IP Library › Patent Application 61113544
Patent Application Provisional Small
App. No. 61/113,544 · Confirmation No. 9400

Method of adding one or more layers of conductive traces and pads to the surface of a fully manufactured wafer including connection to all or a selected sub set of the pads on the die within the wafer

Inventor: Morgan T. Johnson
Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2009-01-14 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2009-01-02 PA.. Power of Attorney 2 View
2008-11-24 APP.FILE.REC Filing Receipt 3 View
2008-11-11 TR.PROV Provisional Cover Sheet (SB16) 3 View
2008-11-11 SPEC Specification 2 View
2008-11-11 CLM Claims 1 View
2008-11-11 ABST Abstract 1 View
2008-11-11 DRW Drawings-only black and white line drawings 11 View
2008-11-11 WFEE Fee Worksheet (SB06) 2 View
2008-11-11 N417 Electronic Filing System Acknowledgment Receipt 3 View
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Quick Facts
App. No.
61/113,544
Filed
2008-11-11