Laser-based surface processing for semiconductor workpiece
Systems and methods for laser-based surface processing operations on a wide bandgap semiconductor wafer, such as a silicon carbide semiconductor wafer, are provided. In one example, a method includes removing a wide bandgap semiconductor wafer from a boule using a removal process. The method includes ablating, with one or more lasers, an exposed surface resulting from the removal process to remove material from the exposed surface, wherein ablating, with one or more lasers, the exposed surface reduces a thickness of semiconductor material (e.g., by about 25 microns or greater).
1. A method, comprising:
removing a wide bandgap semiconductor wafer from a boule using a removal process;
ablating, with one or more lasers, an exposed surface resulting from the removal process to remove material from the exposed surface such that the exposed surface has a surface roughness in a range of about 0.5 nanometers to about 65 microns, wherein ablating, with one or more lasers, the exposed surface reduces a thickness of semiconductor material by about 25 microns or greater.
2. The method of claim 1 , wherein the exposed surface is a surface of the wide bandgap semiconductor wafer or is a surface of the boule.
3. The method of claim 1 , wherein the removal process comprises:
inducing a subsurface laser damage region in the boule; and
separating the wide bandgap semiconductor wafer from the boule along the subsurface laser damage region.
4. The method of claim 3 , wherein after ablating, with one or more lasers, the exposed surface of the boule, the method comprises removing a second wide bandgap semiconductor wafer from the boule using the removal process.
5. The method of claim 1 , wherein ablating, with one or more lasers, an exposed surface comprises implementing a coarse laser ablation process with the one or more lasers, wherein the coarse laser ablation process removes material from the exposed surface such that the exposed surface has a surface roughness in a range of about 20 nanometers to about 65 microns.
6. The method of claim 5 , wherein the coarse laser ablation process reduces the thickness of semiconductor material by about 25 microns to about 500 microns.
7. The method of claim 5 , wherein ablating, with one or more lasers, an exposed surface comprises implementing a fine laser ablation process, wherein the fine laser ablation process removes material from the exposed surface such that the exposed surface has a surface roughness in a range of about 0.5 nanometer to about 180 nanometers.
8. The method of claim 7 , wherein the fine laser ablation process reduces the thickness of semiconductor material by about 0.1 micron to about 50 microns.
9. The method of claim 7 , wherein the coarse laser ablation process is implemented using a first laser and the fine laser ablation process is implemented using a second laser.
10. The method of claim 9 , wherein the first laser has a longer wavelength relative to the second laser.
11. The method of claim 10 , wherein the first laser is an infrared laser and the second laser is an ultraviolet laser.
12. The method of claim 1 , wherein ablating, by the one or more lasers, the exposed surface comprises ablating, by the one or more lasers, the exposed surface with one or more lasers having a laser pulse energy in a range of about 10 nanojoules to about 200 millijoules.
13. The method of claim 1 , wherein the wide bandgap semiconductor wafer comprises silicon carbide or a Group III-nitride.
14. A method, comprising:
removing a wide bandgap semiconductor wafer from a boule using a removal process;
ablating, with one or more lasers, an exposed surface resulting from the removal process to remove material from the exposed surface, wherein ablating, with one or more lasers, the exposed surface reduces a thickness of semiconductor material by about 25 microns or greater;
wherein the ablating, by the one or more lasers, the exposed surface comprises:
obtaining data indicative of a workpiece property;
determining one or more laser parameters based on the data indicative of the workpiece property; and
ablating, with the one or more lasers, the exposed surface based at least in part on the one or more laser parameters.
15. The method of claim 14 , wherein the data indicative of the workpiece property comprises a surface topography of at least a portion the exposed surface.
16. The method of claim 14 , wherein the data indicative of the workpiece property is obtained from an optical sensor or one or more surface measurement lasers.
17. The method of claim 14 , wherein the data indicative of the workpiece property comprises an image.
18. The method of claim 14 , wherein the one or more laser parameters comprise one or more of laser power, laser pulse frequency, laser wavelength, laser pulse duration, focusing depth, laser pulse energy, laser scan pattern, or translation speed.
19. The method of claim 14 , wherein the one or more laser parameters are specified as a function of position on the exposed surface.
20. The method of claim 14 , wherein the data indicative of the workpiece property comprises an optical property.
21. A method, comprising:
removing a wide bandgap semiconductor wafer from a boule using a removal process;
ablating, with one or more lasers, an exposed surface resulting from the removal process to remove material from the exposed surface, wherein ablating, with one or more lasers, the exposed surface reduces a thickness of semiconductor material by about 25 microns or greater;
wherein ablating, with one or more lasers, comprises setting a focal depth of the one or more lasers to a focal depth within about 1000 microns or less beneath a peak height of the exposed surface.