Substrate, semiconductor device, method of manufacturing substrate, and method of manufacturing semiconductor device

1. A substrate for mounting an optical element having a light emission/reception part, the substrate comprising:

a base material having first and second planes; and

an optical waveguide penetrating through the base material from the first plane to the second plane, in a direction perpendicularly intersecting the optical element mounted on top of the first plane, the optical waveguide being positioned opposite to the light emission/reception part;

wherein the base material is formed of silicon, and

wherein the optical waveguide has first and second ends that protrude from the first and second planes and are polished to be flush with respect to the first and second planes prior to mounting the optical element to the substrate;

wherein the distance between the polished first and second ends is substantially equal to the thickness of the substrate when mounting the optical element to the substrate.

2. The substrate as claimed in claim 1 , wherein the base material further includes:

a first through-hole to which the optical waveguide is attached;

a second through-hole having a via for electrically connecting to the optical element;

wherein the first and second through-holes are anisotroplo-etched holes.

3. The substrate as claimed in claim 2 , wherein the second through-hole has a wall provided with an insulating layer.

4. The substrate as claimed in claim 2 , wherein the via is provided with a connection pad on one side thereof, wherein the one side is situated opposite from the other side of the via for connecting to the optical element.

5. A semiconductor device comprising:

a plurality of the optical elements of claim 1 ; and

a plurality of the substrates of claim 1 .

6. A method of manufacturing a substrate for mounting an optical element having a light emission/reception part, the substrate having a base material including first and second planes and an optical waveguide penetrating through the base material from the first plane to the second plane, in a direction perpendicularly intersecting the optical element mounted on top of the first plane, the optical waveguide having first and second ends that protrude from the first and second planes, the method comprising the steps of:

forming the base material with a silicon material;

forming a first through-hole and a second through-hole in the substrate by anisotropic etching;

attaching the optical waveguide to the first through-hole:

forming a via in the second through-hole; and

polishing the first and second ends protruding from the first and second planes to be flush with respect to the first and second planes prior to mounting the optical element to the substrate;

wherein the distance between the polished first and second ends is substantially equal to the thickness of the substrate when mounting the optical element to the substrate.

7. The method as claimed in claim 6 , wherein the first through-hale and the second through-hole are formed simultaneously.

8. The method as claimed in claim 6 , further comprising the steps of:

forming an insulating layer at least at a wall of the second through-hole.

9. The method as claimed in claim 8 , further comprising a step of providing a connection pad on one side of the via, wherein the one side is situated opposite from the other side of the via for connecting to the optical element.

10. A method of manufacturing a plurality of substrates for mounting optical elements having light emission/reception parts, each of the substrates having a base material including first and second planes and an optical waveguide penetrating through the base material from the first plane to the second plane, in a direction perpendicularly intersecting the optical element mounted on top of the first plane, the optical waveguide having first and second ends that protrude from the first and second planes, the method comprising the steps of:

forming the base material with a silicon material;

forming a first through-hole and a second through-hole in the substrate by anisotropic etching;

attaching the optical waveguide to the first through-hole;

forming a via in the second through-hole;

polishing the first and second ends protruding from the first and second planes to be flush with respect to the first and second planes;

mounting the optical elements on the substrates after the polishing step; and

cutting out the substrates mounted with the optical elements by dicing the base material;

wherein the distance between the polished first and second ends is substantially equal to the thickness of the substrate when mounting the optical elements to the substrates.