SEMICONDUCTOR DEVICES HAVING METAL GATE RUNNERS WITH ASYMMETRIC OUTER GATE RUNNERS, UNEVENLY-SPACED INNER GATE RUNNERS AND/OR SPINE-RIB INNER GATE RUNNERS WITH MULTIPLE RIBS
Semiconductor devices comprise a semiconductor layer structure having an active region therein, a gate pad on the semiconductor layer structure and positioned to be closest to a first side of the active region, a plurality of gate electrodes, and a metal gate runner that electrically connects the gate pad to at least some of the gate electrodes. The metal gate runner comprises an outer runner that extends around a portion of a periphery of the active region. The outer gate runner comprises a first outer segment that extends along at least a portion of the first side of the active region and a second outer segment that extends along at least a portion of a second side of the active region that connects to the first side, but the outer gate runner does not extend along a third side of the active region that is opposite the second side.
1 . A semiconductor device, comprising:
a semiconductor layer structure having an active region therein;
a gate pad on the semiconductor layer structure, the gate pad positioned to be closest to a first side of the active region;
a plurality of gate electrodes; and
a metal gate runner that electrically connects the gate pad to at least some of the gate electrodes, the metal gate runner comprising an outer runner that extends around a portion of a periphery of the active region,
wherein, when the semiconductor device is viewed in plan view, the outer gate runner comprises a first outer segment that extends along at least a portion of the first side of the active region and a second outer segment that extends along at least a portion of a second side of the active region that connects to the first side, but the outer gate runner does not extend along a third side of the active region that is opposite the second side.
2 . The semiconductor device of claim 1 , wherein, when the semiconductor device is viewed in plan view, the outer gate runner does not extend along a portion of the first side of the active region that is in between the gate pad and the third side of the active region.
3 . (canceled)
4 . The semiconductor device of claim 1 , wherein the metal gate runner further comprises an inner gate runner that includes a plurality of inner segments that extend inwardly from the outer gate runner.
5 . The semiconductor device of claim 4 , wherein at least some of the inner segments extend at right angles from the second outer segment of the outer gate runner, and wherein the inner segments that extend from the second outer segment of the outer gate runner do not extend all the way to the third side of the active region.
6 . (canceled)
7 . The semiconductor device of claim 1 , wherein, when the semiconductor device is viewed in plan view, the outer gate runner does not extend along a fourth side of the active region that is opposite the first side of the active region, and wherein the metal gate runner further comprises an inner gate runner that includes a plurality of inner segments that extend inwardly from the outer gate runner.
8 . The semiconductor device of claim 7 , wherein, when the semiconductor device is viewed in plan view, a first distance between two adjacent ones of the inner segments is at least 1.1 times greater than a second distance between the fourth side of the active region and a one of the inner segments that is closest to the fourth side of the active region.
9 . (canceled)
10 . The semiconductor device of claim 7 , wherein, when the semiconductor device is viewed in plan view, a first distance between two adjacent ones of the inner segments is between 1.7 and 2.3 times a second distance between the fourth side of the active region and a one of the inner segments that is closest to the fourth side of the active region.
11 - 12 . (canceled)
13 . The semiconductor device of claim 1 , wherein the metal gate runner further comprises an inner gate runner that comprises a first inner segment that extends from the gate pad.
14 . The semiconductor device of claim 13 , wherein the first inner segment extends in parallel to the second outer segment.
15 - 16 . (canceled)
17 . A semiconductor device, comprising:
a semiconductor layer structure having an active region therein;
a gate pad on the semiconductor layer structure;
a plurality of gate electrodes; and
a metal gate runner that electrically connects the gate pad to at least some of the gate electrodes,
wherein the metal gate runner comprises an outer gate runner that partly surrounds the active region when the semiconductor device is viewed in plan view, where the outer gate runner only extends along first and second sides of the active region.
18 . The semiconductor device of claim 17 , wherein the first side of the active region connects to the second side of the active region.
19 . The semiconductor device of claim 18 , wherein the outer gate runner only includes a single outer segment that directly connects to the gate pad.
20 . The semiconductor device of claim 19 , wherein the gate pad is positioned to be closest to the first side of the active region, and the outer gate runner does not extend along a third side of the active region that is opposite the second side of the active region.
21 - 27 . (canceled)
28 . The semiconductor device of claim 19 , wherein the metal gate runner further comprises an inner gate runner that comprises a first inner segment that extends from the gate pad.
29 . The semiconductor device of claim 28 , wherein the first inner segment extends in parallel to the second outer segment.
30 . (canceled)
31 . A semiconductor device, comprising:
a semiconductor layer structure comprising an active region therein;
a gate pad on the semiconductor layer structure;
a plurality of gate electrodes; and
a metal gate runner that includes an outer gate runner that electrically connects the gate pad to at least some of the gate electrodes,
wherein the outer gate runner includes a plurality of outer segments and only a single one of the outer segments directly connects to the gate pad.
32 . The semiconductor device of claim 31 , wherein, the plurality of outer segments comprises a first outer segment that extends along at least a portion of the first side of the active region and a second outer segment that extends along at least a portion of a second side of the active region that connects to the first side, and the outer gate runner does not extend along a third side of the active region that is opposite the second side.
33 . The semiconductor device of claim 31 , wherein, when the semiconductor device is viewed in plan view, the outer gate runner does not extend along a fourth side of the active region that is opposite the first side of the active region.
34 . The semiconductor device of claim 33 , wherein the metal gate runner further comprises an inner gate runner that comprises a plurality of inner segments that extend from the outer gate runner.
35 - 36 . (canceled)
37 . The semiconductor device of claim 34 , wherein, when the semiconductor device is viewed in plan view, a first distance between two adjacent ones of the inner segments is between 1.7 and 2.3 times a second distance between the fourth side of the active region and a one of the inner segments that is closest to the fourth side of the active region.
38 - 72 . (canceled)