IP Library › Assignment 016995/0904
Patent Assignment
Reel/Frame 016995/0904

Assignment of Assignor's Interest

Recorded: 2006-01-10 Pages: 4
Assignors
LEE, JASON
Executed: 2006-01-03
KIM, GEUN SIK
Executed: 2006-01-03
Assignee
CHIPPAC, INC.
47400 KATO ROAD, FREMONT, CALIFORNIA, 94538
Covered Properties (2)
Semiconductor Package Having Double Layer Leadframe
Patent: 7,671,451 →
Application: 11/274,925 →
Publication: US 2006/0192274
Double layer leadframe integrated circuit system
Application: 60/627,637 →
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Merger and Change of Name Aug 6, 2015
From: CHIPPAC, INC.; STATS CHIPPAC, INC.
To: STATS CHIPPAC, INC.
Reel/Frame 036286/0612 →
Security Interest Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name Apr 7, 2016
From: STATS CHIPPAC LTD
To: STATS CHIPPAC PTE. LTE
Reel/Frame 038378/0200 →
Release of Security Interest Jun 4, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052844/0491 →