Etching process for decreasing mask defect
The present invention provides an etching process for decreasing mask defect. The process comprises providing a substrate, and sequentially forming a thin film layer, a mask, and a photoresist on the surface of the substrate. Then the photoresist is trimmed by a bromide compound, and a first etching process is performed to transfer patterns from the photoresist to the mask. A strip process is performed to strip photoresist by mixing gases that include fluorine. Finally, a second etching process is performed to transfer the pattern from patterned mask to the thin film layer.
1. A hard mask etching process free from halogenated compound polymer residue, the process comprising:
providing a substrate and sequentially forming a thin film layer, a mask, and a patterned photoresist on the substrate;
trimming the patterned photoresist by a bromide compound in a chamber;
performing a first etching process to transfer the pattern from the photoresist to the mask;
removing halogenated compound polymers in-situ in said chamber; and
performing a second etching process to transfer the pattern from the patterned mask to the thin film layer.
2. The process of claim 1 , wherein the step of removing halogenated compound polymers further comprising simultaneously striping the photoresist.
3. The process of claim 1 , wherein the substrate is a silicon substrate and the thin film layer is a polysilicon layer.
4. The process of claim 3 , wherein a gate oxide layer is formed between the polysilicon layer and the silicon substrate.
5. The process of claim 1 , wherein a bottom anti-reflection layer is formed between the mask and the patterned photoresist.
6. The process of claim 1 , wherein the bromide compound is utilized in a trimming or curing photoresist process.
7. The process of claim 6 , wherein the bromide compound comprises HBr, HBr 2 , or HBr x .
8. The process of claim 1 , wherein the mask comprises an oxide silicon compounds layer, nitride silicon compounds layer, metal, or dielectric layer.
9. The process of claim 1 , wherein the halogenated compound polymers are removed by a mixing gas comprising oxygen (O 2 ) and fluorocarbon (C x F y ), or oxygen (O 2 ) and fluorosulfur (S x F y ).
10. The process of claim 9 , wherein the fluorocarbon is tetafluoromethane, and the duration of the strip photoresist process is 60˜100 seconds.
11. A hard mask etching process free from halogenated compound polymer residue, the process comprising:
providing a substrate, and sequentially forming a mask and a patterned photoresist on the substrate;
trimming the patterned photoresist by a bromide compound in a chamber;
performing a first etching process to transfer the pattern from the photoresist to the mask;
removing halogenated compound polymers in-situ in said chamber; and
performing a second etching process to transfer the pattern from the patterned mask to the substrate.
12. The process of claim 11 , wherein the step of removing halogenated compound polymers further comprising simultaneously striping the photoresist.
13. The process of claim 11 , wherein the substrate is a silicon substrate.
14. The process of claim 11 , wherein a bottom anti-reflection layer is formed between the mask and the patterned photoresist.
15. The process of claim 11 , wherein the mask is a nitride silicon compounds layer.
16. The process of claim 15 , wherein a pad oxide layer is formed between the mask and substrate.
17. The process of claim 11 , wherein the bromide compound is used to trim or cure photoresist.
18. The process of claim 17 , wherein the bromide compound comprises HBr, HBr 2 , or HBr x .
19. The process of claim 11 , wherein the halogenated compound polymers are removed by a mixing gas comprising oxygen (O 2 ) and fluorocarbon (C x F y ), or oxygen (O 2 ) and fluorosulfur (S x F y ).
20. The process of claim 19 , wherein the fluorocarbon is tetafluoromethane, and the duration of the strip photoresist process is 60˜100 seconds.