IP Library › Patent Application 60899783
Patent Application Provisional Small
App. No. 60/899,783 · Confirmation No. 8553

Low pressure injection molding encapsulation of high voltage circuitry and regulated output current and slope control

Provisional Application Expired
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2011-02-24 OA.POSTCARD A courtesy postcard sent by USPTO to users who opt-in for e-Office Action 1 View
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2007-03-08 APP.FILE.REC Filing Receipt 3 View
2007-02-06 TRNA Transmittal of New Application 3 View
2007-02-06 SPEC Specification 23 View
2007-02-06 CLM Claims 2 View
2007-02-06 ABST Abstract 1 View
2007-02-06 OATH Oath or Declaration filed 2 View
2007-02-06 DRW Drawings-only black and white line drawings 10 View
2007-02-06 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
App. No.
60/899,783
Filed
2007-02-06