Patent Application

App. No. 18/618,823

Abstract

Claims (60)

1 . A power module comprising:

a power substrate;

at least one first power device arranged on the power substrate;

at least one second power device arranged on the power substrate;

at least one true Kelvin interconnection; and

at least one pseudo-Kelvin interconnection.

2 . The power module according to claim 1 ,

wherein the at least one first power device is connected to the at least one true Kelvin interconnection; and

wherein the at least one second power device is connected to the at least one pseudo-Kelvin interconnection.

3 . The power module according to claim 1 , further comprising a source Kelvin terminal.

4 . The power module according to claim 3 , wherein the at least one true Kelvin interconnection connects the at least one first power device to the source Kelvin terminal.

5 . (canceled)

6 . The power module according to claim 3 , wherein the at least one true Kelvin interconnection connects a source Kelvin pad of the at least one first power device to the source Kelvin terminal.

7 . The power module according to claim 3 ,

wherein the source Kelvin terminal is connected to a signal trace; and

wherein the at least one true Kelvin interconnection is wire bonded to the signal trace.

8 . The power module according to claim 1 , wherein the at least one true Kelvin interconnection is configured to be electrically isolated from a power loop of the power module.

9 . The power module according to claim 1 , wherein the at least one true Kelvin interconnection is configured to be electrically isolated from a power loop of the power module such that a current flow of the power loop does not flow through the at least one true Kelvin interconnection.

10 . The power module according to claim 1 , wherein the at least one pseudo-Kelvin interconnection connects the at least one second power device through the at least one true Kelvin interconnection.

11 . (canceled)

12 . (canceled)

13 . The power module according to claim 1 , wherein the at least one pseudo-Kelvin interconnection is configured as part of a power loop of the power module such that a current flow of the power loop also flows through at least a portion the at least one pseudo-Kelvin interconnection.

14 . The power module according to claim 1 , wherein the at least one first power device and the at least one second power device are implemented as paralleled power electronic devices in the power module.

15 . The power module according to claim 1 , wherein the at least one pseudo-Kelvin interconnection shares a partial path with a power loop of the at least one first power device and/or the at least one second power device.

16 . The power module according to claim 1 , wherein the at least one true Kelvin interconnection is configured such that there is no shared path through a power loop of the power module.

17 . The power module according to claim 1 , wherein the at least one pseudo-Kelvin interconnection is configured such that there is a shared path through a power loop of the power module.

18 . The power module according to claim 1 , wherein the at least one pseudo-Kelvin interconnection is configured to operate with a signal current flow in one direction and a power flow in a direction orthogonal to the signal current flow.

19 . The power module according to claim 1 , wherein the at least one first power device is configured with the at least one true Kelvin interconnection and the at least one first power device is arranged on an edge of the power substrate.

20 . The power module according to claim 1 , wherein the at least one true Kelvin interconnection is configured as a true source Kelvin interconnection to at least one source pad on the at least one first power device; and wherein the at least one true Kelvin interconnection comprises one or more wire bonds, ribbons, laminate overlays, and/or direct attaches.

21 . The power module according to claim 1 ,

wherein the at least one true Kelvin interconnection is configured as a true source Kelvin interconnection to at least one source pad on the at least one first power device; and

wherein the at least one true Kelvin interconnection comprises one or more wire bonds, and/or one or more wire bonds and signal traces.

22 . The power module according to claim 1 , wherein the at least one pseudo-Kelvin interconnection is configured as a partial or pseudo Kelvin interconnection to source pads on the at least one second power device through one or more wire bonds, ribbons, laminate overlays, and/or direct attaches.

23 . The power module according to claim 1 , wherein the at least one pseudo-Kelvin interconnection is connected to the at least one true Kelvin interconnection.

24 . The power module according to claim 1 , wherein the at least one pseudo-Kelvin interconnection is connected to the at least one true Kelvin interconnection through one or more wire bonds between the at least one first power device and the at least one second power device.

25 . The power module according to claim 1 , wherein the at least one pseudo-Kelvin interconnection comprises one or more wire bonds connecting between different implementations of the at least one second power device.

26 . The power module according to claim 1 , wherein the at least one pseudo-Kelvin interconnection comprises one or more stitched wire bonds connecting between different implementations of the at least one second power device.

27 . The power module according to claim 1 , wherein the at least one pseudo-Kelvin interconnection is connected to the at least one true Kelvin interconnection through one or more clips between the at least one first power device and the at least one second power device.

28 . The power module according to claim 1 , wherein the at least one pseudo-Kelvin interconnection is connected to the at least one true Kelvin interconnection through one or more clips between different implementations of the at least one second power device.

29 . The power module according to claim 1 , wherein the at least one pseudo-Kelvin interconnection is connected to the at least one true Kelvin interconnection through one or more jumpers between the at least one first power device and the at least one second power device.

30 . The power module according to claim 1 , wherein the at least one pseudo-Kelvin interconnection is connected to the at least one true Kelvin interconnection through one or more jumpers between different implementations of the at least one second power device.

31 . The power module according to claim 1 , further comprising a mixed Kelvin configuration that comprises: the at least one pseudo-Kelvin interconnection that includes a shared power path through one or more source clip attaches, jumper wire bonds, and/or daisy chained wire bonds; and the at least one true Kelvin interconnection that comprises one or more wire bonds, ribbons, laminate overlays, and/or direct attaches configured separate from a power path.

32 . (canceled)

33 . The power module according to claim 1 , wherein the at least one first power device and/or the at least one second power device comprise a MOSFET with a gate pad, at least one source pad, and a drain pad.

34 .- 46 . (canceled)

47 . A power module comprising:

at least one first power device;

at least one second power device;

at least one true Kelvin interconnection; and

at least one pseudo-Kelvin interconnection,

wherein the at least one pseudo-Kelvin interconnection is connected to the at least one true Kelvin interconnection.

48 .- 91 . (canceled)

92 . A power module comprising:

at least one first power device;

at least one second power device;

at least one true Kelvin interconnection; and

at least one pseudo-Kelvin interconnection,

wherein the at least one first power device is connected to the at least one true Kelvin interconnection; and

wherein the at least one second power device is connected to the at least one pseudo-Kelvin interconnection.

93 .- 272 . (canceled)

Assignments (8)