Bipolar transistor
The present disclosure relates to semiconductor structures and, more particularly, to a bipolar transistor and methods of manufacture. The structure includes: a collector region; an extrinsic base comprising an emitter opening with an angled sidewall; an emitter within the emitter opening; and an intrinsic base between the emitter and the collector.
1. A structure comprising:
a collector region;
an extrinsic base comprising an emitter opening with an angled sidewall;
an emitter within the emitter opening; and
an intrinsic base between the emitter and the collector,
wherein the extrinsic base comprises a single crystalline semiconductor material and the angled sidewall extends along an angled crystal plane facet of the single crystalline semiconductor material of the extrinsic base.
2. The structure of claim 1 , wherein the single crystalline semiconductor material comprises SiGe.
3. The structure of claim 1 , wherein the angled sidewall terminates at a material that is selective to the extrinsic base.
4. A structure comprising:
a collector region;
an extrinsic base comprising an emitter opening with an angled sidewall;
an emitter within the emitter opening; and
an intrinsic base between the emitter and the collector,
wherein the extrinsic base comprises a single crystalline semiconductor material and the emitter is within the emitter opening extending into the extrinsic base, with the emitter opening comprising the angled sidewall and a vertical sidewall above the angled sidewall.
5. The structure of claim 4 , wherein the vertical sidewall comprises a sidewall spacer material.
6. The structure of claim 5 , further comprising insulator material on the angled sidewall of the extrinsic base.
7. The structure of claim 6 , wherein the insulator material comprises oxide material and nitride material extending over the sidewall spacer material.
8. The structure of claim 6 , wherein the insulator material is symmetrical within an opening of the extrinsic base.
9. The structure of claim 5 , wherein the emitter extends over an upper surface of the sidewall spacer material.
10. A structure comprises:
a collector region;
an intrinsic base region above the collector region;
an extrinsic base above the intrinsic base region, the extrinsic base comprising an emitter opening with a vertical sidewall and an angled sidewall;
an emitter within the emitter opening; and
insulator material on the angled sidewall which isolates the extrinsic base from the emitter,
wherein the extrinsic base comprises a single crystalline semiconductor material and the angled sidewall extends along an angled crystal plane facet of the single crystalline semiconductor material.
11. The structure of claim 10 , wherein the vertical sidewall comprises a sidewall spacer material and the angled sidewall is covered with the insulator material.
12. The structure of claim 10 , wherein the angled sidewall terminates at a semiconductor material that is selective to the extrinsic base.
13. The structure of claim 10 , wherein the sidewall spacer material is angled and borders at a junction between the extrinsic base and the emitter.
14. A structure comprises:
a collector region;
an intrinsic base region above the collector region;
an extrinsic base above the intrinsic base region, the extrinsic base comprising an emitter opening with a vertical sidewall and an angled sidewall;
an emitter within the emitter opening; and
insulator material on the angled sidewall which isolates the extrinsic base from the emitter,
wherein the vertical sidewall comprises a sidewall spacer material and the angled sidewall is covered with the insulator material and the sidewall spacer material comprises oxide material and nitride material over the oxide material, the oxide material extending to underneath the nitride material.
15. A structure comprises:
a collector region;
an intrinsic base region above the collector region;
an extrinsic base above the intrinsic base region, the extrinsic base comprising an emitter opening with a vertical sidewall and an angled sidewall;
an emitter within the emitter opening; and
insulator material on the angled sidewall which isolates the extrinsic base from the emitter,
wherein the vertical sidewall comprises a sidewall spacer material and the angled sidewall is covered with the insulator material and the sidewall spacer material is symmetrical within the emitter opening.
16. A structure comprises:
a collector region;
an intrinsic base region above the collector region;
an extrinsic base above the intrinsic base region, the extrinsic base comprising an emitter opening with a vertical sidewall and an angled sidewall;
an emitter within the emitter opening; and
insulator material on the angled sidewall which isolates the extrinsic base from the emitter,
wherein the vertical sidewall comprises a sidewall spacer material and the angled sidewall is covered with the insulator material and the sidewall emitter extends over an upper surface of the sidewall spacer material.
17. A method comprising:
forming a collector region;
forming an extrinsic base with an emitter opening comprising an angled sidewall;
forming an emitter within the emitter opening; and
forming an intrinsic base between the emitter and the collector,
wherein the extrinsic base comprises a single crystalline semiconductor material and the angled sidewall extends along an angled crystal plane facet of the single crystalline semiconductor material of the extrinsic base.