 degrees to at least about 15 degrees.

2 . The PCB stator of claim 1 , wherein the channels and pockets of a first side of the sides of the PCB panels have a first depth, the channels and pockets of a second side of the sides of the PCB panels have a second depth.

3 . The PCB stator of claim 2 , wherein the first and second depths are the same or within 25 μm of each other.

4 . The PCB stator of claim 3 , wherein the sides of each PCB panel have a same layout.

5 . The PCB stator of claim 3 , wherein the sides of each PCB panel have a different layout.

6 . The PCB stator of claim 2 , wherein the first depth differs from the second depth.

7 . The PCB stator of claim 6 , wherein the sides of each PCB panel have a same layout.

8 . The PCB stator of claim 6 , wherein the sides of each PCB panel have a different layout.

9 . The PCB stator of claim 1 , wherein the uniform depth of the channels and pockets is equal to or greater than 140 μm.

10 . A printed circuit board (PCB) stator for an axial field rotary energy device, the PCB stator comprising:

PCB panels, each comprising a tridimensional (3D) dielectric substrate with opposite sides and made of fiber-reinforced polymer;

each side comprises channels and pockets comprising molded dielectric laminate, the channels and pockets in each side have a uniform depth, and the channels and pockets comprise a layout of conductive traces and pads that are plated therein and the outer surface of those conductive traces and pads are flush with the sides of the 3D dielectric substrate; and

side walls of the channels and pockets have a draft angle in a range of at least about 5 degrees to at least about 15 degrees.

11 . The PCB stator of claim 10 , wherein the channels and pockets of a first side of the sides of the PCB panels have a first depth, the channels and pockets of a second side of the sides of the PCB panels have a second depth.

12 . The PCB stator of claim 11 , wherein the first and second depths are the same or within 25 μm of each other.

13 . The PCB stator of claim 12 , wherein the sides of each PCB panel have a same layout.

14 . The PCB stator of claim 12 , wherein the sides of each PCB panel have a different layout.

15 . The PCB stator of claim 11 , wherein the first depth differs from the second depth.

16 . The PCB stator of claim 15 , wherein the sides of each PCB panel have a same layout.

17 . The PCB stator of claim 15 , wherein the sides of each PCB panel have a different layout.

18 . The PCB stator of claim 10 , wherein the uniform depth of the channels and pockets is equal to or greater than 140 μm.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 2, 2024
From: CARIGNAN, EDWARD C.; GUEDES-PINTO, PAULO
To: INFINITUM ELECTRIC INC.
Reel/Frame 066983/0191 →
Continuity (3)
Continuation In Part 18382921 · Oct 23, 2023
Continuation 18127453 · Mar 28, 2023
Related Publication 20240334595A1 · Oct 3, 2024
References Cited (60)
US 3230406A · Henry-Baudot · 1966 [cited by examiner]
US 4985600A · Heerman · 1991 [cited by applicant]
US 5589722A · Sakaguchi et al. · 1996 [cited by applicant]
US 6411002B1 · Smith · 2002 [cited by examiner]
US 6426241B1 · Cordes · 2002 [cited by examiner]
US 7573173B1 · Frownfelter · 2009 [cited by applicant]
US 8193781B2 · Lin · 2012 [cited by examiner]
US 8240036B2 · Yoshioka · 2012 [cited by examiner]
US 8736133B1 · Smith · 2014 [cited by examiner]
US 8785784B1 · Duford · 2014 [cited by examiner]
US 9072187B2 · Hu · 2015 [cited by examiner]
US 9332650B2 · Yoshioka et al. · 2016 [cited by applicant]
US 10135310B2 · Schuler · 2018 [cited by examiner]
US 10186922B2 · Schuler · 2019 [cited by examiner]
US 10819174B2 · Schuler et al. · 2020 [cited by applicant]
US 11336130B1 · Shaw · 2022 [cited by examiner]
US 11502583B1 · Lee · 2022 [cited by examiner]
US 11616423B1 · Lee et al. · 2023 [cited by applicant]
US 11750071B1 · Carignan · 2023 [cited by examiner]
US 11800640B1 · Carignan · 2023 [cited by examiner]
US 12004306B1 · Carignan · 2024 [cited by examiner]
US 20020066672A1 · Iijima et al. · 2002 [cited by applicant]
US 20030047458A1 · Begum et al. · 2003 [cited by applicant]
US 20030135998A1 · Walz et al. · 2003 [cited by applicant]
US 20050285470A1 · Itoh et al. · 2005 [cited by applicant]
US 20060202564A1 · Sakamoto et al. · 2006 [cited by applicant]
US 20060202584A1 · Jore · 2006 [cited by examiner]
US 20080129129A1 · Kori et al. · 2008 [cited by applicant]
US 20090051317A1 · Fridhendler et al. · 2009 [cited by applicant]
US 20090071705A1 · Kim · 2009 [cited by examiner]
US 20100253170A1 · Bi et al. · 2010 [cited by applicant]
US 20130049500A1 · Shan et al. · 2013 [cited by applicant]
US 20140070904A1 · Cahill et al. · 2014 [cited by applicant]
US 20140175922A1 · Jore et al. · 2014 [cited by applicant]
US 20150084446A1 · Atar · 2015 [cited by applicant]
US 20150318751A1 · Smith et al. · 2015 [cited by applicant]
US 20160329796A1 · Hano · 2016 [cited by examiner]
US 20180219445A1 · Jore · 2018 [cited by examiner]
US 20210143695A1 · Park · 2021 [cited by examiner]
US 20230036536A1 · Milheim · 2023 [cited by examiner]
US 20240334595A1 · Carignan · 2024 [cited by examiner]
US 20240334612A1 · Carignan · 2024 [cited by examiner]
US 20250133654A1 · Carignan · 2025 [cited by examiner]
US 20250219489A1 · Lee · 2025 [cited by examiner]
CN 1408197A · 2003 [cited by applicant]
CN 105871089A · 2016 [cited by applicant]
CN 105896760A · 2016 [cited by applicant]
CN 106300856A · 2017 [cited by applicant]
DE 29622874U1 · 1997 [cited by applicant]
DE 102011054250A1 · 2012 [cited by applicant]
DE 102015211852A1 · 2016 [cited by applicant]
EP 2284979A1 · 2011 [cited by applicant]
EP 2863524A1 · 2015 [cited by applicant]
GB 2033667A · 1980 [cited by applicant]
JP H11186698A · 1999 [cited by applicant]
JP 2003298207A · 2003 [cited by applicant]
JP 2004281427 · 2004 [cited by applicant]
WO 2009068079A1 · 2009 [cited by applicant]
Yamada et al., English Machine Translation of JP2004-281427 (Year: 2004). [cited by applicant]
German Federal Patent Court, Decision in the Appeal Matter Concerning Patent Application 11 2018 000 356.6. (in English and in German), Date of Mailing Aug. 7, 2024, 98 pages. [cited by applicant]