Low temperature solder chip attach structure and process to produce a high temperature interconnection
View Patent ↗A solder interconnection uses preferably lead-rich solder balls for making a low temperature chip attachment directly to any of the higher levels of packaging substrate. After a solder ball has been formed using standard processes, a thin cap layer of preferably pure tin is deposited on a surface of the solder balls. An interconnecting eutectic alloy is formed upon reflow. Subsequent annealing causes tin to diffuse into the lead, or vice versa, and intermix, thereby raising the melting point temperature of the cap layer of the resulting assembly. This structure and process avoids secondary reflow problems during subsequent processing.
1. A process of capping a Pb-rich ball with at least one layer of low melting point metal, said process comprising the steps of:
(a) forming said Pb-rich ball on a substrate;
(b) placing a mask over said Pb-rich ball such that a portion of said Pb-rich ball is exposed;
(c) depositing at least one layer of a low melting point metal over said Pb-rich ball through said mask, such that at least a portion of said Pb-rich ball has a capping layer of said low melting point metal;
(d) heating said Pb-rich ball and said capping layer of said low melting point metal to form a eutectic alloy having a Pb-rich core and a cap region of said low melting point metal;
(e) annealing said eutectic alloy such that one of said low melting point metal from said cap region is diffused into said Pb-rich core and Pb from said Pb-rich core is diffused into low melting point metal from said cap region,
wherein the melting point of said low melting point metal is lower than the melting point of Pb.
2. The process of claim 1 , wherein said low melting point metal is Sn.
3. The process of claim 2 , wherein substantially all of the Sn is diffused into said Pb-rich core to form an assembly having a weight composition of about 97/3 Pb/Sn.
4. The process of claim 3 , wherein the step of annealing is performed at 150° C. for a time in the range between 4 and 5 hours.
5. The process of claim 1 , wherein said capping layer of said low melting point metal has a thickness of less than 10.2 μm (0.4 mils).