TRENCH BASED SEMICONDUCTOR DEVICES WITH CONFORMAL SALICIDE THICKNESS
A semiconductor device includes a semiconductor layer including a trench, wherein the trench is adjacent a mesa, a first metal silicide layer on a top portion of the mesa, and a second metal silicide layer on a bottom portion of the trench. The first metal silicide layer has a thickness that is no more than about 1 to 1.5 times greater than a thickness of the second metal silicide layer. Related methods of forming a semiconductor device are disclosed.
1 . A method of forming a semiconductor device, comprising:
forming a trench in a semiconductor layer, wherein the trench is adjacent a mesa and the semiconductor layer comprises silicon;
depositing metal on the semiconductor layer, wherein the metal forms a first metal layer on a top portion of the mesa and a second metal layer on a bottom portion of the trench;
annealing the semiconductor layer so that the first metal layer and the second metal layer form a respective first metal silicide layer on the top portion of the mesa and a second metal silicide layer on the bottom portion of the trench, wherein annealing the semiconductor layer is performed for an anneal time and/or at an anneal temperature that are selected so that the second metal layer is fully silicided during the annealing while the first metal layer is only partially silicided during the annealing; and
removing un-silicided portions of the first metal layer.
2 . The method of claim 1 , wherein the metal comprises nickel and the semiconductor layer comprises silicon carbide.
3 . The method of claim 2 , wherein the first metal layer has a thickness as deposited of about 100 nm or greater and the second metal layer has a thickness as deposited of about 50 nm or less.
4 . The method of claim 2 , wherein the first metal layer has a thickness as deposited of about two or more times greater than a thickness of the second metal layer as deposited.
5 . The method of claim 2 , wherein the first metal silicide layer has a thickness of about 100 nm or greater and the second metal silicide layer has a thickness of about 100 nm or less.
6 . The method of claim 2 , wherein the first metal silicide layer has a first thickness that is less than about 2 times a second thickness of the second metal silicide layer.
7 . The method of claim 6 , wherein the first thickness is about 1 to 1.5 times greater than the second thickness.
8 . The method of claim 2 , wherein the first metal silicide layer has a first thickness of less than about twice a second thickness of the first metal layer.
9 . The method of claim 1 , wherein the trench has an aspect ratio of about 1.5:1 or greater.
10 . The method of claim 2 , wherein annealing the semiconductor layer is performed at an anneal temperature of less than 650′C.
11 . The method of claim 2 , wherein annealing the semiconductor layer is performed at an anneal time of less than 150 seconds.
12 . A semiconductor device, comprising:
a semiconductor layer comprising a trench, wherein the trench is adjacent a mesa;
a first metal silicide layer on a top portion of the mesa; and
a second metal silicide layer on a bottom portion of the trench;
wherein the first metal silicide layer has a thickness that is less than about 2 times a thickness of the second metal silicide layer.
13 . The semiconductor device of claim 12 , wherein first metal silicide has a thickness that is about 1 to 1.5 times greater than the thickness of the second metal layer.
14 . The semiconductor device of claim 12 , wherein the metal comprises nickel and the semiconductor layer comprises silicon carbide.
15 . The semiconductor device of claim 12 , wherein the first metal layer has a thickness as deposited of about 100 nm or greater and the second metal layer has a thickness as deposited of about 50 nm or less.
16 . The semiconductor device of claim 12 , wherein the first metal layer has a thickness as deposited of about two or more times greater than a thickness of the second metal layer as deposited.
17 . The semiconductor device of claim 12 , wherein the first metal silicide layer has a thickness or about 100 nm or greater and the second metal silicide layer has a thickness of about 100 nm or less.
18 . The semiconductor device of claim 12 , wherein the first metal silicide layer has a thickness of less than about twice a thickness of the first metal layer.
19 . The semiconductor device of claim 12 , wherein the trench has an aspect ratio of about 1.5:1 or greater.
20 . A method of forming a semiconductor device, comprising:
forming a trench in a semiconductor layer, wherein the trench is adjacent a mesa and the semiconductor layer comprises silicon;
depositing metal on the semiconductor layer, wherein the metal forms a first metal layer on a top portion of the mesa and a second metal layer on a bottom portion of the trench;
partially siliciding the first metal layer while fully siliciding the second metal layer to form a first metal silicide layer on the top portion of the mesa and a second metal silicide layer on the bottom portion of the trench; and
removing un-silicided portions of the first metal layer.
21 . The method of claim 20 , wherein partially siliciding the first metal layer while fully siliciding the second metal layer comprises annealing the semiconductor layer for an anneal time and/or at an anneal temperature that are selected so that the second metal layer is fully silicided during the annealing while the first metal layer is only partially silicided during the annealing.
22 . The method of claim 20 , wherein the metal comprises nickel and the semiconductor layer comprises silicon carbide.