Low dielectric constant insulating film and method of forming the same

1. A method of forming a low dielectric constant insulating film, comprising the steps of:

(a) forming a non-porous insulating film consisting essentially of said insulating film containing Si—CH n (n=1, 2, 3) bonds in a Si—O—Si or other Si—O skeleton, on a substrate;

(b) irradiating said insulating film with ultraviolet light in an atmosphere of reduced-pressure or reduced-pressure and containing mainly inert gas and nitrogen, wherein the ultraviolet light has an energy level higher than the binding energy of the Si—CH n bonds in said insulating film and lower than the binding energy of the Si—O—Si or other Si—O bonds in the skeleton, and wherein the irradiating is without oxidation, to break the Si—CH n bonds and free CH n groups, without affecting the skeleton; and

(c) removing the free CH n groups from said insulating film.

2. The method of forming the low dielectric constant insulating film according to claim 1 , wherein

the wavelength of said ultraviolet light is 120 nm or more.

3. The method of forming the low dielectric constant insulating film according to claim 1 , wherein

step (c) is performed after step (b).

4. The method of forming the low dielectric constant insulating film according to claim 1 , wherein

step (b) and step (c) are performed simultaneously by irradiating ultraviolet light on said insulating film in the reduced-pressure atmosphere while heating said substrate.

5. The method of forming the low dielectric constant insulating film according to claim 1 , wherein

the steps (a), (b) and (c) are performed repeatedly.

6. The method of forming the low dielectric constant insulating film according to claim 1 , wherein

step (a) comprises applying electric power to (1) a deposition gas which contains an organic compound having Si—CH 3 bonds and siloxane bonds or (2) a deposition gas which contains an organic compound having Si—CH 3 bonds and oxidizing gas, to generate a plasma and reaction to form a CVD insulating film containing Si—CH n bonds on said substrate.

7. The method of forming the low dielectric constant insulating film according to claim 6 , wherein:

the electric power is applied to deposition gas (1); and

the organic compound having the Si—CH 3 bonds and siloxane bonds is any one of hexamethyldisiloxane (HMDSO: (CH 3 ) 3 Si—O—Si(CH 3 ) 3 ),

octamethylcyclotetrasiloxane (OMCTS),

octamethyltrisiloxane (OMTS),

and

tetramethylcyclotetraslloxane (TMCTS)

8. The method of forming the low dielectric constant insulating film according to claim 6 , wherein:

the electric power is applied to deposition gas (2); and

another organic compound having the Si—CH 3 bonds is any one of

dimethyldimethoxysilane (Si(CH 3 ) 2 OCH 3 ) 2 ),

tetramethylsilane (Si(CH 3 ) 4 ),

trimethylsilane (SiH(CH 3 ) 3 ), and

dimethylsilane (SiH 2 (CH 3 )).

9. The method of forming the low dielectric constant insulating film according to claim 6 , wherein:

the electric power is applied to deposition gas (2); and

said oxidizing gas is at least one of H 2 O, N 2 O, CH 3 OH, C 2 H 5 OH, H 2 O 2 and O 2 .

10. The method of forming the low dielectric constant insulating film according to claim 6 , wherein:

the electric power is applied to deposition gas (2); and

said deposition gas (2) additionally contains C x H y F z , wherein x is a positive integer, y is 0 or a positive integer, z is 0 or a positive integer, and y and z are not both 0.

11. The method of forming the low dielectric constant insulating film according to claim 10 , wherein said C x H y F z is C 4 F 8 and C 2 F 4 .

12. The method of forming the low dielectric constant insulating film according to claim 1 , wherein

step (a) comprises coating organic SOG, having Si—CH 3 bonds and siloxane bonds, as a coating on said substrate.

13. The method of forming the low dielectric constant insulating film according to claim 12 , wherein

said organic SOG is alkylsilsesquioxane polymer (MSQ).