IP Library › Granted Patent US 1,056,861
Granted Patent S1
US 1,056,861 · App. 29/808,482 · Granted Jan 7, 2025

Power semiconductor module

Inventors: Yuki Nakano (Kyoto, JP); Kenji Yamamoto (Kyoto, JP); Yasunori Kutsuma (Kyoto, JP)
Assignee: ROHM CO., LTD.
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Quick Facts
Patent No.
US 1,056,861
App. No.
29/808,482
Granted
Jan 7, 2025
Kind
S1
Claims (1)

The ornamental design for a power semiconductor module, as shown and described.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 20, 2021
From: NAKANO, YUKI; YAMAMOTO, KENJI; KUTSUMA, YASUNORI
To: ROHM CO., LTD.
Reel/Frame 057534/0619 →
Priority Claims (2)
JP 2021-006000 D · Mar 23, 2021 · national
JP 2021-006001 D · Mar 23, 2021 · national
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