Package on package semiconductor device with integrated antenna and method therefor
A method of forming a package-on-package semiconductor device is provided. The method includes mounting an antenna sub-assembly on a first major side of a package substrate and a packaged RF semiconductor device on a second major side of the package substrate. The antenna sub-assembly includes an antenna substrate, an antenna substrate waveguide, and an antenna structure. The antenna substrate waveguide is aligned with a waveguide formed through the package substrate. The packaged RF semiconductor device includes a semiconductor die, an RDL formed over an active side of the first semiconductor die, and a signal launcher formed from a conductive layer of the RDL. The signal launcher is configured for propagation of an RF signal through the waveguide formed through the package substrate and the antenna substrate waveguide.
1 . A method comprising:
mounting an antenna sub-assembly on a first major side of a package substrate, the antenna sub-assembly comprising:
an antenna substrate;
an antenna substrate waveguide formed through a core portion of the antenna substrate, the antenna substrate waveguide aligned with a waveguide formed through the package substrate; and
an antenna structure aligned with the antenna substrate waveguide;
encapsulating with a first encapsulant at least a portion of the antenna sub-assembly and a portion of the first major side of the package substrate; and
mounting a packaged radio frequency (RF) semiconductor device on a second major side of the package substrate, the packaged RF semiconductor device comprising:
a first semiconductor die,
a second encapsulant encapsulating the first semiconductor die, and
a redistribution layer (RDL) formed over an active side of the first semiconductor die, a signal launcher formed from a conductive layer of the RDL and configured for propagation of an RF signal through the waveguide formed through the package substrate.
2 . The method of claim 1 , wherein the antenna substrate waveguide formed through the core portion of the antenna substrate is formed as an air-filled antenna substrate waveguide.
3 . The method of claim 1 , wherein sidewall surfaces of the antenna substrate waveguide are plated with a metal material to form a metal lining of the antenna substrate waveguide.
4 . The method of claim 1 , wherein a continuous waveguide path is formed between the signal launcher and the antenna structure by way of mounting the packaged RF semiconductor device and antenna sub-assembly on the package substrate.
5 . The method of claim 1 , wherein a die pad at the active side of the first semiconductor die is interconnected to the signal launcher by way of the RDL.
6 . The method of claim 1 , wherein the antenna sub-assembly is mounted on the first major side of the package substrate by way of a solder material.
7 . The method of claim 6 , wherein the solder material forms a continuous path around a perimeter of the antenna substrate waveguide and a perimeter of the waveguide at the first major side of the package substrate.
8 . The method of claim 1 , further comprising mounting a second semiconductor die on the first major side of the package substrate before encapsulating with the first encapsulant.
9 . The method of claim 8 , wherein the second semiconductor die is interconnected with the packaged RF semiconductor device by way of the substrate package.
10 . A semiconductor device comprising:
a package substrate including a waveguide formed through the package substrate;
an antenna sub-assembly mounted on a first major side of the package substrate, the antenna sub-assembly comprising:
an antenna substrate;
an antenna substrate waveguide formed through a core portion of the antenna substrate, the antenna substrate waveguide aligned with the waveguide formed through the package substrate; and
an antenna structure aligned with the antenna substrate waveguide; and
a packaged radio frequency (RF) semiconductor device mounted on a second major side of the package substrate, the packaged RF semiconductor device comprising:
a first semiconductor die,
a first encapsulant encapsulating the first semiconductor die, and
a redistribution layer (RDL) formed over an active side of the first semiconductor die, a signal launcher formed from a conductive layer of the RDL and configured for propagation of an RF signal through the waveguide formed through the package substrate.
11 . The semiconductor device of claim 10 , wherein the antenna sub-assembly is mounted on the first major side of the package substrate by way of a solder material, the solder material forming a continuous path around a perimeter of the antenna substrate waveguide at an interface formed between the antenna sub-assembly and the first major side of the package substrate.
12 . The semiconductor device of claim 10 , further comprising a second semiconductor die mounted on the first major side of the package substrate.
13 . The semiconductor device of claim 10 , further comprising a second encapsulant encapsulating at least a portion of the antenna sub-assembly at the first major side of the package substrate.
14 . The semiconductor device of claim 10 , wherein the antenna structure of the antenna sub-assembly is configured as a slot antenna.
15 . The semiconductor device of claim 10 , wherein the packaged RF semiconductor device further comprises a conductive lined cavity formed in the encapsulant, the conductive lined cavity configured as a signal reflector of the signal launcher.
16 . A method comprising:
mounting an antenna sub-assembly on a first major side of a package substrate, the antenna sub-assembly comprising:
an antenna substrate;
an antenna substrate waveguide formed through a core portion of the antenna substrate, the antenna substrate waveguide aligned with a waveguide formed through the package substrate; and
an antenna structure aligned with the antenna substrate waveguide; and
mounting a packaged radio frequency (RF) semiconductor device on a second major side of the package substrate, the packaged RF semiconductor device comprising:
a first semiconductor die,
a first encapsulant encapsulating the first semiconductor die, and
a redistribution layer (RDL) formed over an active side of the first semiconductor die, a signal launcher formed from a conductive layer of the RDL and configured for propagation of an RF signal through the waveguide formed through the package substrate.
17 . The method of claim 16 , further comprising mounting a second semiconductor die on the first major side of the package substrate.
18 . The method of claim 17 , further comprising encapsulating with a second encapsulant at least a portion of the antenna sub-assembly and the second semiconductor die.
19 . The method of claim 16 , wherein the antenna substrate waveguide formed through the core portion of the antenna substrate is formed as an air-filled antenna substrate waveguide having a metal lining on sidewalls of the antenna substrate waveguide.
20 . The method of claim 16 , wherein a continuous waveguide path is formed between the signal launcher and the antenna structure after mounting the packaged RF semiconductor device and antenna sub-assembly on the package substrate.