Electronic component packaging structure and method for producing the same

1. An electronic component packaging structure, comprising:

circuit boards each having a wiring at least on a surface thereof; and

an electronic component package secured between the circuit boards,

wherein the electronic component package includes at least one electronic component embedded within an electrical insulating encapsulation resin molded member made of an inorganic filler and a resin, the at least one electronic component being selected from an active component and a passive component,

protruding electrodes are arranged on both faces of the electrical insulating encapsulation resin molded member,

the electronic component is connected electrically with at least a part of the protruding electrodes,

the circuit boards are only attached to each other partially by the protruding electrodes on the both faces of the electrical insulating encapsulation resin molded member of the electronic component package, and

wherein the protruding electrodes are formed with solder.

2. The electronic component packaging structure according to claim 1 ,

wherein the electronic component package includes:

an electronic component package circuit board;

protruding electrodes provided at arbitrary positions of a face of the electronic component package circuit board that is on a side opposite to a face bonded with the electrical insulating encapsulation resin molded member;

protruding electrodes provided at arbitrary positions of a face of the electrical insulating encapsulation resin molded member that is on a side opposite to a face bonded with the electronic component package circuit board; and

at least two semiconductor elements embedded in the electrical insulating encapsulation resin molded member.

wherein a first semiconductor element is mounted on the electronic component package circuit board and a circuit-formation face of the first semiconductor element is connected electrically with the electronic component package circuit board by wire bonding,

a second semiconductor element is bonded onto the first semiconductor element so as to directly contact the first semiconductor element, and

a circuit-formation face of the second semiconductor element is connected electrically with the protruding electrodes provided at the arbitrary positions of the surface of the electrical insulating encapsulation resin molded member on the side opposite to the face bonded with the electronic component package circuit board.

3. The electronic component packaging structure according to claim 1 , wherein the circuit boards are one in which thermosetting resin is impregnated with a reinforcing material.

4. The electronic component packaging structure according to claim 3 , wherein the thermosetting resin is at least one selected from the group consisting of epoxy resin, polymide resin, polyphenylene ether resin, phenol resin, fluorine resin and isocyanate resin.

5. The electronic component packaging structure according to claim 1 , wherein the circuit boards are a resin film made of a thermoplastic resin.

6. The electronic component packaging structure according to claim 5 , wherein the resin film is at least one selected from the group consisting of wholly aromatic polyester, fluorine resin, polyphenylene oxide resin, syndiotactic polystyrene resin, polymide resin, polyamide resin, aramid resin and polyphenylene sulphide resin.

7. The electronic component packaging structure according to claim 1 , wherein the resin constituting the electrical insulating encapsulation resin molded member made of the inorganic filler and the resin is a thermosetting resin.

8. The electronic component packaging structure according to claim 7 , wherein the inorganic filter is at least one selected from the group consisting of SiO 2 , Al 2 O 3 , MgO, TiO 2 , BN, AlN and Si 3 N 4 .

9. The electronic component packaging structure according to claim 7 , wherein the thermosetting resin is at least one selected from the group consisting of epoxy resin, polyimide resin, polyphenylene ether resin, phenol resin, fluorine resin and isocyanate resin.

10. The electronic component packaging structure according to claim 1 , wherein the protruding electrodes are formed on electrode plates.

11. An electronic component packaging structure, comprising:

circuit boards each having a wiring at least on a surface thereof; and

an electronic component package secured between the circuit boards,

wherein the electronic component package includes at least one electronic component embedded within an electrical insulating encapsulation resin molded member made of an inorganic filler and a resin, the at least one electronic component being selected from an active component and a passive component,

protruding electrodes are arranged on both faces of the electrical insulating encapsulation resin molded member.

the electronic component is connected electrically with at least a part of the protruding electrodes,

the circuit boards are only attached to each other partially by the protruding electrodes on the both faces of the electrical insulating encapsulation resin molded member of the electronic component package, and

the protruding electrodes are fonned on electrode plates.

12. The electronic component packaging structure according to claim 11 , wherein the electronic component package includes:

an electronic component package circuit board;

protruding electrodes provided at arbitrary positions of a face of the electronic component package circuit board that is on a side opposite to a face bonded with the electrical insulating encapsulation resin molded member;

protruding electrodes provided at arbitrary positions of a face of the electrical insulating encapsulation resin molded member that is on a side opposite to a face bonded with the electronic component package circuit board; and

at least two semiconductor elements embedded in the electrical insulating encapsulation resin molded member,

wherein a first semiconductor element is mounted on the electronic component package circuit board and a circuit-formation face of the first semiconductor element is connected electrically with the electronic component package circuit board by wire bonding,

a second semiconductor element is bonded onto the first semiconductor element so as to directly contact the first semiconductor element, and

a circuit-formation face of the second semiconductor element is connected electrically with the protruding electrodes provided at the arbitrary positions of the surface of the electrical insulating encapsulation resin molded member on the side opposite to the face bonded with the electronic component package circuit board.

