One transistor DRAM cell structure and method for forming
A single transistor DRAM cell is formed in a SOI substrate so that the DRAM cells are formed in bodies that are electrically isolated from each other. Each cell has doped regions that act as source and drain contacts. Between the drain contact and the body is a region, which aids in impact ionization and thus electron/hole formation during programming that is the same conductivity type as the body but of a higher concentration than the body. Adjacent to the source contact and to the body is a region, which aids in diode current during erase, that is the same conductivity type as the source contact but of a lower concentration than the source contact.
1. A one-transistor dynamic random access memory (DRAM) cell comprising:
a transistor having a first drain/source region, a second drain/source region, a body region between the first and second drain/source regions, and a gate over the body region, wherein a doping concentration of a portion of the first drain/source region adjacent to the body region is different than a doping concentration of a portion of the second drain/source region adjacent to the body region.
2. The DRAM cell of claim 1 , wherein the portions of the first and second drain/source regions are located relatively near to the gate.
3. The DRAM cell of claim 1 , further comprising a halo region between the body region and the first drain/source region.
4. The DRAM cell of claim 3 wherein impact ionization is used to transfer charge to the body region for lowering a threshold voltage of the transistor to write a first state during a write operation of the DRAM cell.
5. The DRAM cell of claim 4 , wherein the first drain/source region is relatively heavily doped and the threshold voltage is lowered during the write operation in response to a high potential applied to the heavily doped drain/source region, a low potential to the second drain/source region, and a gate potential that is between the low and high potentials.
6. The DRAM cell of claim 3 , wherein a drain/source diode is used to remove charge from the body region to raise a threshold voltage of the transistor to write a second state during a write operation of the DRAM cell.
7. The DRAM cell of claim 6 , wherein the first drain/source region is relatively heavily doped and the threshold voltage is raised during a write operation in response to a high potential applied to the heavily doped drain/source region, a low potential to the second drain/source region, and a high gate potential.
8. The DRAM cell of claim 2 wherein the second drain/source region includes Germanium.
9. The DRAM cell of claim 1 , wherein the transistor is characterized as being a silicon-on-insulator (SOI) N-channel transistor.
10. A one-transistor dynamic random access memory (DRAM) cell comprising:
a transistor having a first drain/source region, a second drain/source region, a body region between the first and second drain/source regions, and a gate over the body region, wherein a doping concentration of an area of the body region directly adjacent to the first drain/source region has a different doping concentration than an area of the body region directly adjacent to the second drain/source region.
11. The DRAM cell of claim 10 , wherein the transistor is characterized as being a silicon-on-insulator (SOI) N-channel transistor.
12. The DRAM cell of claim 10 , wherein the area of the body region directly adjacent to the first drain/source region is a halo region.
13. The DRAM cell of claim 12 , further comprising an area located between the body region and the first drain/source region and under the halo that includes Germanium.
14. The DRAM cell of claim 10 wherein impact ionization is used to transfer charge to the body region for lowering a threshold voltage of the transistor to write a first state to the DRAM cell during a write operation.
15. The DRAM cell of claim 14 , wherein the first drain/source region is relatively heavily doped and the threshold voltage is lowered during the write operation in response to a high potential applied to the heavily doped drain/source region, a low potential to the second drain/source region, and a gate potential that is between the low and high potentials.
16. The DRAM cell of claim 10 , wherein a drain/source diode is used to remove charge from the body region to raise a threshold voltage of the transistor to write a second state during a write operation of the DRAM cell.
17. The DRAM cell of claim 16 , wherein the first drain/source region is relatively heavily doped and the threshold voltage is raised during a write operation in response to a high potential applied to the heavily doped drain/source region, a low potential to the second drain/source region, and a high gate potential.
