Method of closing an antifuse using laser energy
View Patent ↗A structure and method for providing an antifuse which is closed by laser energy with an electrostatic assist. Two or more metal segments are formed over a semiconductor structure with an air gap or a porous dielectric between the metal segments. Pulsed laser energy is applied to one or more of the metal segments while a voltage potential is applied between the metal segments to create an electrostatic field. The pulsed laser energy softens the metal segment, and the electrostatic field causes the metal segments to move into contact with each other. The electrostatic field reduces the amount of laser energy which must be applied to the semiconductor structure to close the antifuse.
1. A method of closing an antifuse comprising the steps of:
(a) providing an antifuse structure having at least two metal segments with a fuse gap between the metal segments, wherein the fuse gap is filled with a dielectric material selected from the group consisting of polyimide and porous silicate; and
(b) simultaneously applying pulsed laser energy to the metal segments and applying a voltage potential between the metal segments.
2. The method of claim 1 wherein each of the metal segments has an end facing and defining the fuse gap, at least one of the ends having a corner along the end facing the fuse gap, and wherein the metal segments soften upon application of the pulsed laser energy and move to form an electrical connection upon application of the voltage potential between the metal segments, the corner enhancing the electric field due to the potential gradient around the corner.
3. The method of claim 1 wherein the metal segments comprise at least one of aluminum and copper.
4. The method of claim 1 wherein the density of the applied pulsed laser energy is less than 1 Joule/cm 2 .
5. The method of claim 1 wherein the applied voltage potential is less than 1 volt.