Apparatus process and method for mounting and treating a substrate
View Patent ↗The present invention is a method, apparatus and process for an improved substrate mounting and processing technique for various substrate treatments comprising cleaning, dicing, sawing, polishing, and planarization, among others.
1. An apparatus for spray cleaning a substrate comprising:
an outer compartment having a bottom wall and side walls;
an inner compartment defined by bottom and side walls contained within the outer compartment, the bottom wall of the inner compartment adjacent the bottom wall of the outer compartment and the side walls of the inner compartment spaced apart from the side walls of the outer compartment;
at least one thermal electric cold plate disposed within the inner compartment, each thermal electric cold plate having a current reversible hot and cold side positioned opposite the bottom of the inner compartment;
a thermally conductive base having a thermally conductive middle portion adjacent to and in thermal contact with each current reversible hot and cold side and separating a top of the inner compartment from the outer compartment, and opposing end portions extending from the middle portion between the outer compartment and inner compartment side walls towards the outer compartment bottom;
a process fluid pipe for directing process fluid from a process fluid source into contact with the thermally conductive base and the substrate;
a mounting device for securing the substrate when subjected to the process fluid, the mounting device connected to the outer compartment and positioned proximate the base; and
a spray applicator for directing a cleaning spray at the substrate.
2. The apparatus of claim 1 and further comprising a fluid outlet port contained within the outer compartment.
3. The apparatus of claim 1 wherein the substrate is adherable to the base by solidifying the process fluid contacting the substrate and the base.
4. The apparatus of claim 1 and further comprising acoustic transducers for transmitting acoustic energy through the base substrate and create cavitation within the process fluid.
5. The apparatus of claim 1 wherein the base is grounded to dissipate electrostatic charges.
6. The apparatus of claim 1 wherein the base includes channels positioned therein for directing the fluid upon exiting the process fluid pipe.
7. The apparatus of claim 1 and further comprising a containment member supportable by the base, the substrate positionable therein.