IP Library Granted Patent US 7,231,321
Granted Patent B2
US 7,231,321 · App. 11/270,775 · Granted Jun 12, 2007

Method of resetting substrate processing apparatus, storage medium storing program for implementing the method, and substrate processing apparatus

Assignee: Tokyo Electron Limited
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Quick Facts
Patent No.
US 7,231,321
App. No.
11/270,775
Granted
Jun 12, 2007
Kind
B2
Abstract

A method of resetting a substrate processing apparatus having a chamber which is capable of carrying out abnormality judgment on the substrate processing apparatus accurately without causing a decrease in the utilization ratio of the substrate processing apparatus. The chamber is evacuated. A temperature in the chamber is set. Whether or not there is an abnormality in the chamber is judged. An atmosphere in the chamber is stabilized so as to conform to predetermined processing conditions. At least one selected from data that change in response to a change in a state inside the chamber is measured. The measured data is compared with reference data that corresponds to the measured data for a normal state in the chamber.

Claims (41)

1. A method of resetting a substrate processing apparatus having a chamber, the method comprising:

an evacuating step of evacuating the chamber;

a temperature setting step of setting a temperature in the chamber;

an abnormality judgment step of judging whether or not there is an abnormality in the chamber;

a seasoning step of stabilizing an atmosphere in the chamber so as to conform to predetermined processing conditions; and

a displaying step of displaying results judged in said abnormality judgment step,

wherein:

said abnormality judgment step comprises measuring at least one selected from data that change in response to a change in a state inside the chamber, and comparing the measured data with reference data that corresponds to the measured data for a normal state in the chamber; and

in said temperature setting step, the temperature in the chamber is set to a temperature different from a temperature in the chamber during ordinary substrate processing.

2. A method as claimed in claim 1 , wherein in said abnormality judgment step, a processing gas that does not cause production of a reaction product in the chamber is introduced while a substrate in the chamber is subjected to a predetermined process.

3. A method as claimed in claim 2 , wherein the processing gas comprises only oxygen.

4. A method as claimed in claim 1 , wherein the measured data comprises a log showing a state of at least one component part of the substrate processing apparatus.

5. A method as claimed in claim 4 , wherein the log is of an impedance of a matcher that adjusts high-frequency electrical power applied to a lower electrode disposed in the chamber.

6. A method as claimed in claim 4 , wherein the log is of a voltage between a lower electrode disposed in the chamber and a matcher that adjusts high-frequency electrical power applied to the lower electrode.

7. A method as claimed in claim 4 , wherein the log is of an opening extent of a control valve that controls a pressure in the chamber.

8. A method as claimed in claim 1 , wherein the measured data is processed substrate light emission data.

9. A method as claimed in claim 8 , wherein the light emission data relates to a light intensity ratio.

10. A method as claimed in claim 1 , wherein the measured data is data relating to a high-frequency power source that supplies high-frequency electrical power applied to a lower electrode disposed in the chamber.

11. A method as claimed in claim 1 , wherein in said evacuating step, the temperature in the chamber is raised.

12. A method as claimed in claim 1 , wherein in said seasoning step, stability of the atmosphere in the chamber is detected based on a difference in light emission data between two consecutively processed substrates.

13. A method as claimed in claim 12 , wherein in said seasoning step, the stability of the atmosphere in the chamber is detected based on a derivative of the difference in the light emission data.

14. A method as claimed in claim 1 , wherein in said abnormality judgment step, a leak in the chamber is detected based on a ratio of light emission amounts at different wavelengths for light emission from a processed substrate.

15. A computer-readable storage medium storing a program for causing a computer to implement a method of resetting a substrate processing apparatus having a chamber, the program comprising:

an evacuating module for evacuating the chamber;

a temperature setting module for setting a temperature in the chamber;

an abnormality judgment module for judging whether or not there is an abnormality in the chamber;

a seasoning module for stabilizing an atmosphere in the chamber so as to conform to predetermined processing conditions; and

a displaying module for displaying results judged by said abnormality judgment module,

wherein:

said abnormality judgment module measures at least one selected from data that change in response to a change in a state inside the chamber, and compares the measured data with reference data that corresponds to the measured data for a normal state in the chamber; and

said temperature setting module sets the temperature in the chamber to a temperature different from a temperature in the chamber during ordinary substrate processing.

16. A substrate processing apparatus comprising:

a chamber;

an evacuating device that evacuates said chamber;

a temperature setting device that sets a temperature in said chamber;

an abnormality judgment device that judges whether or not there is an abnormality in said chamber;

a seasoning device that stabilizes an atmosphere in said chamber so as to conform to predetermined processing conditions; and

a displaying device for displaying results judged by said abnormality judgment device,

wherein:

said abnormality judgment device measures at least one selected from data that change in response to a change in a state inside said chamber, and compares the measured data with reference data that corresponds to the measured data for a normal state in said chamber; and

said temperature setting device sets the temperature in the chamber to a temperature different from a temperature in the chamber during ordinary substrate processing.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 10, 2005
From: FURUYA, HAJIME; TANAKA, HIDEKI; OKUBO, TOMOYA; KOBAYASHI, RYOKO
To: TOKYO ELECTRON LIMITED
Reel/Frame 017221/0726 →
Priority Claims (1)
JP 2004-327076 · Nov 10, 2004 · national
Continuity (2)
Provisional Application 6063561900 · Dec 14, 2004
Related Publication 20060100825A1 · May 11, 2006