Semiconductor device package

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Quick Facts

Patent No.: US 504,874
App. No.: 29/211,046
Granted: May 10, 2005
Kind: S1

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Claims (1)

We claim the ornamental design for a semiconductor device package, as shown and described.

Assignments (7)

RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 0087 Recorded Jun 22, 2023

From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT

To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION

Reel/Frame 064070/0001 →

CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 5859768 AND TO RECITE COLLATERAL AGENT ROLE OF RECEIVING PARTY IN THE SECURITY INTEREST PREVIOUSLY RECORDED ON REEL 038620 FRAME 0087. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Aug 25, 2016

From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT

Reel/Frame 039853/0001 →

RELEASE OF SECURITY INTEREST Recorded May 6, 2016

From: JPMORGAN CHASE BANK, N.A. (ON ITS BEHALF AND ON BEHALF OF ITS PREDECESSOR IN INTEREST, CHASE MANHATTAN BANK)

To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Reel/Frame 038632/0074 →

RELEASE OF SECURITY INTEREST Recorded May 6, 2016

From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT AND COLLATERAL AGENT

To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Reel/Frame 038631/0345 →

SECURITY INTEREST Recorded Apr 15, 2016