Semiconductor device including detection electrodes applicable for a touch sensor
A sealing member containing conductive particles and disposed in a seal region is formed between a display panel and a touch panel. A laminated structure formed on the display panel includes a first detection lines. The first detection lines extend from the seal region to a connection region and are connected through the conductive particles to terminals of second detection lines formed on the touch panel. A peripheral edge of the organic barrier is located inward from the conductive particles of the sealing member. The above described structure can facilitate a work for connecting external lines such as FPC to the display panel and the touch panel. Further, the structure can secure stability of electrical connection between the external lines and the touch panel.
1. A semiconductor device comprising:
a substrate including an insulator and a plurality of detection electrodes;
a terminal on the substrate, the terminal located along an edge of the substrate;
a first detection line electrically connected to the terminal; and
a second detection line electrically connected to one of the plurality of detection electrodes, wherein
the insulator overlaps with at least one of the plurality of detection electrodes in a planar view,
the first detection line and the second detection line are electrically connected with each other at a contact portion,
the contact portion is located between the plurality of detection electrodes and an edge of the insulator in the planar view, and
the substrate is configured to be folded back between the contact portion and the terminal.
2. The semiconductor device according to claim 1 , wherein
the insulator comprises multiple layers stacked each other.
3. The semiconductor device according to claim 2 , wherein the multiple layers comprise:
a first inorganic insulating layer;
a second inorganic insulating layer; and
an organic insulating layer between the first inorganic insulating layer and the second inorganic insulating layer, wherein
an edge of the organic insulating layer is located between the plurality of detection electrodes and an edge of the first inorganic insulating layer in the planar view,
the edge of the first inorganic insulating layer is located between the edge of the organic insulating layer and the edge of the substrate in the planar view,
the second inorganic insulating layer is in contact with the first inorganic insulating layer outside the edge of the organic insulating layer, and
the contact portion is located between the edge of the organic insulating layer and the edge of the second inorganic insulating layer in the planar view.
4. The semiconductor device according to claim 3 , wherein
the substrate is configured to be folded back between the edge of the organic insulating layer and the terminal.
5. The semiconductor device according to claim 3 , wherein
the substrate is configured to be folded back between the edge of the first inorganic insulating layer and the terminal.
6. The semiconductor device according to claim 1 , wherein
the terminal is at an opposite side of the plurality of detection electrodes.
7. A semiconductor device comprising:
a substrate including a plurality of detection electrodes;
a terminal on the substrate, the terminal located along an edge of the substrate;
a first detection line electrically connected to the terminal;
a second detection line electrically connected to one of the plurality of detection electrodes; and
a sealing layer between the first detection line and the second detection line, wherein
the first detection line and the second detection line are electrically connected with each other at a contact portion,
the sealing layer overlaps with the contact portion in a planar view, and
the substrate is configured to be folded back between the contact portion and the terminal.
8. The semiconductor device according to claim 7 , wherein
the sealing layer surrounds the plurality of detection electrodes in the planar view.
9. The semiconductor device according to claim 7 , wherein
the substrate is configured to be folded back between the sealing layer and the terminal.
10. The semiconductor device according to claim 7 , wherein
the substrate is configured to be folded back between the edge of the second detection line and the terminal.
11. The semiconductor device according to claim 7 , wherein
the terminal is at an opposite side of the plurality of detection electrodes.
12. A semiconductor device comprising:
a substrate including a plurality of detection electrodes;
a terminal on the substrate, the terminal located along an edge of the substrate;
a first detection line electrically connected to the terminal; and
a second detection line electrically connected to one of the plurality of detection electrodes, wherein
the first detection line and the second detection line are electrically connected with each other at a contact portion,
a sealing layer is provided between the first detection line and the second detection line at the contact portion,
the sealing layer overlaps with the contact portion in a planar view, and
the substrate is configured to be folded back between the contact portion and the terminal.
13. The semiconductor device according to claim 12 , wherein
the sealing layer surrounds the plurality of detection electrodes in the planar view.
14. The semiconductor device according to claim 12 , wherein
the substrate is configured to be folded back between the sealing layer and the terminal.
15. The semiconductor device according to claim 12 , wherein
the substrate is configured to be folded back between the edge of the second detection line and the terminal.
16. The semiconductor device according to claim 12 , wherein
the terminal is at an opposite side of the plurality of detection electrodes.