18. A one-transistor dynamic random access memory (DRAM) cell comprising:
a transistor having a first drain/source region, a second drain/source region, a body region between the first and second drain/source regions, and a gate over the body region, wherein a doping concentration of a first area of the body region directly adjacent to the first drain/source region has a different doping concentration than a second area of the body region directly adjacent to the second drain/source region, and wherein a doping concentration of a portion of the first drain/source region adjacent to the body region is different than a doping concentration of a portion of the second drain/source region adjacent to the body region.
19. The DRAM cell of claim 18 , wherein the transistor is characterized as being a silicon-on-insulator (SOI) N-channel transistor.
20. The DRAM cell of claim 19 , wherein the area of the body region directly adjacent to the first drain/source region is a halo region.
21. The DRAM cell of claim 20 , further comprising an area located between the body region and the first drain/source region and under the halo that includes Germanium.
22. The DRAM cell of claim 18 wherein impact ionization is used to transfer charge to the body region for lowering a threshold voltage of the transistor to write a first state to the DRAM cell during a write operation.
23. The DRAM cell of claim 22 , wherein the first drain/source region is relatively heavily doped and the threshold voltage is lowered during the write operation in response to a high potential applied to the heavily doped drain/source region, a low potential to the second drain/source region, and a gate potential that is between the low and high potentials.
24. The DRAM cell of claim 18 , wherein a drain/source diode is used to remove charge from the body region to raise a threshold voltage of the transistor to write a second state during a write operation of the DRAM cell.
25. The DRAM cell of claim 24 , wherein the first drain/source region is relatively heavily doped and the threshold voltage is raised during a write operation in response to a high potential applied to the heavily doped drain/source region, a low potential to the second drain/source region, and a high gate potential.
26. A method for forming a one-transistor dynamic random access memory (DRAM) cell, comprising the steps of:
providing a silicon-on-insulator (SOI) semiconductor device having an insulator formed on a substrate and a semiconductor layer formed on the insulator;
forming a body region of the memory cell in the semiconductor layer;
forming a gate over the body region;
forming first and second drain/source regions in the semiconductor layer adjacent to, and on opposite sides of, the body region;
forming a halo region in the body region adjacent to the first drain/source region;
forming a heavily doped extension in the first drain/source region underlapping the gate; and forming a lightly doped extension in the second drain/source region underlapping the gate.
27. The method of claim 26 , wherein the body region is P-type and the first and second drain/source regions are N-type.
28. The method of claim 26 , wherein the halo region is P-type, the heavily doped extension is N-type, and the lightly doped extension is N-type.
29. A method for forming a one-transistor dynamic random access memory (DRAM) cell, comprising the steps of:
providing a silicon-on-insulator (SOI) semiconductor device having an insulator formed on a substrate and a semiconductor layer formed on the insulator;
forming a body region of the memory cell in the semiconductor layer;
forming a gate over the body region;
forming first and second drain/source regions in the semiconductor layer adjacent to, and on opposite sides of, the body region;
forming a first halo region in the body region adjacent to the first drain/source region and to the gate; and
forming a second halo region in the body region adjacent to the second drain/source region and to the insulator.
30. The method of claim 29 , further comprising a first lightly doped extension formed under the first halo region and adjacent to first drain/source region.
31. The method of claim 29 , further comprising a second lightly doped extension formed over the second halo region and adjacent to the second drain/source region.
32. A method for forming a one-transistor dynamic random access memory (DRAM) cell, comprising the steps of:
providing a silicon-on-insulator (SOI) semiconductor device having an insulator formed on a substrate and a semiconductor layer formed on the insulator, the semiconductor layer having a surface;
forming a body region of the memory cell in the semiconductor layer;
forming a gate over the body region on the surface of the semiconductor layer;
forming first and second drain/source regions in the semiconductor layer adjacent to, and on opposite sides of, the body region;
forming a halo region in the body region adjacent to the first drain/source region and to the gate;
heavily doping the first drain/source region; and
heavily doping a portion of the second drain/source region, the portion being near the surface of the semiconductor layer.