Method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner
In a system and a method according to the present invention, a sensor signal, such as a motor current signal, from a drive assembly of a pad conditioning system is used to control a CMP system to compensate for a change in the conditions of consumables, thereby enhancing process stability.
1. A system for chemical mechanical polishing, comprising:
a controllable polishing head configured to receive and hold in place a substrate;
a polishing pad mounted on a platen that is coupled to a first drive assembly;
a pad conditioning assembly coupled to a second drive assembly including an electric motor; and
a control unit operatively connected to said polishing head and said second drive assembly, the control unit being configured to receive a sensor signal from said electric motor and to control said polishing head on the basis of said sensor signal.
2. The system of claim 1 , wherein said sensor signal received from said electric motor is indicative of at least one of a revolution and a torque of said electric motor.
3. The system of claim 2 , wherein said control unit is configured to receive said sensor signal indicative of the revolution and the torque of said electric motor and to determine a control signal for said polishing head on the basis of said sensor signal of a plurality of previously processed substrates.
4. A method of operating a CMP system, comprising:
obtaining a sensor signal from an electric motor driving a pad conditioner of said CMP system while moving said pad conditioner relative to a polishing pad of said CMP system; and
adjusting at least one process parameter of said CMP system on the basis of said sensor signal for at least one substrate to be processed in said CMP system, wherein a plurality of substrates are processed in said CMP system with said at least one process parameter being adjusted only once.
5. The method of claim 4 , wherein said sensor signal is indicative of at least one of a revolution and a torque of said electric motor.
6. The method of claim 5 , wherein controlling said CMP system includes:
establishing reference data for said sensor signal on the basis of a plurality of processed substrates; and
using said sensor signal in combination with said reference data to adjust said at least one process parameter.
7. The method of claim 6 , wherein establishing said reference data includes determining a moving average of sensor signals obtained from a plurality of previously performed operations of said pad conditioner.
8. The method of claim 6 , further comprising obtaining information on a change of the condition of at least one consumable of said CMP system and adjusting said at least one process parameter on the basis of said information and said reference data.
9. The method of claim 5 , wherein said electric motor is controlled to have a substantially constant speed during the motion of said pad conditioner relative to the polishing pad.
10. The method of claim 9 , wherein a signal indicative of the motor current of said electric motor is used as said sensor signal.
11. The method of claim 4 , wherein controlling operation of said CMP system includes readjusting at least one of a down force exerted to a polishing head, a polish time and a relative speed between a substrate and the polishing pad on the basis of said sensor signal.
12. The method of claim 11 , wherein controlling operation of said CMP system includes re-adjusting a drive signal to said electric motor on the basis of said sensor signal to adjust a conditioning effect.
13. A method of operating a CMP system, comprising:
obtaining a sensor signal from an electric motor driving a pad conditioner of said CMP system while moving said pad conditioner relative to a polishing pad of said CMP system, wherein said sensor signal is indicative of at least one of a revolution and a torque of said electric motor;
adjusting at least one process parameter of said CMP system on the basis of said sensor signal for at least one substrate to be processed in said CMP system;
establishing reference data for said sensor signal on the basis of a plurality of processed substrates; and
using said sensor signal in combination with said reference data to adjust said at least one process parameter.
14. The method of claim 13 , wherein establishing said reference data includes determining a moving average of sensor signals obtained from a plurality of previously performed operations of said pad conditioner.
15. The method of claim 13 , further comprising obtaining information on a change of the condition of at least one consumable of said CMP system and adjusting said at least one process parameter on the basis of said information and said reference data.