IP Library › Patent Application 60627637
Patent Application Provisional
App. No. 60/627,637 · Confirmation No. 9740

Double layer leadframe integrated circuit system

Inventors: Jason Lee, Geun Sik Kim
Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2004-11-12 TRNA Transmittal of New Application 1 View
2004-11-12 SPEC Specification 4 View
2004-11-12 WFEE Fee Worksheet (SB06) 1 View
2004-11-12 ADS Application Data Sheet 2 View
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Quick Facts
App. No.
60/627,637
Filed
2004-11-12