Patent Application
Provisional
App. No. 62/705,462
· Confirmation No. 4286
WIDE BANDGAP WAFER BACKSIDE CAPPED BY POLY-SIC
Applicant:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2020-07-06 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2020-06-29 | DRW |
Drawings-only black and white line drawings | — | View | |
| 2020-06-29 | SPEC |
Specification | — | View | |
| 2020-06-29 | CLM |
Claims | — | View | |
| 2020-06-29 | ABST |
Abstract | — | View | |
| 2020-06-29 | N417.PYMT |
Electronic Fee Payment | — | View | |
| 2020-06-29 | ADS |
Application Data Sheet | — | View | |
| 2020-06-29 | N417 |
Electronic Filing System Acknowledgment Receipt | — | View | |
| 2020-06-29 | SPEC |
Specification | — | View | |
| 2020-06-29 | SPEC |
Specification | — | View |
Inventors
Tetsuya YOSHIDA
Ashikaga-shi, JAPAN
Takumi HOSOYA
Oota-shi, JAPAN
Hideto SHIMOYOSHI
Kaizu-shi, JAPAN
Kazuhiro YAMAZAKI
Ojiya-shi, JAPAN
Attorneys & Agents of Record
Prosecution
- Customer No.
- 14912
- Docket No.
- ONS04082L01US
- Confirmation No.
- 4286
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL 053613, FRAME 0621
Recorded 2023-08-17
SECURITY INTEREST
Recorded 2020-08-27
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Quick Facts
- App. No.
- 62/705,462
- Filed
- 2020-06-29
External Links