Methods and heat distribution devices for thermal management of chip assemblies
A method of manufacturing a chip assembly comprises joining an in-process unit to a printed circuit board; reflowing a bonding material disposed between and electrically connecting the in-process unit with the printed circuit board, the bonding material having a first reflow temperature; and then joining a heat distribution device to the plurality of semiconductor chips using a thermal interface material (“TIM”) having a second reflow temperature that is lower than the first reflow temperature. The in-process unit further comprises a substrate having an active surface, a passive surface, and contacts exposed at the active surface; an interposer electrically connected to the substrate; a plurality of semiconductor chips overlying the substrate and electrically connected to the substrate through the interposer, and a stiffener overlying the substrate and having an aperture extending therethrough, the plurality of semiconductor chips being positioned within the aperture.
1. A method of assembling a cooling loop assembly to an in-process unit comprising:
joining a plurality of in-process units to a circuit board, each in-process unit including:
a substrate; and
at least one microelectronic element electrically connected to the substrate, the microelectronic element having an active front surface facing toward the substrate and an opposed rear surface facing away from the substrate;
joining a corresponding plurality of heat distribution devices to the plurality of in-process units, each of the corresponding plurality of heat distribution devices including an inlet and an outlet; and
bonding a cooling loop assembly to the inlet and outlet of each of the plurality of heat distribution devices, the cooling loop assembly including a network of fluid lines connected to each inlet and each outlet.
2. The method of claim 1 , wherein the corresponding plurality of heat distribution devices are joined to the plurality of in-process units prior to the bonding of the cooling loop assembly to each of the heat distribution devices.
3. The method of claim 1 , wherein each of the corresponding plurality of heat distribution devices comprises a base and a lid, the method further comprising joining the base of each of the corresponding plurality of heat distribution devices to the corresponding one of the plurality of in-process units prior to joining the lid of each of the corresponding plurality of heat distribution devices to the base and prior to the bonding of the cooling loop assembly.
4. The method of claim 1 , wherein each of the corresponding plurality of heat distribution devices includes a base and a lid, the method further comprising attaching a bottom surface of the base of each of the corresponding plurality of heat distribution devices to a rear surface of the at least one microelectronic element of each of the plurality of in-process units.
5. The method of claim 3 , wherein the plurality of in-process units each further include a stiffener overlying the substrate and extending around at least a portion of the at least one microelectronic element of each of the plurality of in-process units, and wherein the joining of each of the corresponding plurality of heat distribution devices comprises joining a bottom surface of the base of the heat distribution device to the stiffener.
6. The method of claim 1 , wherein each of the corresponding plurality of heat distribution devices includes a base and a lid, wherein the respective inlets and outlets of each of the heat distribution devices extend from the lid, and wherein prior to joining the lid to the base, the cooling loop assembly is joined to the inlet and outlet of each corresponding heat distribution device.
7. The method of claim 1 , wherein the at least one microelectronic element of at least one in-process unit of the plurality of in-process units comprises a plurality of microelectronic elements, and wherein at least one of the plurality of microelectronic elements has been thinned so as to have a different height than at least one other of the plurality of microelectronic elements, and wherein a shape of each of the corresponding plurality of heat distribution devices is configured to accommodate the different height of the thinned microelectronic element.