Multi-die package structures including an interconnected package component disposed in a substrate cavity
A semiconductor device and a method of making the same are provided. A first die and a second die are placed over a carrier substrate. A first molding material is formed adjacent to the first die and the second die. A first redistribution layer is formed overlying the first molding material. A through via is formed over the first redistribution layer. A package component is on the first redistribution layer next to the copper pillar. The package component includes a second redistribution layer. The package component is positioned so that it overlies both the first die and the second die in part. A second molding material is formed adjacent to the package component and the first copper pillar. A third redistribution layer is formed overlying the second molding material. The second redistribution layer is placed on a substrate and bonded to the substrate.
1 . A semiconductor device, comprising:
a first die disposed on a first surface of a redistribution structure;
a second die positioned next to the first die and disposed on the first surface of the redistribution structure;
a package connected to a second surface of the redistribution structure, the package comprising a plurality of package dies and a plurality of package through vias, and the second surface being opposite to the first surface, wherein the first die and the second die each overlap the package and the package underlies in part each of the first and second dies;
a first molding material extending along sidewalls of the first and second dies;
a substrate having a cavity positioned underneath the package, wherein the package is disposed in the cavity; and
a first set of connectors connecting the first and second dies to the substrate.
2 . The semiconductor device of claim 1 wherein the cavity is a partial cavity.
3 . The semiconductor device of claim 1 further comprising a molding material formed between the redistribution layer and the first and second dies.
4 . The semiconductor device of claim 1 further comprising a second set of connectors disposed on a surface of the package opposite to another surface of the package that faces the first die and second die.
5 . The semiconductor device of claim 1 wherein the substrate further comprises one or more metal pads each attached to a corresponding connector of the first set of connectors.
6 . The semiconductor device of claim 1 wherein the substrate is a build-up laminate substrate comprising a plurality of layers.
7 . The semiconductor device of claim 1 further comprising a heat dissipation lid covering the first die, the second die and the package.
8 . The semiconductor device of claim 1 wherein the first set of connectors connect the first and second dies to the substrate through the redistribution structure.
9 . A semiconductor device, comprising:
a first die,
a second die spaced laterally apart from the first die;
a package component underlying in part each of the first die and the second die, the package component comprising a third die and one or more redistribution layers internal to the package component;
a substrate having a cavity positioned underneath the package component, wherein the package component is disposed in the cavity;
a first set of connectors connecting the first and second dies to the substrate; and
an interconnect structure connecting the package component to the first and second dies, the interconnect structure comprising a second set of connectors.
10 . The semiconductor device of claim 9 wherein a density of the first set of connectors is less than a density of the second set of connectors.
11 . The semiconductor device of claim 9 wherein the second set of connectors are microbumps and the first set of connectors are bumps.
12 . The semiconductor device of claim 11 wherein the bumps are larger than the microbumps.
13 . The semiconductor device of claim 9 further comprising a redistribution layer disposed over the package component and underlying the first and second dies.
14 . The semiconductor device of claim 13 further comprising a molding material formed between the redistribution layer and the first and second dies.
15 . The semiconductor device of claim 9 further comprising a third set of connectors disposed on a surface of the package component opposite to another surface of the package component that faces the first die and second die.
16 . The semiconductor device of claim 9 wherein the substrate further comprises one or more metal pads each attached to a corresponding connector of the first set of connectors.
17 . The semiconductor device of claim 9 wherein the substrate is a build-up laminate substrate comprising a plurality of layers.
18 . The semiconductor device of claim 9 further comprising a heat dissipation lid covering the first die, the second die and the package component.
19 . A semiconductor device, comprising:
a first die,
a second die spaced laterally apart from the first die;
a package component underlying in part the first die and the second die, the package component comprising a third die and one or more redistribution layers internal to the package component;
a substrate having a partial cavity positioned underneath the package component, wherein the package component is disposed in the partial cavity;
wherein the substrate is a build-up laminate substrate comprising a plurality of layers;
a first set of connectors connecting the first and second dies to the substrate; and
an interconnect structure connecting the package component to the first and second dies, the interconnect structure comprising a second set of connectors.
20 . The semiconductor device of claim 19 wherein the second set of connectors are microbumps and the first set of connectors are bumps.