Packaging apparatus for optical interconnection on optical printed circuit board
A packaging apparatus for optical interconnection on an optical PCB includes a first substrate with a via hole formed therethrough and in which an optical waveguide is formed, an optical interconnection block having a reflective plane on its lower end inserted into the via hole, a second substrate flip-bonded to an upper surface of the first substrate, and an optically active element flip-bonded to a lower surface of the second substrate and aligned for optical communication.
1. A packaging apparatus for optical interconnection on an optical PCB comprising:
a printed circuit board having an optical via hole, an upper surface, and an optical waveguide;
an optical interconnection block of a hollow structure containing a cavity, the block having a reflective plane on lower end of the block and being inserted into the optical via hole;
a package substrate mounted on said upper surface and having a lower surface; and
an optically active element flip-bonded to said lower surface, optically aligned, by said reflective plane, with the optical waveguide and configured to optically communicate with the optical waveguide.
2. The packaging apparatus as set forth in claim 1 , wherein the optically active element includes a surface emitting element.
3. The packaging apparatus as set forth in claim 2 , further comprising a transmitting chip mounted on said upper surface for driving the surface emitting element.
4. The packaging apparatus as set forth in claim 2 , further comprising a transmitting chip mounted on said lower surface for driving the surface emitting element.
5. A packaging apparatus for optical interconnection on an optical PCB comprising:
a printed circuit board having an optical waveguide, an upper surface, a main via hole, and subsidiary via holes, the subsidiary via holes arranged around the main via hole;
an optical interconnection block having a reflective plane on lower end of the block, the block being inserted into the main optical via hole;
a package substrate mounted on said upper surface and having a lower surface;
a plurality of guide pins extended from the package substrate and inserted into the subsidiary via holes; and
an optically active element flip-bonded to said lower surface, optically aligned, by said reflective plane, with the optical waveguide, and configured to optically communicate with the optical waveguide.
6. The packaging apparatus as set forth in claim 5 , wherein the optically active element includes a surface emitting element.
7. The packaging apparatus as set forth in claim 6 , further comprising a transmitting chip mounted on said upper surface for driving the surface emitting element.
8. The packaging apparatus as set forth in claim 5 , further comprising a plurality of interposers interposed between the package substrate and the printed circuit board for controlling an intervening interval.
9. The packaging apparatus as set forth in claim 8 , wherein each of the interposers has a hollow-cylindrical shape defining a cavity such that a corresponding one of the guide pins passes through the respective cavity.
10. A packaging apparatus for optical interconnection on an optical PCB comprising:
a printed circuit board having an optical via hole, an upper surface, and an optical waveguide;
an optical interconnection block of a hollow structure containing a cavity, the block having a reflective plane on lower end of the block, and being inserted into the optical via hole;
a package substrate mounted on said upper surface, having an upper surface, and made of a transparent material; and
an optically active element flip-bonded to the upper surface of the package substrate, optically aligned, by said reflective plane, with the optical waveguide, and configure to optically communicate with the optical waveguide.
11. The packaging apparatus as set forth in claim 10 , wherein the optically active element includes a surface emitting element.
12. The packaging apparatus as set forth in claim 11 , further comprising a transmitting chip mounted on the upper surface of the printed circuit board for driving the surface emitting element.
13. The packaging apparatus as set forth in claim 10 , wherein the package substrate has a lower surface, said apparatus further comprising a condensing lens bonded to said lower surface for improving optical coupling efficiency and reducing allowable alignment tolerance.
14. A packaging apparatus for optical interconnection on an optical PCB comprising:
a printed circuit board having an optical waveguide, an upper surface, a main via hole, and subsidiary via holes, the subsidiary via holes arranged around the main via hole;
an optical interconnection block having a reflective plane on lower end of the block, the block being inserted into the main optical via hole;
a package substrate mounted on said upper surface and having an upper surface;
a plurality of guide pins extended from the package substrate and inserted into the subsidiary via holes; and
an optically active element flip-bonded to the upper surface of the package substrate and optically aligned, by said reflective plane, for optical communication by means of the optical waveguide.
15. The packaging apparatus as set forth in claim 14 , wherein the optically active element includes a surface emitting element.
16. The packaging apparatus as set forth in claim 15 , further comprising a transmitting chip mounted on the upper surface of the printed circuit board for driving the surface emitting element.
17. A packaging apparatus for optical interconnection on an optical PCB comprising:
a printed circuit board having an optical via hole, an upper surface, and an optical waveguide;
a package substrate flip-bonded to said upper surface and having a lower surface; and
an optically active element flip-bonded to said lower surfaces having lateral surfaces, and provided with an active layer that extends from a first lateral surface to a second lateral surface of the optical active element and that is optically aligned with the optical waveguide disposed opposite to the first and second lateral surfaces, the optically active element being inserted into the optical via hole and configured to optically communicate with the optical waveguide.
18. The packaging apparatus as set forth in claim 17 , wherein the optically active element includes a side emitting element.
19. The packaging apparatus as set forth in claim 18 , further comprising a transmitting chip mounted onto said upper surface for driving the side emitting element.
20. The packaging apparatus as set forth in claim 19 , wherein said transmitting chip has a lower surface connected to said upper surface by solder balls.
21. The packaging apparatus as set forth in claim 1 , wherein the block being inserted into the optical via hole intersects with the optical waveguide.
22. The packaging apparatus as set forth in claim 5 , wherein the block being inserted into the optical via hole intersects with the optical waveguide.
23. The packaging apparatus as set forth in claim 10 , wherein the block being inserted into the optical via hole intersects with the optical waveguide.
24. The packaging apparatus as set forth in claim 14 , wherein the block being inserted into the optical via hole intersects with the optical waveguide.
25. The packaging apparatus as set forth in claim 17 , wherein the optical via hole intersects with the optical waveguide.