13. The electronic component packaging structure according to claim 11 , wherein the circuit boards are one in which thermosetting resin is impregnated with a reinforcing material.

14. The electronic component packaging structure according to claim 13 , wherein the thermosetting resin is at least one selected from the group consisting of epoxy resin, polyimide resin, polyphenylene ether resin, phenol resin, fluorine resin and isocyanate resin.

15. The electronic component packaging structure according to claim 11 , wherein the circuit boards are a resin film made of a thermoplastic resin.

16. The electronic component packaging structure according to claim 15 , wherein the resin film is at least one selected from the group consisting of wholly aromatic polyester, fluorine resin, polyphenylene oxide resin, syndiotactic polystyrene resin, polyimide resin, polyamide resin, aramid resin and polyphenylene sulphide resin.

17. The electronic component packaging structure according to claim 11 , wherein the resin constituting the electrical insulating encapsulation resin molded member made of the inorganic filler and the resin is a thermosetting resin.

18. The electronic component packaging structure according to claim 17 , wherein the inorganic filler is at least one selected from the group consisting of SiO 2 , Al 2 O 3 , MgO, TiO 2 , BN, AlN and Si 3 N 4.

19. The electronic component packaging structure according to claim 17 , wherein the thermosetting resin is at least one selected from the group consisting of epoxy resin, polyimide resin, polyphenylene ether resin, phenol resin, fluorine resin and isocyanate resin.

20. An electronic component packaging structure, comprising:

circuit boards each having a wiring at least on a surface thereof and

an electronic component package secured between the circuit boards,

wherein, the electronic component package includes at least one electronic component embedded within an electrical insulating encapsulation resin molded member made of an inorganic filler and a resin, the at least one electronic component being selected from an active component and a passive component,

protruding electrodes are arranged on both faces of the electrical insulating encapsulation resin molded member,

the electronic component is connected electrically with at least a part of the protruding electrodes,

the circuit boards are only attached to each other partially by the protruding electrodes on the both faces of the electrical insulating encapsulation resin molded member of the electronic component package, and

the electronic component package includes:

an electronic component package circuit board;

protruding electrodes provided at arbitrary positions of a face of the electronic component package circuit board that is on a side opposite to a face bonded with the electrical insulating encapsulation resin molded member;

protruding electrodes provided at arbitrary positions of a face of the electrical insulating encapsulation resin molded member that is on a side opposite to a face bonded with the electronic component package circuit board; and

at least two semiconductor elements embedded in the electrical insulating encapsulation resin molded member,

wherein a first semiconductor element is mounted on the electronic component package circuit board and a circuit-formation face of the first semiconductor element is connected electrically with the electronic component package circuit board by wire bonding,

a second semiconductor element is bonded onto the first semiconductor element so as to directly contact the first semiconductor element, and

a circuit-formation face of the second semiconductor element is connected electrically with the protruding electrodes provided at the arbitrary positions of the surface of the electrical insulating encapsulation resin molded member on the side opposite to the face bonded with the electronic component package circuit board.

21. The electronic component packaging structure according to claim 20 , wherein the circuit boards are one in which thermosetting resin is impregnated with a reinforcing material.

22. The electronic component packaging structure according to claim 21 , wherein the thermosetting resin is at least one selected from the group consisting of epoxy resin, polyimide resin, polyphenylene ether resin, phenol resin, fluorine resin and isocyanate resin.

23. The electronic component packaging structure according to claim 20 , wherein the circuit boards are a resin film made of a thermoplastic resin.

24. The electronic component packaging structure according to claim 23 , wherein the resin film is at least one selected from the group consisting of wholly aromatic polyester, fluorine resin, polyphenylene oxide resin, syndiotactic polystyrene resin, polyimide resin, polyamide resin, aramid resin and polyphenylene sulphide resin.

25. The electronic component packaging structure according to claim 20 , wherein the resin constituting the electrical insulating encapsulation resin molded member made of the inorganic filler and the resin is a thermosetting resin.

26. The electronic component packaging structure according to claim 25 , wherein the inorganic filter is at least one selected from the group consisting of SiO 2 , Al 2 O 3 , MgO, TiO 2 , BN, AlN and Si 3 N 4 .

27. The electronic component packaging structure according to claim 25 , wherein the thermosetting resin is at least one selected from the group consisting of epoxy resin, polyimide resin, polyphenylene ether resin, phenol resin, fluorine resin and isocyanate resin.