Wafer level package structure with a heat slug
A wafer level package structure and a method for packaging said wafer level package structure are described. The wafer level package structure at least comprises a die, a heat slug covering said die, a carrier for supporting said heat slug and said die, a plurality of wires electrically connecting said die and said carrier, and a mould compound encapsulating said die, said carrier, said heat slug and said wires. The method comprises the steps of: (a)providing a heat slug metal with a plurality of openings; (b)mounting said heat slug metal onto a wafer to dispose said openings on corresponding bonding pads of the wafer so as to expose said bonding pads; (c)sawing said combined heat slug metal and wafer into a plurality of die units; (d)attaching said die unit onto a carrier; (e)electrically connecting a plurality of wires to said die unit and said carrier; (f)encapsulating said wired die unit and said carrier. In the present invention, the heat slug metal and wafer can be sawed into a plurality of die units at the same time to improve the defect of the complicated process of individually sawing heat slug metal and wafer and individually combining heat slug metal and wafer in the conventional method.
1. A wafer level package structure, comprising:
a die unit having a die and a heat slug, said die having a plurality of bonding pads formed on an upper surface thereof, said heat slug covering said upper surface of said die, and said heat slug having a plurality of recessed portions formed corresponding to said bonding pads to uncover and expose said bonding pads of said die;
a carrier for supporting said die and said heat slug;
a plurality of wires to electrically connect said bonding pads of said die and said carrier, wherein one end of each said wire is within a recessed portion; and
a mould compound for encapsulating said die, said heat slug, said carrier and said wires.
2. The wafer level package structure claimed in claim 1 , wherein said carrier is a substrate.
3. The wafer level package structure claimed in claim 1 , wherein said is carrier is a lead frame.
4. The wafer level package structure claimed in claim 1 , wherein said wires are electrically connected said bonding pads and said carrier through said gaps.
5. The wafer level package structure claimed in claim 1 , wherein, said heat slug is exposed to the air.
6. A wafer level package structure, comprising:
a die unit having a die and a heat slug, said die having a plurality of bonding pads formed on an upper surface thereof, said heat slug covering said upper surface of said die, and said heat slug having a plurality of openings formed therein corresponding to said bonding pads to uncover and expose said bonding pads of said die;
a carrier for supporting said die and said heat slug;
a plurality of wires to electrically connect said bonding pads of said die;
a carrier for supporting said and said heat slug;
a plurality of wires to electrically connect said bonding pads of said die and said carrier, wherein one end said wire is within at least one of the openings; and
a mould compound for encapsulating said die, said heat slug, said carrier and said wires.
7. The wafer level package structure claimed in claim 6 , wherein said carrier is a substrate.
8. The wafer level package structure claimed in claim 6 , wherein said carrier is a lead frame.
9. The wafer level package structure claimed in claim 6 , wherein said wires are electrically connected said bonding pads and said carrier through said openings.