IP Library › Granted Patent US 12,721,237
Granted Patent B2
US 12,721,237 · App. 19/285,679 · Granted Aug 25, 2026

Slicing micro-LED wafer and slicing micro-LED chip

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Quick Facts
Patent No.
US 12,721,237
App. No.
19/285,679
Granted
Aug 25, 2026
Kind
B2
Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 9, 2026
From: JADE BIRD DISPLAY (SHANGHAI) LIMITED
To: HUE INC.
Reel/Frame 075373/0207 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 30, 2025
From: XU, QUNCHAO; LI, QIMING
To: JADE BIRD DISPLAY (SHANGHAI) LIMITED
Reel/Frame 071882/0718 →
Continuity (4)
Continuation 18781945 · Jul 23, 2024
Continuation 18346325 · Jul 3, 2023
Continuation 17155518 · Jan 22, 2021
Related Publication 20250357439A1 · Nov 20, 2025
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