Contact probe and probe device
A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
1. A probe device comprising:
a film;
a plurality of wiring patterns formed on a first surface of the film, each wiring pattern having a front end portion projecting from the film to form contact pins;
a metal layer provided on a second surface of the film;
wherein said film comprises:
a contact probe main body including a plurality of the wiring patterns disposed as main wiring patterns; and
a contact probe branch portion which branches from the contact probe main body, integrally formed with the contact probe main body, and includes a plurality of the wiring patterns disposed as branch wiring patterns formed by dividing portions of the main wiring patterns.
2. The probe device recited in claim 1 , further comprising:
a wiring substrate having a plurality of substrate side wiring patterns respectively connected to middle portions of the main wiring patterns and the branch wiring patterns; and
support members for supporting respective front end portions of the main wiring patterns.
3. The probe device recited in claim 2 , wherein said wiring patterns comprise nickel.
4. The probe device recited in claim 3 , wherein said contact pins are coated with gold.
5. The probe device recited in claim 1 , further comprising:
a wiring substrate having a plurality of substrate side wiring patterns respectively connected to rear end portions of the main wiring patterns and the branch wiring patterns; and
support members for supporting respective front end portions of the main wiring patterns.
6. The probe device recited in claim 5 , wherein said wiring patterns comprise nickel.
7. The probe device recited in claim 6 , wherein said contact pins are coated with gold.
8. The probe device recited in claim 1 , wherein said wiring patterns comprise nickel.
9. The probe device recited in claim 1 , wherein said contact pins are coated with gold.