IP Library Granted Patent US 7,189,011
Granted Patent B2
US 7,189,011 · App. 10/646,981 · Granted Mar 13, 2007

Optoelectronic assembly

Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
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Quick Facts
Patent No.
US 7,189,011
App. No.
10/646,981
Granted
Mar 13, 2007
Kind
B2
Abstract

An optoelectronic assembly ( 300 ) includes a laser ( 102 ) for emitting light along a main optical path. Beam splitters ( 110, 114 ) split a proportion of light from the main optical path and the split light is guided by optical light guides ( 310 ) to a photodiode array ( 302 ). The light guides ( 310 ) are mouldable and substantially rigid and can be co fabricated as a single assembly including fiducials to facilitate positioning on a substrate ( 124 ) of the assembly ( 300 ). By having the array ( 302 ) adjacent the periphery of the substrate ( 124 ), wirebonds ( 308 ) need only be provided directly from the array ( 302 ) to a feed-through ( 130 ), and electrical tracks on the substrate and ceramic blocks for mounting the photodiodes are eliminated, as is individual placement of the ceramic blocks on the substrate.

Claims (34)

1. An optoelectronic assembly comprising:

an optical emitter for emitting light along a main optical path, wherein the optical emitter is mounted on a first substrate;

a mouldable, substantially rigid optical light guide have a first end for receiving a small proportion of the light from the main optical path and a second end, wherein the optical light guide includes a structural feature to facilitate interception of the light from the main optical path, wherein said structural feature comprises an angled facet; and

a photodetector located adjacent the second end of the optical light guide for receiving light there from, wherein the photodetector is mounted on a second substrate.

2. An optoelectronic assembly according to claim 1 , wherein the optical light guide is mounted on the first substrate.

3. An optoelectronic assembly according to claim 2 , wherein the optical light guide includes a fiducial to facilitate alignment of the light guide to the first substrate.

4. An optoelectronic assembly according to claim 1 , including a plurality of mouldable, substantially rigid optical guides, and a plurality of photodetectors, wherein the plurality of optical light guides each has a second end located adjacent at a respective one of the photodetectors.

5. An optoelectronic assembly according to claim 4 , wherein the plurality of photodetectors is mounted as an array on the second substrate.

6. An optoelectronic assembly according to claim 5 , wherein the plurality of optical light guides is manufactured as a single assembly.

7. An optoelectronic assembly according to claim 1 , wherein the optical light guide is made from a stable, low absorption plastics material.

8. An optoelectronic assembly comprising:

an optical emitter for emitting light along a main optical path,

a mouldable, substantially rigid optical light guide have a first end for receiving a small proportion of the light from the main optical path and a second end, and

a photodetector located adjacent the second end of the optical light guide for receiving light there from, wherein the optical light guide includes a structural feature to facilitate interception of the light from the main optical path, wherein said structural feature comprises an angled facet.

9. An optoelectronic assembly according to claim 8 , wherein the optical emitter, the photodetector and the optical light guide are mounted on a substrate, and the photodetector is arranged at a periphery of the substrate.

10. An optoelectronic assembly according to claim 8 , including a plurality of mouldable, substantially rigid optical guides, and a plurality of photodetectors, wherein the plurality of optical light guides each has a second end located adjacent at a respective one of the photodetectors.

11. An optoelectronic assembly according to claim 10 , wherein the plurality of photodetectors is mounted as an array adjacent a periphery of the substrate.

12. An optoelectronic assembly according to claim 11 , wherein the plurality of optical light guides is manufactured as a single assembly for mounting to the substrate.

13. An optoelectronic assembly according to claim 8 , wherein the optical light guide is made from a stable, low absorption plastics material.

14. An optoelectronic assembly according to claim 8 , wherein the optical light guide includes a fiducial to facilitate alignment of the light guide to a substrate.

15. An optoelectronic assembly comprising:

an optical emitter for emitting light along a main optical path, wherein the optical emitter is mounted on a first substrate;

a mouldable, substantially rigid optical light guide have a first end for receiving a small proportion of the light from the main optical path and a second end, wherein the optical light guide includes a structural feature to facilitate interception of the light from the main optical path; and

a photodetector located adjacent the second end of the optical light guide for receiving light there from, wherein the photodetector is mounted on a second substrate; and

a beam splitter for splitting a small proportion of light from the main optical path into a secondary light path, wherein the first end of the optical light guide is positioned in the secondary light path.

16. An optoelectronic assembly comprising:

an optical emitter for emitting light along a main optical path,

a mouldable, substantially rigid optical light guide have a first end for receiving a small proportion of the light from the main optical path and a second end, and

a photodetector located adjacent the second end of the optical light guide for receiving light there from, wherein the optical light guide includes a structural feature to facilitate interception of the light from the main optical path; and

a beam splitter for splitting a small proportion of light from the main optical path into a secondary light path, wherein the first end of the optical light guide is positioned in the secondary light path.

17. An optoelectronic assembly comprising:

an optical emitter for emitting light along a main optical path, wherein the optical emitter is mounted on a first substrate;

a mouldable, substantially rigid optical light guide have a first end for receiving a small proportion of the light from the main optical path and a second end, wherein the optical light guide includes a structural feature to facilitate interception of the light from the main optical path; and

a photodetector located adjacent the second end of the optical light guide for receiving light there from, wherein the photodetector is mounted on a second substrate, wherein said first substrate contains optical feed through of said small proportion of the light without electrical feed through to said photodetector on said second substrate, and wherein said second substrate contains said optical feed through of said optical light guide and an electrical feed through from said photodetector.

Assignments (11)
MERGER Recorded Mar 3, 2023
From: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED; BROADCOM INTERNATIONAL PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 062952/0850 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2020
From: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
To: BROADCOM INTERNATIONAL PTE. LTD.
Reel/Frame 053771/0901 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE PREVIOUSLY RECORDED AT REEL: 047196 FRAME: 0097. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 6, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048555/0510 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047196/0097 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED AT REEL: 017206 FRAME: 0666. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 6, 2016
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 038632/0662 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032851/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2006
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP PTE. LTD.
Reel/Frame 017206/0666 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 22, 2003
From: AGILENT TECHNOLOGIES UK LIMITED
To: AGILENT TECHNOLOGIES, INC.
Reel/Frame 014448/0981 →
Priority Claims (1)
EP 02256675 · Sep 25, 2002 · regional
Continuity (1)
Related Publication 20040161206A1 · Aug 19, 2004