Materials and processes for generating radioisotopes
The present disclosure generally relates to materials, processes, generators, and/or systems, for generating radioisotope. The present disclosure also generally relates to ceramic materials comprising radioisotope suitable for use in a radioisotope generator. The present disclosure also generally relates to processes, generators and/or systems, for producing and capturing radioisotope. The present disclosure also generally relates to the preparation of radioisotope solutions for use in radiopharmacy and/or other clinical applications.
1. A 228 Th-based generator for producing 212 Pb, comprising:
a tantalum oxide substrate having an atomic lattice and including an immobilized 228 Th surface layer, wherein at least a portion of 228 Th atoms from the 228 Th surface layer have exchanged into the atomic lattice of the tantalum oxide substrate; and
a chamber comprising a collection surface, wherein the chamber is configured to house the tantalum oxide substrate in the chamber such that the 228 Th surface layer of the tantalum oxide substrate is in gaseous communication with the collection surface;
wherein the 228 Th surface layer permits emanation of gaseous 220 Rn produced by radioactive decay of 228 Th in the immobilized 228 Th surface layer into the chamber; and
212 Pb produced by radioactive decay of the gaseous 220 Rn in the chamber collects on the collection surface.
2. The generator of claim 1 , wherein the tantalum oxide substrate has a porosity, in volume percentage of total volume of the tantalum oxide substrate, of less than 10.
3. The generator of claim 2 , wherein the tantalum oxide substrate has a porosity, in volume percentage of total volume of the tantalum oxide substrate, of less than 5.
4. The generator of claim 1 , wherein the 228 Th surface layer has average activity of at least 10 MBq per cm 2 .
5. The generator of claim 4 , wherein the 228 Th surface layer has average activity of at least 100 MBq per cm 2 .
6. The generator of claim 1 , wherein the 228 Th surface layer is tightly bound such that emanating gaseous 220 Rn contains less than 0.1% 228 Th as a contaminant.
7. The generator of claim 1 , wherein the 228 Th surface layer is tightly bound such that the 212 Pb produced by radioactive decay of the gaseous 220 Rn contains less than 0.1% 228 Th as a contaminant.
8. The generator of claim 1 , wherein the 228 Th surface layer is formed by applying an aqueous solution of 228 Th to the tantalum oxide substrate and heating the aqueous solution and tantalum oxide substrate to convert the 228 Th in aqueous solution to 228 Th oxide.
9. The generator of claim 8 , wherein the aqueous solution of 228 Th is 228 Th nitrate.
10. The generator of claim 9 , wherein the 228 Th surface layer is tightly bound such that emanating gaseous 220 Rn contains less than 0.1% 228 Th as a contaminant and/or the 212 Pb produced by radioactive decay of the gaseous 220 Rn contains less than 0.1% 228 Th as a contaminant.
11. The generator of claim 1 , wherein the 228 Th surface layer contains at least 200MBq of 228 Th.
12. The generator of claim 1 , wherein the 228 Th surface layer contains at least 500MBq of 228 Th.
13. The generator of claim 1 , wherein the 228 Th surface layer contains at least 1000MBq of 228 Th.
14. The generator of claim 1 , wherein the 228 Th surface layer contains a quantity of 228 Th sufficient to produce at least 200 MBq of 212 Pb in a 24 hour period of time.
15. The generator of claim 1 , wherein the substrate has a substantially planar surface on which the 228 Th surface layer is disposed.
16. A 228 Th-based generator for producing 212 Pb, comprising:
a tantalum oxide substrate having an atomic lattice and including an immobilized 228 Th surface layer containing at least 200 MBq of 228 Th, wherein at least a portion of 228 Th atoms from the 228 Th surface layer have exchanged into the atomic lattice of the tantalum oxide substrate; and
a chamber comprising a collection surface, wherein the chamber is configured to house the tantalum oxide substrate in the chamber such that the 228 Th surface layer of the tantalum oxide substrate is in gaseous communication with the collection surface;
wherein:
the 228 Th surface layer permits emanation of gaseous 220 Rn produced by radioactive decay of 228 Th in the immobilized 228 Th surface layer into the chamber;
212 Pb produced by radioactive decay of the gaseous 220 Rn in the chamber collects on the collection surface; and
the emanating gaseous 220 Rn contains less than 0.1% 228 Th as a contaminant and/or the 212 Pb contains less than 0.1% 228 Th as a contaminant.